• Title/Summary/Keyword: Layer-by-layer

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Improvement of the luminous efficiency of organic light emitting diode using LiF anode buffer layer

  • Park, Won-Hyeok;Kim, Gang-Hun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.147-147
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    • 2015
  • The multilayer structure of the organic light emitting diode has merits of improving interfacial characteristics and helping carriers inject into emission layer and transport easier. There are many reports to control hole injection from anode electrode by using transition metal oxide as an anode buffer layer, such as V2O5, MoO3, NiO, and Fe3O4. In this study, we apply thin films of LiF which is usually inserted as a thin buffer layer between electron transport layer(ETL) and cathode, as an anode buffer layer to reduce the hole injection barrier height from ITO. The thickness of LiF as an anode buffer layer is tested from 0 nm to 1.0 nm. As shown in the figure 1 and 2, the luminous efficiency versus current density is improved by LiF anode buffer layer, and the threshold voltage is reduced when LiF buffer layer is increased up to 0.6 nm then the device does not work when LiF thickness is close to 1.0 nm As a result, we can confirm that the thin layer of LiF, about 0.6 nm, as an anode buffer reduces the hole injection barrier height from ITO, and this results the improved luminous efficiency. This study shows that LiF can be used as an anode buffer layer for improved hole injection as well as cathode buffer layer.

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Numerical simulation of the effect of bedding layer geometrical properties on the punch shear test using PFC3D

  • Haeri, Hadi;Sarfarazi, Vahab;Zhu, Zheming
    • Structural Engineering and Mechanics
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    • v.68 no.4
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    • pp.507-517
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    • 2018
  • In this research the effect of bedding layer angle and bedding layer thickness on the shear failure mechanism of concrete has been investigated using PFC3D. For this purpose, firstly calibration of PFC3d was performed using Brazilian tensile strength. Secondly punch shear test was performed on the bedding layer. Thickness of layers were 5 mm, 10 mm and 20 mm. in each thickness layer, layer angles changes from $0^{\circ}$ to $90^{\circ}$ with increment of $25^{\circ}$. Totally 15 model were simulated and tested by loading rate of 0.016 mm/s. The results show that when layer angle is less than $50^{\circ}$, tensile cracks initiates between the layers and propagate till coalesce with model boundary. Its trace is too high. With increasing the layer angle, less layer mobilizes in failure process. Also, the failure trace is very short. It's to be note that number of cracks decrease with increasing the layer thickness. The minimum shear punch test strength was occurred when layer angle is more than $50^{\circ}$. The maximum value occurred in $0^{\circ}$. Also, the shear punch test tensile strength was increased by increasing the layer thickness.

Heterogeneity of hard skin layer in wrinkled PDMS surface fabricated by Ar ion beam irradiation (아르곤 이온빔 조사로 형성된 주름진 PDMS 표면 경화층의 이질성)

  • Lee, Seunghun;Byeon, Eunyeon;Kim, Do-Geun;Jung, Sunghoon
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2018.06a
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    • pp.43.1-43.1
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    • 2018
  • Spatial distribution of binding state in depth direction is investigated in a hard skin layer on soft polydimethylsiloxane (PDMS) fabricated by Ar ion beam irradiations. The hard skin layer known as a silica-like homogenous layer was composed of two layers. Impinging Ar ions transfer energy to PDMS as a function of collisional energy transfer rate, which is the maximum at surface and decreases gradually as an ion penetrates. This formed the heterogeneous hard skin layer that consists of a top-most layer and an intermediate layer. XPS depth profiling showed the existence of the top-most layer and intermediate layer. In the top-most layer, scission and cross-linking were occurred simultaneously and Si-O bond showed dissociated status, SiOx (x = 1.25 - 1.5). Under the top-most layer, there was the intermediate layer in which cross-linking is mainly occurred and Si-O bond showed silica-like binding status, SiOx (x = 1.75 - 2). And theoretical analysis which calculates the collisional energy transfer and a displacement per atom explained the thickness variation of top-most layer according to Ar ion energy from 360 eV to 840 eV.

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Fabrication of Bi-superconducting Thin Films by Layer-by-layer Sputtering Method (순차 스퍼터법에 의한 Bi-초전도 박막의 제작)

  • 심상흥;양승호;박용필
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.613-616
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    • 2001
  • Bi$_2$Sr$_2$CuO$_{x}$ thin films have been fabricated by atomic layer-by-layer deposition using ion beam sputtering(IBS) method. During the deposition, 10 and 90 wt%-ozone/oxygen mixture gas of typical pressure of 1~9$\times$10$^{-5}$ Torr are supplied with ultraviolet light irradiation for oxidation. XRD and RHEED investigations reveal out that a buffer layer with some different compositions is formed at the early deposition stage of less than 10 units cell and then Bi-2201 oriented along the c-axis is grown.n.

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Determining Variables of Fabrication for Stereolithograpy (유전자 알고리즘을 이용한 광조형장치의 작업변수 결정)

  • 전근수;백인환
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.910-913
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    • 2000
  • In this research we investigate geometric issues involved while using a particular rapid prototyping system, called Stereolithography(SLA). SLA create prototypes layer by layer, each layer being formed by scanning a laser beam across the x, y surface of a vat of liquid monomer mix. The performance of SLA is influenced by orientation and layer thickness of designed fabrication. The number of layer and the area needed support is influenced by the orientation and layer thickness of designed fabrication. The step influence and volume error is influenced by slice thickness. We minimize the support are, the number of layer and cusp height. These variables of fabrication is minimized using genetic algorithm. The time for genetic algorithm is as little as we can accept. So we calculate support area and cusp height simply.

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Fabrication of Bi-superconducting Thin Films by Layer-by-layer Sputtering Method

  • Jung, Jin-in;Lee, Hee-Kab;Park, Yong-Pil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.11a
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    • pp.77-80
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    • 1999
  • Bi$_2$Sr$_2$CuO$\sub$x/ thin films have been fabricated by atomic layer-by-layer deposition using ion beam sputtering(IBS) method. XRD and RHEED investigations reveal that a buffer layer with compositions different from Bi-2201 is formed at the early deposition stage of less than 10 units cell and then Bi-2201 oriented along the c-axis is grown.

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Epitaxial Growth of BSCCO Thin film Fabricated by Layer-by-layer Sputtering

  • Yang, Sung-Ho;Park, Yong-Pil;Lee, Hee-Kab
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.07a
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    • pp.212-217
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    • 2000
  • Bi$_2$Sr$_2$CuO$_{x}$(Bi-2201) thin films have been fabricated by atomic layer-by-layer deposition using ion beam sputtering(IBS) process. During the deposition, 14 wt%-ozone/oxygen mixture gas of typical pressure of 5.0$\times$10$^{-5}$ Torr is supplied with ultraviolet light irradiation for oxidation. XRD and RHEED investigations reveal that a buffer layer with compositions different from Bi-2201 is formed at the early deposition stage of less than 10 units cell and then Bi-2201 oriented along the c-axis is grown.n.

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Improvement of Electrodeposition Rate of Cu Layer by Heat Treatment of Electroless Cu Seed Layer (Cu Seed Layer의 열처리에 따른 전해동도금 전착속도 개선)

  • Kwon, Byungkoog;Shin, Dong-Myeong;Kim, Hyung Kook;Hwang, Yoon-Hwae
    • Korean Journal of Materials Research
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    • v.24 no.4
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    • pp.186-193
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    • 2014
  • A thin Cu seed layer for electroplating has been employed for decades in the miniaturization and integration of printed circuit board (PCB), however many problems are still caused by the thin Cu seed layer, e.g., open circuit faults in PCB, dimple defects, low conductivity, and etc. Here, we studied the effect of heat treatment of the thin Cu seed layer on the deposition rate of electroplated Cu. We investigated the heat-treatment effect on the crystallite size, morphology, electrical properties, and electrodeposition thickness by X-ray diffraction (XRD), atomic force microscope (AFM), four point probe (FPP), and scanning electron microscope (SEM) measurements, respectively. The results showed that post heat treatment of the thin Cu seed layer could improve surface roughness as well as electrical conductivity. Moreover, the deposition rate of electroplated Cu was improved about 148% by heat treatment of the Cu seed layer, indicating that the enhanced electrical conductivity and surface roughness accelerated the formation of Cu nuclei during electroplating. We also confirmed that the electrodeposition rate in the via filling process was also accelerated by heat-treating the Cu seed layer.

Self-healing Anticorrosion Coatings for Gas Pipelines and Storage Tanks

  • Luckachan, G.E.;Mittal, V.
    • Corrosion Science and Technology
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    • v.15 no.5
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    • pp.209-216
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    • 2016
  • In the present study, chitosan based self-healing anticorrosion coatings were prepared by layer by layer (lbl) addition of chitosan (Ch) and polyvinyl butyral (PVB) on mild carbon steel substrate. Chitosan coatings exhibited enhanced coating stability and corrosion resistance in aggressive environments by the application of a PVB top layer. Chitosan layer in the lbl coatings have been modified by using glutaraldehyde (Glu) and silica ($SiO_2$). Performance of different coatings was tested using electrochemical impedance spectroscopy and immersion test. The best anticorrosion performance was observed in case of 10 % Ch_$SiO_2$_PVB coatings, which withstand immersion test over 25 days in 0.5 M salt solution without visible corrosion. 10 % Ch_$SiO_2$ coatings without the PVB top layer didn't last more than 3days. Application of PVB top layer sealed the defects in the chitosan pre-layer and improved its hydrophobic nature as well. Raman spectra and SEM of steel surfaces after corrosion study and removal of PVB_Ch/Glu_PVB coatings showed a passive layer of iron oxide, attributing to the self-healing nature of these coatings. Conducting particle like graphene reinforcement of chitosan in the lbl coatings enhanced corrosion resistance of chitosan coatings.

Laboratory Experimentals and Numerical Analysis for Development of a Atmospheric Mixed Layer (대기 혼합층 발달 과정의 모형 실험과 수치 해석)

  • 이화운
    • Journal of Environmental Science International
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    • v.2 no.1
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    • pp.17-26
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    • 1993
  • The layer that is directly influenced by ground surface is called the atmospheric boutsdary layer in comparison with the free atmosphere of higher layer. In the boundary layer, the changes of wind, temperature and coefficient of turbulent diffusion in altitude are large and have great influences an atmospheric diffusion. The purpose of this paper is to express the structure and characteristics of development of mixed layer by using laboratory experiment and numerical simulation. Laboratory experiment using water tank are performed that closely simulate the process of break up of nocturnal surface inversion above heated surface and its phenomena are analyzed by the use of horizontally averaged temperature which is observed. The result obtained from the laboratory experiment is compared with theoretical ones from ; \textsc{k}-\varepsilon numerical model. The results are summarized as follows. 1) The horizontally averaged temperature was found to vary smoothly with height and the mixed layer developed obviously being affected by the convection. 2) The mean height of mixed layer may be predicted as a function of time, knowing the mean initial temperature gradient. The experimental values are associated well with the theoretical values computed for value of the universal constant $C_r$= 0.16, our $C_r$ value is little smaller than the value found by Townsend and Deardoru et al.

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