• Journal of the Optical Society of Korea
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• 제13권1호
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• pp.75-79
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• 2009

A four beam interference optical system for laser micro structuring using a pulse laser was demonstrated. The four beam interference optical system using a pulse laser(picosecond laser) can fabricate micro structure on mold material(NAK80) directly. Micro structure on the polymer can be reproduced economically by injection molding of the micro structure on the mold material. The four beam interference optical system was composed by the DOE(Diffractive Optical Element) and two lenses. The laser intensity distribution of four beam interference was explained by an interference optics point of view and by the image optics point of view. We revealed that both views showed the same result. The laser power distribution of a $1{\mu}m$ peak pattern was made by the four beam interference optical system and measured by the objective lens and CCD. A $1{\mu}m$ pitch dot pattern on the mold material was fabricated and measured by SEM(Scanning Electron Microscopy).

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 추계학술대회 논문집
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• pp.199-200
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• 2009

• 한국레이저가공학회지
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• 제18권3호
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• pp.14-19
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• 2015

A helical fabricating method using $CO_2$ laser was utilized for producing cone-shaped structure on a silica substrate. Output power and the number of scanning radiation were modified in order to control the structure. The experiment shows that the depth and width of cone-shape were increased with higher output power of the laser and the number of scanning. We demonstrate fabrication of multidirectional side-firing optical fiber with diameter of 440 um using the $CO_2$ laser fabrication technique.

• 마이크로전자및패키징학회지
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• 제8권4호
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• pp.43-45
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• 2001

본 연구는 레이저 처리기술에 의한 $Li_2O-A1_2O_3-SiO_2$계 유리의 미세가공과 레이저에 의한 유리의 광활성반응에 관한 것으로서, 1064 nm와 355 nm의 파장을 갖는 Nd:YAG laser를 유리에 조사하여 유리의 파괴특성 및 광학적변화를 관찰하였다. 1064 nm레이저에 의한 유리의 파괴 부분은 광학현미경과 주사전자현미경 (SEM)으로서 파괴특성을 평가하였으며, 355 nm 레이저에 의한 유리의 변화는 흡수대역은 측정함으로서 그 광학적 특성을 나타내었다. 이와 같은 레이저에 의한 가공은 유리내부의 3차원적인 미세구조물 형성이나, internal waveguide, 또는 광 흡수대역의 변화에 따른 광기록방법으로 응용될 것으로 예상된다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2016년도 추계학술대회 논문집
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• pp.118.1-118.1
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• 2016

The laser surface modification has been reported for its functional applications for improving tribological performance, wear resistance, hardness, and corrosion property. In most of these applications, continuous wave lasers and pulsed lasers were used for surface melting, cladding, alloying. Since flexibility in processing, refinement of microstructure and controlling the surface properties, technology utilizing lasers has been used in a number of fields. Especially, femtosecond laser has great benefits compared with other lasers because its pulsed width is much shorter than characteristic time of thermal diffusion, which leads to diminish heat affected zone. Moreover, laser surface engineering has been highlighted as an effective tool for micro/nano structuring of materials in the bio application field. In this study, we applied femtosecond and nanosecond pulsed laser to treat biometals, such as Mg, Mg alloy, and NiTi alloy, by heating to improve corrosion properties and functionalize their surface controlling cell response as implantable biomedical devices.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1036-1042
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• 2003

The hot embossing process has been mentioned as one of major nanoreplication techniques. This is due to its simple process, low cost, high replication fidelity and relatively high throughput. As the initial step of quantitating the embossing process , simple parametric study about embossing time have been carried out using high-resolution masters which patterned by the DRIE process and laser machining. Under the various embossing time, the viscous flow of thin PMMA films into microcavities during compression force has been investigated. Also, a study about simulating the viscous flow during embossing process has planned and continuum scale FDM analysis was applied on this simulation. With currently available test data and condition, simple FDM analysis using FLOW3D was made attempt to match simulation and experiment.