• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.85-89
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• 2006

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.552-554
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• 1995

In long-haul high speed optical communications, the distance between a transmitter and a receiver depends on the amount of light coupled to a single mode optical fiber from the laser diode(LD) as well as the LD characteristic itself. And the transmitter module must have long lifetime. high reliability, and even simple structure. Such points have induced laser welding technique to be a first choice in opto-electronic module packaging because it can provide strong weld joint in a short time with very small coupling loss. In this paper, packaging considerations and characteristics for high speed LD modules are discussed. They include optical path design factors for larger aligning tolerance, and novel laser welding processes for component assembly. For low coupling loss after laser welding processes, the optical path for optimum coupling of a single mode optical fiber into the LD chip was designed with the GRIN lens system providing sufficiently large aligning tolerance both in the radial and axial directions. The measured sensitivity of the LD module was better than -33.7dBm(back to back) at a BER of $10^{-10}$ with a 2.5Gbps NRZ $2^{23}-1$ PRBS.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.4
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• pp.291-296
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• 2020

The high power of a shingled photovoltaic module can be attributed to its low cell-to-module loss. The production of high power modules in limited area requires high efficiency solar cells. Shingled photovoltaic modules can be made by divided solar cells, which can be produced by the laser scribing process. After dividing the 21% PERC cell using laser scribing, the efficiency decreased by approximately 0.35%. However, there was no change in the efficiency of the solar cell having relatively lower efficiency, because the laser scribing process induce higher heat damages in solar cells with high efficiency. To prove this phenomena, the J₀ (leakage current density) of each cell was analyzed. It was found that the J₀ of 21% PERC increased about 17 times between full and divided solar cell. However, the J₀ of 20.2% PERC increased only about 2.5 times between full and divided solar cell.

• Laser Solutions
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• v.8 no.3
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• pp.21-26
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• 2005

A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. Laser ACF bonding has better bonding quality than conventional bonding in view of peel strength, flatness, pressure unbalance and processing time. New ACF bonding processes by making use of high power diode laser are proposed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.7
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• pp.56-62
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• 2019

The high-precision laser scriber carries out scribing alumina ceramic substrates for manufacturing ultra-small chip resistors. The ceramic substrates are loaded, aligned, scribed, transferred, and unloaded. The entire process is fully automated, thereby minimizing the scribing cycle time of the ceramic substrates and improving the throughput. The scriber consists of the laser optical system, pick-up module of ceramic substrates, pre-alignment module, TH axis drive work table, automation module for substrate loading / unloading, and high-speed scribing control S/W. The loader / unloader unit, which has the greatest influence on the scribing cycle time of the substrates, carries the substrates to the work table that carries out the cutting line work by driving the X and Y axes as well as by adsorbing the ceramic substrates. The loader / unloader unit consists of the magazine up / down part, X-axis drive part for conveying the substrates to the left and right direction, and the vision part for detecting the edge of the substrate for the primary pre-alignment of the substrates. In this paper, the laser scribing machining simulation is performed by applying the instrument mechanism of each component module. Through this study, the scribing machining process is first verified by analyzing the process operation and work area of each module in advance. In addition, the scribing machining process is optimized by comparing and analyzing the scribing cycle time of one ceramic substrate according to the alignment stage module speed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.10
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• pp.949-957
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• 2017

A laser-vision-based height measurement system is developed and implemented for the inspection of two-step variable valve lift module assemblies. The proposed laser-vision sensor module is designed based on the principle of laser triangulation. This paper summarizes the work on 3D point cloud data collection and height difference measurements. The configuration of the measurement system and the proposed height measurement algorithm are described and analyzed in detail. Additional measurement experiments on the height differences of valves and lash adjusters of a two-step variable valve lift module were implemented repeatedly to evaluate the accuracy and repeatability of the proposed measurement system. Experimental results show that the proposed laser-vision-based height measurement system achieves high accuracy, repeatability, and stabilization for the inspection of two-step variable valve lift module assemblies.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.7
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• pp.145-152
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• 2004

This paper proposed efficient manufacturing system using the OMM (on-machine measurement) system. The OMM system is software based 3D modeler for inspection on machine and it is interfaced tool machine with RS232C. The software is composed of two inspection modules that one is touch probe operating module and the other is laser displacement sensor operating module. The module for touch probe has need of inspection feature that extracted it from CAD data. Touch probe moves to workpiece by three operating modes as follows: manual, general and automatic mode. The operating module of laser displacement sensor is used inspection for profile and very small hole. An Advantage of this inspection method is to be able to execute on-line inspection during machining or after it. The efficiency of proposed system which can predict and definite the machining errors of each process is verified, so the developed system is applied to inspect the mold-base(cavity, core).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1993.10a
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• pp.687-692
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• 1993

This paper deals with the generation of laser scan path for manufacturing 3-dimensional body using StereoLithography. The purpose of this study is to develop one module of the StersoLithography system(SLA) for Rapid Protyping and Manufacturing. AutoCAD system is used to supply CAD information from model. The X-Y controller which was made for a special purpose is used to test this system. The system software developed is composed of 3 main modules, the first module is calculating the boundary point os laser scan path. The scound module is generating final output file which is used to down load on the controller. The result of this study shows a good algorithm to generate laser scan path on the basis of simple mathematical background.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.681-682
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• 2010

• 한국신재생에너지학회:학술대회논문집
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• 2007.11a
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• pp.281-284
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• 2007

Recently, we have developed p-i-n a-Si:H single junction thin film solar cells with RF (13.56MHz) plasma enhanced chemical vapor deposition (PECVD) system, and also successfully fabricated the mini modules ($>300cm^2$), using the laser patterning technique to form an integrated series connection. The efficiency of a mini module was 7.4% ($Area=305cm^2$, Isc=0.25A, Voc=14.74V, FF=62%). To fabricate large area modules, it is important to optimise the integrated series connection, without damaging the cell. We have newly installed the laser patterning equipment that consists of two different lasers, $SHG-YVO_4$ (${\lambda}=0.532{\mu}m$) and YAG (${\lambda}=1.064{\mu}m$). The mini-modules are formed through several scribed lines such as pattern-l (front TCO), pattern-2 (PV layers) and pattern-3 (BR/back contact). However, in the case of pattern-3, a high-energy part of laser shot damaged the textured surface of the front TCO, so that the resistance between the each cells decreases due to an incomplete isolation. In this study, the re-deposition of SnOx from the front TCO, Zn (BR layer) and Al (back contact) on the sidewalls of pattern-3 scribed lines was observed. Moreover, re-crystallization of a-Si:H layers due to thermal damage by laser patterning was evaluated. These cause an increase of a leakage current, result in a low efficiency of module. To optimize a-Si:H single junction thin film modules, a laser beam profile was changed, and its effect on isolation of scribed lines is discussed in this paper.