• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.270-270
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• 2016

We fabricated an organic-inorganic nano laminated encapsulation layer using molecular layer deposition (MLD) combined with atomic layer deposition (ALD). The $Al_2O_3$ inorganic layers as an effective single encapsulation layer were deposited at 80 degree C using ALD with alternating surface-saturation reactions of TMA and $H_2O$. A self-assembled organic layers (SAOLs) were fabricated at the same temperature using MLD. MLD and ALD deposition process were performed in the same reaction chamber. The prepared SAOL-$Al_2O_3$ organic-inorganic nano laminate films exhibited good mechanical stability and excellent encapsulation property. The measurement of water vapor transmission rate (WVTR) was performed with Ca test. We controlled thickness-ratio of organic and inorganic layer, and specific ratio showed a lowest WVTR value. Also this encapsulation layer contained very few pin-holes or defects which were linked in whole area by defect test. To apply into real OLEDs panels, we controlled a film stress from tensile to compressive and flexibility defined as an elastic modulus with organic-inorganic ratio. It has shown that OLEDs panel encapsulated with nano laminate layer exhibits better properties than single layer encapsulated in acceleration conditions. These results indicate that the organic-inorganic nano laminate thin films have high potential for flexible display applications.

• Journal of Welding and Joining
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• v.11 no.2
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• pp.74-85
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• 1993

Effect of Si metal powders addition with the plasma transferred arc(PTA) overlaying process on characteristics of the alloyed layer in aluminum alloy(A5083) has been investigated. The overlaying conditions were 175-250A in plasma arc current, 500mm/min in travel speed, the 5-20g/min in powder feeding rate. Main results obtained are summarized as follows. 1)Sufficient size of molten pool on surface of base metal was required for forming an alloyed layer; in a fixed travel, the formation of alloyed layer with clear and beautiful surface depend upon the plasma arc current and powder feeding rate; the greater plasma arc current and the smaller powder feeding rate were, the better bead was formed. Optimum alloyed conditions by which an excellent alloyed bead obtained was 225A in plasma arc current. PTA process made it possible to form an alloyed layer with up to 67wt% Si. 2)Microstructure in the alloyed layer was in accord with prediction from the Al-Si phase diagram 3)The hardness of the alloyed layer increased in proportion to Si content. 4)As volume fraction of primary Si increased, the specific wearness of the alloyed layer was significantly improved. However, no further improvement was found when the volume fraction was greater than about 30%. 5)Utilizing the PTA process, a crack free alloyed layer with maximum hardness of about Hv 310 could be obtained.

• Korean Journal of Materials Research
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• v.17 no.10
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• pp.516-520
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• 2007

Indium tin oxide, which is used as transparent conducting layer in flexible device, is deposited on PET film by a magnetron sputtering in 300 mm wide roll-to-roll process (vacuum web coating). Sheet resistance, specific resistance and transmittance is differed by sputtering parameters such as working pressures, oxygen partial pressure, and thickness of ITO layer. ITO layer is deposited about 90 nm at roll speed of 0.24 m/min and its sputtering power is 3 kW. From the XRD spectrum deposited ITO layer is verified as amorphous. Under working pressure varied from $3{\times}10^{-4}\;Torr$ to $2{\times}10^{-3}\;Torr$, sheet resistance is lowest at the working pressure of $1{\times}10^{-3}\;Torr$ and its value is from $110\;{\Omega}/{\square}$ to $260\;{\Omega}/{\square}$ at the thickness of 90 nm. Oxygen partial pressure also varies sheet resistance and is optimized at the regime from 0.2% ($1.8{\times}10^{-6}\;Torr$) to 0.6% ($6{\times}10^{-6}\;Torr$). In this oxygen partial pressure sheet resistance is lower than $150\;{\Omega}/{\square}$. As ITO layer thickness increases, sheet resistance decreases down to $21\;{\Omega}/{\square}$ and specific resistance is about $7.5{\times}10.4{\Omega}cm$ in 340 nm thickness ITO layer. Transmittance is measured at the wavelength of 550 nm and is about 90% for 180 nm thickness ITO/PET.

• Journal of IKEEE
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• v.25 no.3
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• pp.467-472
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• 2021

Stable operation of semiconductor devices is needed even at high temperatures. Among the structures of semiconductor devices, the area that can cause unstable electrical responses at high temperatures is the contact layer between the metal and the semiconductor. In this study, the effect of annealing conditions included in the process of forming a contact layer of nickel silicide(NiSix) on a p-type SiC layer on the specific contact resistance of the contact layer and the total resistance between the metal and the semiconductor was investigated. To this end, a series of electrodes for TLM (transfer length method) measurements were patterned on the 4 inch p-type SiC layer under conditions of changing annealing temperature of 1700 and 1800 ℃ and annealing time of 30 and 60 minutes. As a result, it was confirmed that the annealing conditions affect the resistance of the contact layer and the electrical stability of the device.

• Mycobiology
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• v.36 no.1
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• pp.40-44
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• 2008

Various bacteria were isolated from the casing layer soil of the culture bed of P. ostreatus and their role in fruiting body induction of the edible mushroom, P. ostreatus, was investigated. Analysis of the bacterial community isolated from the casing layer soil revealed that the composition of genera and number of cultivable bacteria were different for each sterilizing treatment. Bordetella was predominant in the bulk soil whereas Flavobacterium was predominant after sterilization of the casing layer soil. Fluorescent Pseudomonas was predominant in the non-sterilized casing layer soil. Total number of the bacterial genera in the casing layer soil was higher than that in the bulk soil. In particular, an increase in the fluorescent Pseudomonas population was observed in the non-sterilized casing layer accompanied by induction of fruiting body and enhanced mushroom production yield. The results suggested that specific bacterial populations in the casing layer play an important role in the formation of primodia and the development of basidiome in P. ostreatus.

• The Korean Journal of Malacology
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• v.11 no.1
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• pp.70-77
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• 1995

The purpose of this study is to determine the differences of the conchiolin layer, prismatic layer and nacreous layer deposited within the shell of the freshwater family Unionidae. shether they possess species-specific characteristics and differences of the microstructure of these layers, A Scanning electron microscopic obwervations were conducted on seven species. The results indicate that all species possess thin and homogeneous layers within the periostracum. The prismatic layers of these species were composed of ednsely packed prisms. The prismatic layers of the shell in six species were typical shape of prisms. especially Inio douglasiae and Lamprotual gottschei. But, in Unio douglasiae sinuolatus, it was irregular and oblique prism shape.The nacreous layer of weven unionids characterized by possession of three types by lamillae shape: thin and homogeneous on genus Anodonta(0.4 pm size of lamella), Unio(1.3pm) and Lamprotual (1.7pm), homogeneous in shape and irregular in size of lamillae in Lanceolaria(1.0 pm)and irregulat in shape and size in Solenaia(0.2-0.4 pm). The microstructure of the naceous layer may be useful as a taxonomic character at the generic level.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.154-154
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• 2009

Cr capping layer를 이용하여 Titanium germanide의 열적 안정성을 향상시키는 연구를 수행하였다. n-type Ge(100) 기판 위에 전자빔 증착기를 이용하여 30nm 두께의 Ti와 Cr capping layer를 증착하고 $400\;^{\circ}C$에서 $800\;^{\circ}C$까지 30초간 N2 분위기로 급속 열처리하여 Ti germanide를 형성하였다. XRD결과로부터 Cr capping layer의 유무에 관계 없이 Ti germanide가 형성된 것을 관찰할 수 있었다. Ge 기판 위에 CTLM 패턴을 형성하고 실험을 진행하여 Ti germanide의 I-V 측정 데이터를 통해 Ohmic 특성을 알아보았고, contact resistance, sheet resistance, specific contact resistance를 구하였다.

• New & Renewable Energy
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• v.3 no.1 s.9
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• pp.75-82
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• 2007

Aluminum was used as metallic bipolar plate material to reduce a stack weight. The functional materials such as conductive material, Au and nonconductive material, PTFE [polytetrafluoroethylene] were coated on the bipolar plate to enhance electrical contact and corrosion prevention in PEMFC. The active area of bipolar plate is divided into the top layer part that electric current mainly passes, and the bottom layer part that gas and water pass. The bottom layer part in the flow channel needs not to have electrical conductivity because it doesn't pass electric current directly. In this reason, Au on the top layer and PTFE on the bottom layer were coated to apply high electrical conductivity and/or good corrosion resistance. Although the single cell performance using Au-PTFE/Al bipolar plate was shown 78% in comparison with that of graphite, specific power of Au-PTFE/Al bipolar plate(0.4 W/g) was twice as much as graphite bipolar plate.

• Carbon letters
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• v.1 no.3_4
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• pp.133-137
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• 2001

Mesoporous activated carbon fiber (ACF) was prepared from phenolic resin containing a small amount (0.1 wt %) of organic nickel complex through carbonization and steam activation. Microporous ACF as reference sample was also prepared from phenolic resin without agent. In both cases of the mesoporous ACFs and the microporous ACFs, the electric double layer capacitance of the nonaqueous electrolyte (0.5 M $TEABF_4$/PC or 1.0 M $LiClO_4$/PC) was not proportional to the BET specific surface area. This is owing to the low permeability of nonaqueous electrolyte or the low mobility of ion in narrow micropores. However, the mesoporous ACF showed higher double layer capacitance than the microporous (normal) ACF. This result suggests that the presence of many mesopores promotes the formation of effective double layer or the transfer of ion in the micropore.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1997.04a
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• pp.95-101
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• 1997

A general method is presented for the analysis of the damping effectiveness of viscoelastic layer applied to elastic beam. The damping is attributed to the shear deformations of the treatment. Specific results are then given for sandwich beams with dissipative cores. The calculated results by this method are validated by comparison with the experimental results. Optimum design of a viscoelastic damping layer which is constrainedly cohered on a steel beam is discussed from the viewpoint of the modal loss factor. An object function is a loss factor of 3-layered beam and design variable is the thickness of constraining layer and viscoelastic layer. Optimum thickness can be obtained when 3-layered beam has a maximum loss factor.