• Title/Summary/Keyword: Lead Frame

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A Study on Measurement of Semiconductor Package in RF Regime (RF대역에서의 반도체 package 특성 측정에 관한 연구)

  • 박현일;김기혁;황성우
    • Proceedings of the IEEK Conference
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    • 2000.11b
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    • pp.108-111
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    • 2000
  • The electrical characteristics of MQFP packages have been measured in RF regime. The s-parameter of the lead frame has been measured using the test fixture on which the do-capped package was mounted. A simple lumped equivalent circuit modeling of the lead frame and the test fixture can provide reasonable model parameters up to the frequency of 200 MHz.

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Recovery of Precious Metals in Plating Rinsed Wastewater Generated from Lead Frame Manufacturing Process (Lead Frame 제조공정에서 발생되는 도금세정폐수 중 유가금속회수)

  • Kim, Jae-Yong;Um, Myeong-Heon;An, Dae-Hyun;Shim, Myeong-Jin
    • Applied Chemistry for Engineering
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    • v.17 no.4
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    • pp.343-348
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    • 2006
  • The object of this experiment is to recover precious metals from plating rinsed wastewater generated from Lead Frame manufacturing process using electrolysis coupled hybrid process. This was achieved from Amberlite IRA 400 at 1.15 V electrolysis potential using the oxide electrode and at 1.30 V using the Al electrode and from Amberlite IRA 402 at 1.10 V using the oxide electrode and at 1.20 V using the Al electrode. During the first 10~30 min of the process, 90~95% of the silver can be recovered.

An Experimental Evaluation of the Influences of Shearing Factors for the Process Design of Lead Frame Blanking (리드프레임 블랭킹 공정설계를 위한 전단영향인자의 실험적 평가)

  • 임상헌;서의권;심현보
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.679-682
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    • 2001
  • An experiment is carried out to investigate the influences of shearing characteristic factors for the process design of lead frame blanking in copper alloy C194(t=0.205mm). 3 process parameters, e.g., clearance between die and punch, strip holding pressure, and bridge allowance are selected for this study. From the basis condition 6% clearance, 20N/$mm^2$, and 1.5t bridge allowance the seven times of experiment are done by varying the each factor. The square shape specimen is used to study the characteristics of shearing factors. The ratios of roll over, burnish, fracture zone are measured after blanking. The experimental analysis shows that the burnish ratio is decreased as the clearance increases. And the larger strip holding pressure is shown that the roll over and burnish ratio are both decreased. It is found that an optimal strip holding pressure is need for large burnish zone. Finally it is shown that the bridge allowance is less affected than clearance and strip holding pressure.

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A Study on the Characteristics for the Blanking of Lead Frame with the nickel alloy Alloy42 (니켈합금 Alloy42를 사용하는 리드프레임의 블랭킹 특성에 관한 기초연구)

  • Bahn Gab-su;Suh Eui-kwon;Lee Gwang-ho;Mo Chang-ki
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.13 no.6
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    • pp.87-93
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    • 2004
  • An experimental is carried out to investigate the characteristics of blanking for nickel alloy Alloy42 (t=0.203mm), a kind of IC lead frame material. By varying clearance between die and punch the shapes of shear profile are examined. Finite element analysis with element deletion algorithm for ductile fracture mode is also carried out to study the effect of clearance theoretically and to compare with experimental results. The rectangular shape specimen with four different comer radius is used to study the characteristics of blanking for straight side and comer region simultaneously. As the result the ratios measured k(m experiment of roll over, burnish and fracture zone based on initial blank thickness are compared with those of FE analysis. Both experiment and FE analysis show that the amount of mil over and fracture is increased as the clearance increases. When the radius of comer is less than thickness of blank it has been found that larger clearance is required than that of straight region in order to maintain same quality of shear profile at the comer region.

A Study on the Characteristics for the Blanking of Lead Frame with the Rectangular Shape Blanking (사각형 블랭킹을 통한 리드프레임의 블랭킹 특성에 관한 기초연구)

  • Lim, San-Heon;Suh, Eui-Kwon;Shim, Hyun-Bo
    • Journal of the Korean Society for Precision Engineering
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    • v.18 no.3
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    • pp.182-188
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    • 2001
  • An experiment is carried out to investigate the characteristics of blanking for copper alloy C194 (t=0.254mm), a kind of IC lead frame material. By varying clearance between die and punch, the shapes of shear profile are examined. Finite element analysis with element deletion algorithm for ductile fracture mode is also carried out to study the effect of clearance theoretically and to compare with experimental results. The rectangular shape specimen with four different corner radius is used to study the characteristics of blanking for straight side and corner region simultaneously. As the result, the ratios measured from the experiment of roll over, burnish, and fracture zone based on intial blank thickness are compared with those of FE analysis. Both experiment and FE analysis show that the amount of roll over and fracture is increased as the clearance increases. It has been found that larger clearance is required than that of straight region when the radius of corner is less than thickness of blank, in order to maintain same quality of shear profile at the corner region.

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Effects of Added Cr Element on the Tensile Strength and Electrical Conductivity of Cu-Fe Based Alloys (Cu-Fe계 합금의 강도 및 전기전도도에 미치는 Cr 원소첨가의 영향)

  • Kim, Dae-Hyun;Lee, Kwang-Hak
    • Korean Journal of Materials Research
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    • v.20 no.2
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    • pp.60-64
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    • 2010
  • This study looked at high performance copper-based alloys as LED lead frame materials with higher electrical-conductivity and the maintenance of superior tensile strength. This study investigated the effects on the tensile strength, electrical conductivity, thermal softening, size and distribution of the precipitation phases when Cr was added in Cu-Fe alloy in order to satisfy characteristics for LED Lead Frame material. Strips of the alloys were produced by casting and then properly treated to achieve a thickness of 0.25 mm by hot-rolling, scalping, and cold-rolling; mechanical properties such as tensile strength, hardness and electrical-conductivity were determined and compared. To determine precipitates in alloy that affect hardness and electrical-conductivity, electron microscope testing was also performed. Cr showed the effect of precipitation hardened with a $Cr_3Si$ precipitation phase. As a result of this experiment, appropriate aging temperature and time have been determined and we have developed a copper-based alloy with high tensile strength and electrical-conductivity. This alloy has the possibility for use as a substitution material for the LED Lead Frame of Cu alloy.

Effects of Alloying Elements on the Tensile Strength and Electrical Conductivity of Cu-Fe-P Based Alloys (Cu-Fe-P계 합금의 강도 및 전기전도도에 미치는 첨가 원소의 영향)

  • Kim, Dae-Hyun;Lee, Kwang-Hak
    • Korean Journal of Materials Research
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    • v.20 no.2
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    • pp.65-71
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    • 2010
  • In this study, the effect of Sn and Mg on microstructure and mechanical properties of Cu-Fe-P alloy were investigated by using scanning electron microscope, transmission electron microscope, tensile strength, electrical conductivity, thermal softening, size and distribution of the precipitation phases in order to satisfy characteristic for lead frame material. It was observed that Cu-0.14wt%Fe-0.03wt%P-0.05wt%Si-0.1wt%Zn with Sn and Mg indicates increasing tensile strength compare with PMC90 since Sn restrained the growth of the Fe-P precipitation phase on the matrix. However, the electrical conductivity was decreased by adding addition of Sn and Mg because Sn was dispersed on the matrix and restrained the growth of the Fe-P precipitation. The size of 100 nm $Mg_3P_2$ precipitation phase was observed having lattice parameter $a:12.01{\AA}$ such that [111] zone axis. According to the results of the study, the tensile strength and the electrical conductivity satisfied the requirements of lead frame; so, there is the possibility of application as a substitution material for lead frame of Cu alloy.