• Journal of Welding and Joining
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• v.33 no.3
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• pp.25-31
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• 2015

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from electronic devices and system. Specifically, reliability issue of lead-free solder joint have an increasing demand for the car electronics caused by ELV banning. The authors prepared engine control unit and cabin electronics soldered with Sn-3.0Ag-0.5Cu (SAC305). To compare with the degradation characteristics of solder joint strength, thermal cycling test (TC), power-thermal cycling test (PTC) and series tests were conducted. Series tests were conducted for TC and PTC combined stress test using the same sample in sequence and continuously. TC test was performed at $-40{\sim}125^{\circ}C$ and soak time 10 min for 1000 cycles. PTC test was applied by pulse power and full function conditions during 100 cycles. Combined stress test was tested in accordance with automotive company standard. Solder joint degradation was observed by optical microscopy and environment scanning electron microscopy (ESEM). In addition, to compare with deterioration of bond strength of quad flat package (QFP) and chip components, we have measured lead pull and shear strength. Based on the series test results, consequently, we have validated of series test method for lifetime and reliability of Pb-free solder joint in automotive electronics.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.37-44
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• 2013

It is well known that thermal deformation of electronic packages with Pb-Sn solder and with lead-free solder is significantly affected by material properties consisting the package, as well as those of the solder itself. In this paper, the method for determining coefficient of thermal expansion(CTE) of new material is established by using temperature characteristic of strain gages, and the CTE of molding compound are obtained experimentally. The temperature-dependent CTE of molding compound for Pb-Sn solder and that for lead-free solder are obtained by using strain measurements with well known steel specimen and aluminium specimen as reference specimens, and the CTE's are also measured non-contactly by using moire interferometry. Those results are compared, and the agreement between the two types of strain gage experiment and the moire experiment show the strain gage method used in this paper to be reliable. In the case of the molding compound for Pb-Sn solder, the CTE is measured as approximately $15.8ppm/^{\circ}C$ regardless of the temperature. In the case for the lead-free solder, the CTE is measured as of approximately $9.9ppm/^{\circ}C$ below the temperature of $100^{\circ}C$, and then the CTE is increased sharply depending on the temperature, and reaches to $15.0ppm/^{\circ}C$ at $130^{\circ}C$.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1740-1743
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• 2007

In this study, two types of fatigue tests were conducted. First, cyclic bending tests were performed using the micro-bending tester. A four-point bending test method was adopted, because it induces uniform stress fields within a loading span. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. The pseudo-power cycling method makes up for the weak points in a power cycling and a chamber cycling method. Two compositions of solder are tested in all test condition, one is lead-free solder (95.5Sn4.0Ag0.5Cu) and the other is eutectic lead-contained solder (63Sn37Pb). In the cyclic bending test, the solder that exhibits a good reliability can be reversed depending on the load conditions. The lead-contained solders have a longer fatigue life in the region where the applied load is high. On the contrary, the lead-free solder sustained more cyclic loads in the small load region. A similar trend was detected at the thermal cycling test. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. A constitutive model which includes both creep and plasticity was employed. Thermal fatigue was occurred due to the creep. And plastic deformation is main damage for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.1
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• pp.145-153
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• 2013

In this study, shear punch-creep (SP-Creep) at Sn-4Ag/Cu pad the joint was tested by using environment-friendly Pb-free solder alloy Sn-4Ag of electronic components. Pb eutectic alloy (Sn-37Pb) joints limited to environmental issues with reflow time (10sec, 30sec, 100sec, 300sec) according to two types of solder alloy joints are compared and evaluated by creep strain rate, rupture time and IMC (Intermetallic Compound) behavior. As the results, reflow time increases with increasing thickness of IMC can be seen at overall 100sec later in case of two solder joints on the IMC thickness of Sn-4Ag solder joints thicker than Sn-37Pb solder joints. In addition, when considering creep evaluation factors, lead-free solder alloy Sn-4Ag has excellent creep resistance more than Pb eutectic alloy. For this reason, the two solder joints, such as in the IMC (Cu6Sn5) was formed. However, the creep resistance of Sn-4Ag solder joints was largely increased in the precipitation strengthening effect of dispersed Ag3Sn with interface more than Sn-37Pb solder joints.

• Journal of Applied Reliability
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• v.5 no.2
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• pp.241-259
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• 2005

The environmental problem is a main subject of the 21C and an environment destruction phenomenon by various kinds of environmental materials is reaching serious level. Nations to be classified as the environmental developed country, are born again environmental rich country. And they earn a large income by trade Every kind environmental resource in an international commercial transaction. Especially, the study that a reliability assessment method to prevent to reliability problem to be happened when the solder lead(lead-free solder), non-cd component, non-bromide component(without the polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE))and hexavalent chromium(Cr VI) clearance component and mercury-free applied to electronic equipment is progressed. As the result of the study for applying of a reliability assessment technique of lead-free solder that recognized the most of urgent problem at the company, combination accelerated life test could taken by adding and appling the part of a humidity acceleration part to Eyring Model which is proposed by R.E.Thomas. The reliability assessment methods study of PWB clean environmental materials is expected to respond to a reliability elevation and environmental material regulation policy spreading all over the world by beginning form Europe.

• Proceedings of the Korean Reliability Society Conference
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• 2005.06a
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• pp.393-404
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• 2005

The environmental problem is a main subject of the 21C and an environment destruction phenomenon by various kinds of environmental materials is reaching serious level. Nations to be classified as the environmental developed country, are born again environmental rich country. And they earn a large income by trade Every kind environmental resource in an international commercial transaction. Especially, the study that a reliability assessment method to prevent to reliability problem to be happened when the solder lead(lead-free solder), non-cd component, non-bromide component(without the polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE))and hexavalent chromium(Cr VI) clearance component and mercury-free applied to electronic equipment is progressed. As the result of the study for applying of a reliability assessment technique of lead-free solder that recognized the most of urgent problem at the company, combination accelerated life test could taken by adding and appling the part of a humidity acceleration part to Eyring Model which is proposed by R.E.Thomas. The reliability assessment methods study of PWB clean environmental materials is expected to respond to a reliability elevation and environmental material regulation policy spreading all over the world by beginning form Europe.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.65-71
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• 2005

At present, Electronic industries push ahead to eliminate the Pb(Lead) -a hazardous material-from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C\;-\;+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• Proceedings of the Korean Society for Quality Management Conference
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• 2006.04a
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• pp.375-380
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• 2006

Recently European Council(EU) published the RoHS(restriction of the use of certain hazardous substances in electrical and electronic equipment) which is prohibit the use of Pb, Hg, Cd, $Cr^{+6}$, PBB or PBDE in the electrical and electronic equipments. So EU member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain 6 hazardous substances. So many kinds of projects is proceeding to ensure the reliability of Pb-free electronics in the worlds. Especially it is necessary to evaluate of Pb-free solder joints in electronics. Therefore, on this paper, we compared with solder joint strength of chip components, respectively SnPb, Pb-free solder as follows reliability test methods. We also measured the shear strength of solder joint and also compared the effects of environmental test methods. In this results, we analyzed and compared the shear strength variation as follows solder materials and reliability test conditions.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.218-220
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• 2006

Sn-3.0Ag-0.5Cu solder is widely used as micro-joining materials of flip chip package(FCP) because of the fact that it causes less dissolution and has good thermal fatigue property. However, compared with ternary electroplating in the manufacturing process, binary electroplating is still used in industrial field because of easy to make plating solution and composition control. The objective of this research is to fabricate Sn-3.0Ag-0.5Cu solder bumping having accurate composition. The ternary Sn-3.0Ag-0.5Cu solder bumping could be made on a Cu pad by sequent binary electroplating of Sn-Cu and Sn-Ag. Composition of the solder was estimated by EDS and ICP-OES. The thickness of the bump was measured using SEM and the microstructure of intermetallic-compounds(IMCs) was observed by SEM and EDS. From the results, contents of Ag and CU found to be at $2.7{\pm}0.3wt%\;and\;0.4{\pm}0.1wt%$, respectively.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.74-80
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• 2014

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from their devices and system. Especially, reliability issue of lead-free solder joint is increasing in car electronics due to ELV (End-of-Life Vehicle) banning from 2016. We have prepared engine control unit (ECU) modules soldered with Sn-40Pb and Sn-3.0Ag-0.5Cu (SAC305) solders, respectively. Degradation characteristics of solder joint strength were compared with various conditions of automobile environment such as cabin and engine room. Thermal cycle test (TC, $-40^{\circ}C$ ~ ($85^{\circ}C$ and $125^{\circ}C$), 1500 cycles) were conducted with automotive company standard. To compare shear strength degradation rate with eutectic and Pb-free solder alloy, we measured shear strength of chip components and its size from cabin and engine ECU modules. Based on the TC test results, finally, we have known the difference of degradation level with solder alloys and use environmental conditions. Solder joints degradation rate of engine room ECU is superior to cabin ECU due to large CTE (coefficient of thermal expansion) mismatch in field condition. Degradation rate of engine room ECU is 50~60% larger than cabin room electronics.