• 마이크로전자및패키징학회지
• /
• 제8권3호
• /
• pp.37-42
• /
• 2001

지금 까지 전자패키지 접합에 사용되어온 Sn/37Pb 솔더는 낮은 용융온도와 우수한 물리적 특성, 그리고 저렴한 가격 등으로 널리 사용되었다. 그러나 납의 독성으로 인한 환경문제와 인체 유해성이 문제화되면서 이를 대체할 무연솔더의 요구가 시급한 실정이다. 또한 제품의 소형화에 따른 접합부의 미세화로 인한 접합부신뢰성이 요구되고 있다. 본 연구에서는 현재 Sn/37Pb 솔더를 사용하여 제품에 사용되고 있는 48 $\mu$BGA 패키지를 사용하여 Sn/Ag 계열 의 두 무연솔더인 Sn/3.5Ag/0.75Cu와 Sn/2.0Ag/0.5Cu/2.0Bi를 접합하여 장기신뢰성을 시효처리를 통하여 제시하였다. 시효처리는 $130^{\circ}C$, $150^{\circ}C$, $170^{\circ}C$ 온도에서 각각 300, 600, 900 시간동안 하였으며, 시효처리에 따른 전단강도와 각 솔더의 활성화에너지를 구하여 Sn/37Pb 솔더와 비교하였다. 두 무연솔더의 시효강도는 Sn/37Pb 솔더 보다 우수하였으며, 시효처리에 따라 형성된 솔더내부의 금속간화합물의 형상으로부터 균열의 성장과 형성에 대하여 논하였다. 이런 실험결과들로부터 두 무연솔더의 장기신뢰성 측면에서 대체가능성을 제시하였다.

• Journal of Plant Biology
• /
• 제19권1호
• /
• pp.1-6
• /
• 1976

This study was carried out to investigate the formation of precipitates between lead ion and the essential anions of plants, the effects of lead concentration on seed germination and plant growth in water and soil culture, and the germinating and growing recovery of inhibited seed germination and plant growth by lead. Four kinds of the seeds (Glycine max M., Triticum vulgare V., Setaria viridis (L) P. De Beauvois, and Digitoria sanguinalis (L) Scopoli var) were germinated and growth in water and soil culture included the different concentrations of lead for five days. The seeds and plants inhibited germination and growth by lead were transferred to lead free Hoagland solution and the growing recovery was observed. The precipitates of lead ion were observed in the solution of both acidity and alkalinity included each anion of $H_2PO_4^-, HPO_4^{2-}, PO_4^{3-}, SO_4^{2-} and MoO_4^{2-}$ in a room temperature, whereas the precipitates between lead ion and other anions were observed largely in the solution of alkalinity, so that it seemed that lead could be remained in the state of non-soluble in plant and soil. The inhibition of germination and growth in the water culture was observed in 100ppm of lead, whereas the inhibition in the case of the soil culture was observed in 10000ppm of lead. The difference of the effected concentration between water and soil culture in germination and the growth was 100 times. When the seed and plant inhibited the growth in 5000ppm or 10000ppm of lead for five days were transferred to lead free Hoagland solution, the recovery of germination and growth was observed in three days. This growing recovery was different according to the kinds of plant and concentrations of lead. It seemed that plant growth could be inhibited by the inhibition of the metabolism concerned with the precipitates between lead iion and other anions.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2001년도 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
• /
• pp.21-50
• /
• 2001

EC's/Japanese environmental regulation drive the Pb-free/Halogen-free application. Most Japanese electronics companies are preparing the green products. All items concerning to Pb-free/Halogen-ree technology should be coparallely designed and developed. More works need to clear the unknowns on Pb-free materials. Need of consensus on materials and standards. EBM (Environmental Benign Manufacturing)

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
• /
• pp.39-40
• /
• 2006

AE sensor using lead-free ceramics should be developed for prohibiting environment protection. In this study, Langevin type AE sensor was manufactured as air backing structure. Here, the piezoelectic element was used as PZT(EC-65) and NKN, respectively. The resonant frequency of AE sensor using PZT was 143 kHz and the resonant frequency of AE sensor using NKN was 178 kHz. The waveform of AE sensor using NKN was responded more sensitively than that of AE sensor using PZT.

• 한국전기전자재료학회논문지
• /
• 제20권3호
• /
• pp.218-222
• /
• 2007

In this study, Acoustic emission(AE) sensors were fabricated using lead-free piezoelectric ceramics for prohibiting environmental pollution. Structure of AE sensors were designed as Langvin type air backing form. Here, the piezoelectic element was used as PZT(EC-65)(AE1) and NKN(AE2), respectively. The measured resonant frequency, the maximum sensitivity frequency and sensitivity of AE sensors were as follows ; 143 kHz, 29.4 kHz and 69.3 dB in AE1 and 179 kHz, 29.4 kHz and 66.3dB in AE2, respectively.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
• /
• pp.126-129
• /
• 2002

This article presents that the affecting factors to solderability and initial reliability. It was discussed that effect of the solder ball hardness and composition on the reliability of solder joints. In this study, lead free solder alloys with compositions of Sn-Cu, Sn-Ag, Sn-Ag-Cu, Sn-Ag-Cu-Bi were applied to the $\muBGA$ packages. As a result of experiments, the high degree of hardness with the displacement of 0.22mm was obtained Sn-2.0Ag-0.7Cu-3.0Bi. The shear strength of lead free solder was higher than of Sn-37Pb solder, and it was increased about 150% in Sn-2.0Ag-0.7Cu-3.0Bi.

• Journal of Nutrition and Health
• /
• 제29권9호
• /
• pp.958-970
• /
• 1996

This study was performed to investigate the effect of dietary calcium level on cadmium and lead toxicity in rats. Fifty-four male rats of Sprague-Dawely strain weighing 152$\pm$12g were blocked into 9 groups according to body weight, and were raised for 30 days. Nine experimental diets different with cadmium(0%, 0.04%), lead (0%, 0.071%) and calcijm(0.5%, 1.0%, 1.5%) levels were prepared. The results are summarized as follow. Weight gain, F.E.R.(food efficiency ratio), and weights of liver, kidney and femur were lower in cadmium exposed groups than those of heavy metal free groups. Weight gain F.E.R. and ash weight of lead groups were lower than those of heavy metal free groups. But, these were increased with increasing dietary calcium level. Cadmium and lead concentrations in blood, liver, kidney and femur were lower in rats fed 1.5% calcium than 0.5% calcium diet. Fecal cadmium and lead excretions were remarkably increased in 1.5% calcium groups, and cadmium and lead retention rates were decreased in 1.5% calcium groups. Metallothionein concentrations in liver, kidney and small intestine were higher in rats exposed to cadmium and lead. Calcium content in blood, femur and daily urinary and fecal calcium excretion were decreased by cadmium and lead additions, and increased in 1.5% calcium groups. Creatinine clearance were decreased with cadmium administratino and calcium addition. In conclusion, weight gain and organ weights were decreased with cadmium or lead administration. But, cadmium administration was more toxic than lead adminstration. Cadmium or lead toxicity was alleviated by increasing dietary calcium level. Especially, lead toxicity was alleviated in proportion to dietary calcium level.

• 한국산업융합학회 논문집
• /
• 제12권4호
• /
• pp.215-219
• /
• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• 한국산학기술학회논문지
• /
• 제13권1호
• /
• pp.322-328
• /
• 2012

본 논문은 무연 솔더를 제거하기 위한 디지털 디솔더링 시스템에 관하여 다룬다. 땜납의 모재가 유연납에서 무연납으로 변화된 작업환경에 대처하고, 설정온도에 빠르게 수렴하며 연속작업이 가능한 디솔더링 시스템을 제안한다. 제안 시스템은 디솔더링 스테이션과 디솔더링건으로 구성되며, PID 온도제어를 위한 주변회로는 8bit MCU를 중심으로 설계하였다. 제안 시스템의 성능을 확인하기 위하여 동종의 수입품과 성능을 비교한 결과, 제안시스템은 기존 시스템에 비해 작업온도 도달시간은 11초 빠르며, 리플온도의 변화량은 $1.5^{\circ}C$ 적고, 열 회복율은 약 $0.14^{\circ}C$/초 빠르게 나타남을 확인 하였다.

• Journal of Welding and Joining
• /
• 제26권5호
• /
• pp.43-48
• /
• 2008

Characteristics of Sn-1.7%Bi-0.7%Cu-0.6%In (hereafter, SBIC) lead-free solder was investigated in this study. The results from SBIC were compared to other lead-free solders such as Sn-3.5%Ag-0.7%Cu (hereafter, SAC), Sn-0.7%Cu (hereafter, SC), and lead-bearing Sn-37%Pb (hereafter, SP) alloy. Tensile properties of bulk solder, wettability, spreading index, bridge and dross were evaluated. As experimental results, tensile strength and elongation of SBIC was 62.5MPa and 21.5%, respectively. The tensile strength was comparable to that of SP solder. The wetting time of SBIC was 1.2 sec at $250^{\circ}C$, and its wetting properties including wetting force were as good as the SAC alloy. However, wettability of the SC was not so good as the SBIC and SAC. The spreading index of SBIC at $250^{\circ}C$ was 71 %, and it was similar level to those of SAC and SC solders. Bridging was not found for all solders of SBIC, SAC and SC in the range from 240 to $260^{\circ}C$. In dross test at $250^{\circ}C$ for an hour, the amount of dross produced from SBIC was about 57% compared to that from SAC.