• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.18 no.1
• /
• pp.59-67
• /
• 2009

The purpose of this study is to provide a decision support to select an appropriate layered manufacturing(LM) machine that suits the application of a part. Selection factors include concept model, form/fit/functional model, pattern model far molding, material property, build time and part cost that greatly affect the performance of LM machines. However, the selection of a LM is not an easy decision because they are uncertain and vague. For this reason, the aim of this research is to propose hybrid multiple attribute decision making approaches to effectively evaluate LM machines. In addition, because subjective considerations are relevant to selection decision, a fuzzy logic approach is adopted. The proposed selection procedure consists of several steps. First, we identify LM machines that the users consider After constructing the evaluation criteria, we calculate the weights of the criteria by applying the fuzzy Analytic Hierarchy Process(AHP) method. Finally, we construct the fuzzy Technique of Order Preference by Similarity to Ideal Solution(TOPSIS) method to achieve the ranking order of all machines providing the decision information for the selection of LM machines.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.16 no.5
• /
• pp.183-190
• /
• 2007

It is well known that abrasive waterjet(AWJ) was developed as a kind of high-density energy processing technologies. AWJ is used to obtain the better cutting quality of various materials such as metals, ceramics, glass and composite materials within a short manufacturing time because of the characteristics of heatless and noncontact processing. However, AWJ device still has some problems to obtain the high quality of thin workpiece. In this paper, we investigated the optimal microcutting conditions of AWJ, such as maximum pressure, cutting speed and standoff distance of thin multi-layered materials. The experimental results show that AWJ has possibilities and potential to apply to the microcutting of thin multi-layered materials for IT industrial applications.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.25 no.4
• /
• pp.271-280
• /
• 2016

Predicting cutting forces in machine tools is essential to productivity improvement and process control in the manufacturing field. Furthermore, milling machining is more complicated than turning machining. Therefore, several studies have been conducted previously to simulate milling forces; this study aims to simulate the cutting forces in milling machines using multi-layered neural networks. In the experiments, the number of layers in these networks was 3 and 4 and the number of neurons in the hidden layers was varied from 20 to 200. The root mean square errors of simulated cutting force components were obtained from taught and untaught data for the various neural networks. Results show that the error trends for untaught data were non-uniform because of the complex nature of the cutting force components, which was caused by different cutting factors and nonlinear characteristics coming into play. However, trends for taught data showed a very good coincidence.

• Journal of the Korean Society for Precision Engineering
• /
• v.23 no.2 s.179
• /
• pp.191-198
• /
• 2006

Dieless CNC forming is an innovative technology which can form various materials with complex shape by numerically controlled incremental forming process. In this paper, a method of NC tool path generation based on an STL file for dieless CNC forming is proposed. Tool trajectory adopts the principle of layered manufacturing in rapid prototyping technology, but it is necessary to consider STL offset because of the ball shaped tool with a radius. Vertex offset method which enables to compute offset STL directly is engaged for STL offset. The offseted STL is sliced by cutting planes to generate contouring tool path. Algorithm is implemented on a computer and experimented on a dieless CNC forming machine to show its validity.

• Proceedings of the Korean Operations and Management Science Society Conference
• /
• 2003.05a
• /
• pp.1048-1055
• /
• 2003

This paper proposes a new method of solving integrated problems that consist of several sub-problems in a symmetric multi-layered structure, and also demonstrate the applicability of the method. The proposed method is named Symmetric Multi-layered Coevolutionary Algorithm (SMCA). The SMCA imitates partly the natural process of endosymbiotic evolution, which is a special type of coevolution. The SMCA is applied to the process planning problem in flexible manufacturing system (FMS), taking account of the flexibility of machine, tool, process, and sequence. To do this, SMCA's components are studied and its strategies are developed to improve the performance. The proposed algorithm is compared with the existing ones in terms of solution quality. The experimental results confirm the effectiveness of our approach.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2002.04a
• /
• pp.251-254
• /
• 2002

The technique of high speed machining is widely studied in machining field. In this study, TiAIN single-layered and TiAIN/TiN double-layered coatings were applied to end-mill by an arc ion plating technique. Their performances were comparatively studied about cutting force, tool wear, tool life and surface roughness of workpiece under high speed cutting conditions. The TiAIN single-layer coated tool showed higher wear-resistance due to its higher hardness, while the TiAIN/TiN double-layer coated tool showed better performance for high metal removal, i.e., high fled per tooth condition due to its higher toughness. The surface roughness of the workpiece was not influenced by the wear amount of coated tools.

• Journal of the Korea Safety Management & Science
• /
• v.6 no.4
• /
• pp.155-170
• /
• 2004

Among the semiconductor If-chips, unlike memory chips, a majority of Application Specific IC(ASIC) products are produced by customer orders, and meeting the customer specified due date is a critical issue for the case. However, to the one who understands the nature of semiconductor manufacturing, it does not take much effort to realize the difficulty of meeting the given specific production due dates. Due to its multi-layered feature of products, to be completed, a semiconductor product(called device) enters into the fabrication manufacturing process(FAB) repeatedly as many times as the number of the product specified layers, and fabrication processes of individual layers are composed with similar but not identical unit processes. The unit process called photo-lithography is the only process where every layer must pass through. This re-entrant feature of FAB makes predicting and planning of due date of an ordered batch of devices difficult. Parallel machines problem in the photo process, which is bottleneck process, is solved with restricted roll out algorithm. Roll out algorithm is a method of solving the problem by embedding it within a dynamic programming framework. Restricted roll out algorithm Is roll out algorithm that restricted alternative states to decrease the solving time and improve the result. Results of simulation test in condition as same as real FAB facilities show the effectiveness of the developed algorithm.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2001.04a
• /
• pp.275-280
• /
• 2001

Recently, the trends of industrial products grow more miniaturization, variety and mass production. Micro drilling which take high precision in cutting work is requested more micro hole and high speed working. Especially, Micro deep hole drilling is becoming more important in a wide spectrum of precision production industries, ranging from the production of automotive fuel injection nozzle, watch and camera parts, medical needles, and thick multi-layered Printed Circuit Boards(PCB) that are demanded for very high density electric circuitry. This paper shows the tool monitoring results of micro drill with tool dynamometer. And additionally, microscope with built-in monitor inspection show the relationship between burr in workpiece and chip form of micro drill machining.

• Korean Journal of Computational Design and Engineering
• /
• v.10 no.6
• /
• pp.421-431
• /
• 2005

This paper introduces a new approach for saving build time of hybrid rapid prototyping by decomposing a part into minimum number of layers. In the hybrid rapid prototyping, a part of a complicated shape is realized by adding layers of a simpler shape, each of which is obtained by machining a sheet of constant thickness from its top and bottom surfaces. Thus it is desired to decompose a given part into the minimum number of layers while guaranteeing each layer to be fabricated from the given sheets using a 3-axis milling machine. To satisfy these requirements, a concave edge-based algorithm is proposed to decompose a part into layers by considering the tool accessibility, the total number of layers, and the allowable sheet thickness.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2009.05a
• /
• pp.15.2-15.2
• /
• 2009

Manufacturing of printed electronics using printing technology has begun to get into the hot issue in many ways due to the low cost effectiveness to existing semi-conductor process. This technology with both low cost and high productivity, can be applied in the production of organic thin film transistor (OTFT), solar cell, radio frequency identification (RFID) tag, printed battery, E-paper, touch screen panel, black matrix for liquid crystal display (LCD), flexible display, and so forth. The emerging technology to manufacture the products in mass production is roll-to-roll printing technology which is a manufacturing method by printings of multi-layered patterns composed of semi-conductive, dielectric and conductive layers. In contrary to the conventional printing machines in which printing precision is about $50~100{\mu}m$, the printing machines for printed electronics should have a precision under $30{\mu}m$. In general, in order to implement printed electronics, narrow width and gap printing, register of multi-layer printing by several printing units, and printing accuracy of under $30{\mu}m$ are all required. We developed the roll-to-roll printing equipment used for printed electronics, which is composed of un-winder, re-winder, tension measurement system, feeding units, dancer systems, guide unit, printing unit, vision system, dryer units, and various auxiliary devices. The equipment is designed based on cantilever type in which all rollers except printing ones have cantilever types, which could give more accurate machine precision as well as convenience for changing rollers and observing the process.