• Title/Summary/Keyword: Laser cutting technology

Search Result 115, Processing Time 0.022 seconds

High Quality Plasma Cutting and Laser Cutting Technology (고품질 플라즈마 절단 및 레이저 절단기술)

  • Kim, Hwan Tae;Kil, Sang Cheol
    • Journal of Welding and Joining
    • /
    • v.35 no.2
    • /
    • pp.30-34
    • /
    • 2017
  • The trend of the plasma cutting and laser cutting technology of metal alloys including high strength steel, aluminum alloys for the welding structures has been studied. The high-precision plasma systems offer a denser, higher energy arc that in effect produces a sharper cutting tool and high quality cutting products. The high-quality fiber laser systems with compact design and easy set-up make it ideal for cutting in the pipeline or steel structre manufacturing. This paper covers the scientometric analysis of the high efficient cutting technology which are based on the published research works in the 'plasma and laser', and 'cutting technology' obtained from Web of Science, and deals with the details of the background data of the plasma cutting and laser cutting technology.

Effects of Laser Parameters and Workpiece Conditions on Cutting Characteristics of Solid Wood and Wood-based Panel(I) - Cutting Depths and Kerf Widths - (레이저변수(變數)와 피삭재조건(被削材條件)이 목재(木材) 및 목질(木質)보드의 절삭특성(切削特性)에 미치는 영향(影響)(I) - 절삭(切削)깊이와 절삭폭(切削幅) -)

  • Sim, Jae-Hyeon;Jung, Hee-Suk
    • Journal of the Korean Wood Science and Technology
    • /
    • v.25 no.4
    • /
    • pp.75-91
    • /
    • 1997
  • Laser cutting tests were conducted to investigate the laser cutting characteristics of solid woods such as 25mm-thick white oak(Quercus acutissima) and maple(Acer mono), and wood-based panels such as 15mm-thick medium density fiberboard and particleboard. Test variables were laser power, cutting speed, grain direction, and moisture content. Cutting depths, kerf widths and the maximum cutting speed were measured. Cutting depths were increased as focus of laser beam was moving from above the workpiece to on the surface of workpiece, and also to below the workpiece. Kerf widths were decreased as focus of laser beam was moving from above the workpiece to on the surface of workpiece, but were increased as focus of laser beam was moving from on the surface of workpiece to below the workpiece. Minimum kerf widths were obtained when focus of laser beam was positioned on the surface of workpiece. Cutting depths and kerf widths were decreased with increase in moisture content, and cutting depths and kerf widths of more dense white oak were smaller than those of maple. And also cutting depths and kerf widths of particleboard were smaller than those of medium density fiberboard.

  • PDF

Effects of Laser Parameters and Workpiece Conditions on Cutting Characteristics of Solid Wood and Wood-based Panel(II) - Specific Cutting Energy and Surface Qualities - (레이저변수(變數)와 피삭재조건(被削材條件)이 목재(木材) 및 목질(木質)보드의 절삭특성(切削特性)에 미치는 영향(影響)(II) - 비절삭(比切削)에너지와 절삭면(切削面)의 품질(品質) -)

  • Sim, Jae-Hyeon;Jung, Hee-Suk
    • Journal of the Korean Wood Science and Technology
    • /
    • v.26 no.1
    • /
    • pp.38-50
    • /
    • 1998
  • Laser cutting tests were conducted to investigate the laser cutting characteristics of solid woods such as 25mm-thick white oak(Quercus acutissima) and maple(Acer mono), and wood-based panels such as 15mm-thick medium density fiberboard and particleboard. Test variables were laser power, cutting speed, grain direction, and moisture content. Specific cutting energy was measured and the qualities of cut surface were estimated in constant laser power. Specific cutting energy of white oak was larger than that of maple, and specific cutting energy of medium density fiberboard was smaller than that of particleboard. For both white oak and maple, specific cutting energy of green wood was smaller than that of air-dried wood because weight loss of moisture evaporation in green wood was larger than that in air-dried wood. In laser-cut surface, wood cells were not deformed and damaged, but in circular saw-cut surface fibers were pushed out and cut, and wood cells were deformed severely. However, mechanical surface roughness of saw-cut surface was smoother than that of laser-cut surface because of the existence of undeformed cell cavity in laser-cut surface.

  • PDF

The Fracture Effect of a Non-Symmetric Laser Beam on Glass Cutting (비대칭 레이저 빔에 의한 유리 절단 시 파단 효과)

  • Yoon, Sangwoo;Kim, Joohan
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.24 no.4
    • /
    • pp.428-433
    • /
    • 2015
  • A non-symmetric laser beam was used for cutting a thin glass substrate and its effect was investigated. In laser cutting of brittle materials, controlling crack initiation on the surface is crucial; however, it is difficult to ensure that crack propagation occurs according to a designed laser path. A lot of deviation in crack propagation, especially at the edge of the substrate, is usually observed. A non-symmetric laser beam generates a non-uniform energy distribution, which enhances directional crack propagation. A 20-W pulsed YAG laser was used for cutting a thin glass substrate. Parametric analysis was carried out and the crack control of the non-symmetric laser beam was improved. A theoretical model was presented and the limitations of the proposed process were also discussed.

Multi-layer Glass Cutting by Femtosecond Laser (극초단 레이저를 이용한 겹침 평판유리 절단)

  • Shin, Hyun-Myung;Lee, Young-Min;Choi, Hae-Woon
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.21 no.3
    • /
    • pp.382-386
    • /
    • 2012
  • A femtosecond laser with 775nm central wavelength and 150 fs of temporal pulse width was used for multi layered glass cutting applications. Ultrashort pulse was effectively used for clean glass cutting with $50{\mu}m$ depth and minimum cutting width. Laser beam was split to two stages and focused on the top surfaces of each layer. Ablation threshold of used glass was measured to be $2.59J/cm^2$. In experiments, 200mW laser power and 1mm/s scanning speed was used for preliminary experiment. Air gap was the major defect occurring parameter and laser power was less sensitive to glass cutting in the experiment. The maximum cutting speed was measured to be 60mm/min with 2kHz, however, Maximum 3m/min cutting speed can be achievable with a commercially available laser with 100kHz.

A Study on SS400 Cutting Characteristics using Continuous Wave Fiber Laser (연속파 파이버 레이저를 이용한 SS400의 절단 특성에 관한 연구)

  • Oh, Yong-Seok;Lee, Ka-Ram;Park, Eun-Kyeong;Yoo, Young-Tae
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.21 no.4
    • /
    • pp.644-650
    • /
    • 2012
  • This paper show the 2kW fiber laser cutting properties of SS400. The study was comparison of traditional 4kW $CO_2$ Laser cutting and 2kW Fiber laser cutting characteristics for the application of Industrial 2D Laser Cutting Machine. The laser used in this investigation was an IPG YLU-2000 multi-mode Ytterbium Fiber machine with a maximum power of 2000W and a wave length of 1070 nm. The laser was used in its Continuous Wave (CW) mode with an approximately top hat beam intensity distribution. Fiber laser high quality cuts at a large range of speeds (ranging from 2000 to 3800 mm/min) which has been obtained for the 2.3mm Sheet of SS400. 2kW power Fiber laser cut was able to max. 20mm sheets of SS400 (speed range from 650 to 850 mm/min). Fiber laser cutting used in conventional hole nozzle could cut 12mm SS400 but used in special dual cutting nozzle could cut 20mm SS400.

Laser Cutting of Flexible Printed Circuit Board in Liquid (연성인쇄회로기판의 액중 레이저 절단)

  • Kim, Teakgu;Kim, Joohan
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.22 no.1
    • /
    • pp.56-62
    • /
    • 2013
  • The laser cutting process which is flexible and rapid usually provides a better result in cutting of flexible printed circuit boards (FPCB). However, circuit-short by the re-deposition of debris from laser ablation or its heat affect zone (HAZ) on the cutting surfaces can be a problem. A laser cutting process of FPCB in the presence of liquid can minimize these negative effects. The temperature distribution of copper and polymer parts of FPCB was analyzed with numerical simulation and the experimental results were presented to evaluate this process. Generally, laser cutting under liquid has advantages of less re-deposition of carbides and less HAZ on the cutting edges. However, bubble generation and laser beam control through the liquid media should be considered carefully to obtain a successful result.

Experimental Investigation for Ablation Characteristics of Polyimide Layer and Cu-metal Layer using High Power Nd:YAG UV Laser (고출력 Nd:YAG UV레이저를 이용한 polyimide층과 Cu-metal층의 가공상태에 대한 실험적 고찰)

  • Choi, Kyung-Jin;Lee, Young-Hyun
    • Journal of the Semiconductor & Display Technology
    • /
    • v.8 no.4
    • /
    • pp.31-36
    • /
    • 2009
  • In this paper, the laser cutting characteristics of the flexible PCB using high power Nd:YAG UV laser were investigated. A specific FPCB model was selected for the experiment. Test sheets were made, which had equal materials and layer structure to those of the outline (OL) region and the contact pad (CP) region in the FPCB. The experiment is made up of two stages. In the first stage of the experiment, the laser cutting fluence was found, which is the threshold fluence to cut the test sheets completely. The laser cutting fluence of the OL sheet is $1781.26{\sim}1970.16\;J/cm^2$ and that of the CP sheet is $2109.34{\sim}2134.34\;J/cm^2$. In the second stage, cutting performance and its qualities were analyzed by the experiment. The laser cutting performance remained almost unchanged for all laser and process parameter sets. The average cutting width (top side/bottom side) of the OL sheet was $40.45\;{\mu}m/11.52\;{\mu}m$ and that of the CP sheet was $22.14\;{\mu}m/10.93\;{\mu}m$. However, the laser cutting qualities were different according to the parameters. The adjacent region of the cutting line on the OL sheet was carbonized as the beam speed was low and the overlap coefficient was high. The surface quality around the cutting line of the CP sheet was about the same. Carbonization and debris occurred on the surface of the cutting line. As a result of the experiment, the cutting qualities were better as the overlap coefficient was made low and beam speed high. Therefore, the overlap coefficient 2 or 3 is proper for the FPCB laser cutting.

  • PDF

Laser Processing Technology in Semiconductor and Display Industry (반도체 및 디스플레이 산업에서의 레이저 가공 기술)

  • Cho, Kwang-Woo;Park, Hong-Jin
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.27 no.6
    • /
    • pp.32-38
    • /
    • 2010
  • Laser material processing technology is adopted in several industry as alternative process which could overcome weakness and problems of present adopted process, especially semiconductor and display industry. In semiconductor industry, laser photo lithography is doing at front-end level, and cutting, drilling, and marking technology for both wafer and EMC mold package is adopted. Laser cleaning and de-flashing are new rising technology. There are 3 kinds of main display industry which use laser technology - TFT LCD, AMOLED, Touch screen. Laser glass cutting, laser marking, laser direct patterning, laser annealing, laser repairing, laser frit sealing are major application in display industry.

Underwater Laser Cutting of Thick Stainless Steel in Various Cutting Directions for Application to Nuclear Decommissioning

  • Shin, Jae Sung;Oh, Seong Y.;Park, Seung-Kyu;Kim, Taek-Soo;Park, Hyunmin;Lee, Jonghwan
    • Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
    • /
    • v.19 no.3
    • /
    • pp.279-287
    • /
    • 2021
  • For application in nuclear decommissioning, underwater laser cutting studies were conducted on thick stainless-steel plates for various cutting directions using a 6 kW fiber laser. For cutting along the horizontal direction with horizontal laser irradiation, the maximum cutting speed was 110 mm·min-1 for a 48 mm thick stainless-steel plate. For cutting along the vertical direction with horizontal laser irradiation, a maximum speed of 120 mm·min-1 was obtained for the same thickness, which confirmed that the cutting performance was similar but slightly better. Moreover, when cutting with vertically downward laser irradiation, the maximum cutting speed was 120 mm·min-1 for a plate of the same thickness. Thus, the cutting performance for vertical irradiation was nearly identical to that for horizontal irradiation. In conclusion, it was possible to cut thick stainless-steel plates regardless of the laser irradiation and cutting directions, although the assist gas rose up due to buoyancy. These observations are expected to benefit laser cutting procedures during the actual dismantling of nuclear facilities.