• 산업기술연구
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• 제26권B호
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• pp.35-41
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• 2006

Recently, as ultrasonic medical devices are gradually developed, many of those requires smaller and more precision coaxial cables in probe. So, the use of micro coaxial cable becomes an efficient solution for ultrasonic machine. However, there are many difficulties in stripping micro coaxial cable by traditional mechanical process. In this paper, we use the Nd-YAG laser for the efficient stripping of conduct wire of cable. We propose a new method to strip the shield wire of micro coaxial cable. Through some experiments, we found that there is a new possibility in the proposed method. Also, in order to enhance the performance, we propose a preprocess of the cable before stripping.

• Journal of Welding and Joining
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• 제28권5호
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• pp.80-85
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• 2010

This study focused on laser assisted machining (LAM) of silicon nitride ceramic that efficiently removes the material through machining of the softened zone by local heating. The effects of laser-assisted machining parameters were studied for cost reduction, and active application in processing of silicon nitride ceramics in this study. Laser assisted machining of silicon nitride allows effective cutting using CBN tool by local heating of the cutting part to the softening temperature of YSiAlON using by the laser beam. When silicon nitride is sufficiently preheated, the surface is oxidized and decomposed and then forms bloating, micro crack and silicate layer, thereby making the cutting process more advantageous. HIPSN and SSN specimens were used to study the machining characteristics. Higher laser power makes severer oxidation and decomposition of both materials. Therefore, HIPSN and SSN specimens were machined more effectively at higher power.

• Advances in materials Research
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• 제13권1호
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• pp.1-18
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• 2024

The present experimental investigation focuses on finding optimal parametric data-set of laser micro-drilling operation with minimum taper and Heat-affected zone during laser micro-drilling of Carbon Nanotube/Epoxy-based composite materials. Experiments have been conducted as per Box-Behnken design (BBD) techniques considering cutting speed, lamp current, pulse frequency and air pressure as input process parameters. Then, the relationship between control parameters and output responses is developed using second-order nonlinear regression models. The analysis of variance test has also been performed to check the adequacy of the developed mathematical model. Using the Response Surface Methodology (RSM) and an Accelerated particle swarm optimization (APSO) technique, optimum process parameters are evaluated and compared. Moreover, confirmation tests are conducted with the optimal parameter settings obtained from RSM and APSO and improvement in performance parameter is noticed in each case. The optimal process parameter setting obtained from predictive RSM based APSO techniques are speed=150 (m/s), current=22 (amp), pulse frequency (3 kHz), Air pressure (1 kg/cm²) for Taper and speed=150 (m/s), current=22 (amp), pulse frequency (3 kHz), air pressure (3 kg/cm²) for HAZ. From the confirmatory experimental result, it is observed that the APSO metaheuristic algorithm performs efficiently for optimizing the responses during laser micro-drilling process of nanocomposites both in individual and multi-objective optimization.

• 한국정밀공학회지
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• 제26권9호
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• pp.64-71
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• 2009

Recently as ultrasonic medical devices are gradually developed, many of those require smaller and more precision coaxial cables in the probe. So, the use of micro coaxial cable becomes an efficient solution for ultrasonic machine. However, there are many difficulties in stripping micro coaxial cable by traditional mechanical process. In this paper we use the Nd:YAG laser for the efficient striping of conduct wire of cable. Through some experiments, we found that there is a new possibility in the proposed method. Also, we propose a pre-process of the cable before stripping in order to enhance the performance.

• Journal of Oral Medicine and Pain
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• 제31권3호
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• pp.211-221
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• 2006

목적 전통적 고속 회전식 절삭기구 또는 Er:YAG 레이저로 삭제된 상아질에, 두가지 다른 접착 시스템을 적용한 후, 축조한 컴포지트 레진의 미세인장결합강도를 비교하고, 다양한 Er:YAG 레이저 에너지가 미세인장결합강도에 미치는 영향을 평가한다. 재료 및 방법 40개의 제3대구치를 사용하여, 평평한 상아질면을 만든 후 8개의 군으로 나누어, 4가지 절삭방법 (고속 회전식 절삭기구, 2 W, 3 W, 4 W 출력의 Er:YAG 레이저) 중 한 가지로 삭제하고, 2가지 접착 시스템 (Scotchbond Multipurpose Plus, Clearfil SE bond) 중 한 가지로 처리하여 컴포지트 레진을 축조하였다. 24시간의 저장 후, 각 시편을 결합면에 수직으로 자르고, 미세인장결합강도를 측정하였다. 각 군의 미세인장결합강도는 평균$\pm$표준 편차로 표현하였고, 통계분석을 위해 two-way ANOVA, one-way ANOVA, student-Newman-Keuls' multiple comparison test, 그리고 t-test가 사용되었다. 결과 및 결론 1. 접착시스템과 관계없이, 절삭방법에 따른 미세인장결합강도의 유의한 차이가 있었고, 높은 순서대로 나열하면 다음과 같다: 3 W, 2 W, Bur, 4 W (p<0.001). 2. 절삭방법과 관계없이, Scotchbond Multipurpose Plus로 처리한 군이 Clearfil SE bond로 처리한 군보다 유의하게 높은 미세인장결합강도를 나타냈다 (p<0.001). 3. Scotchbond Multipurpose Plus로 처리한 군 중에서, 3 W 레이저 절삭군이 가장 높은 미세인장결합강도를 나타냈고, 다음이 Bur, 2 W, 4 W 절삭군 순이었다 (p<0.001). 4. Clearfil SE bond로 처리한 군 중에서 3 W 레이저 절삭군이 가장 높은 미세인장결합강도를 나타냈고, 다음이 2 W, 4 W, Bur 절삭군 순이었다 (p<0.001). 5. 두 가지 접착 시스템 모두에서, 레이저로 절삭한 군의 미세인장결합강도의 차이가 있었고, 높은 순서대로 나열하면 3 W, 2 W, 4 W 순이었다 (p<0.001). :상아질에 접착된 컴포지트 레진의 미세인장결합강도는 절삭방법과 접착시스템의 상호작용에 의해 유의한 영향을 받았다. 임상에서 레진 수복시, 2 W-3 W 범위내로 Er:YAG laser를 사용한다면 전통적 핸드피스 못지않게 수복물의 우수한 결합강도를 얻을 수 있다. 특히 시술시간의 단축, 과도한 산부식에 따른 부작용의 예방을 위해 Clearfil SE bond를 포함한 self etching system을 사용하고자 한다면 bur보다 Er:YAG laser를 이용한 삭제방법이 더 유용한 결합력을 제공할 것이다.

• Journal of Welding and Joining
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• 제28권4호
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• pp.61-66
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• 2010

Silicon nitride is widely used as an engineering ceramics because it has high strength, abrasion resistance and corrosion resistance even at high temperature. However, machining of silicon nitride is difficult due to its high hardness and brittleness. Laser assisted machining(LAM) allows effective cutting using CBN tool by locally heating the cutting part to the softening temperature of YSiAlON using the laser beam. The effect of preheating depending on process parameters were studied to find out the oxidation mechanism. If silicon nitride is sufficiently preheated, the surface is oxidized and $N_2$ gas is formed and escapes from the material, thereby making the cutting process more advantageous. During laser preheating process before machining, high temperature results in strong oxidation which makes the bloating, silicate layers and micro cracks. Using the results of these experiments, preheating characteristics and oxidation behavior were found out.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.842-846
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• 1997

Micro-hole drilling (holes less than 0.5 mm in diameter with aspect ratios larger than 10) is gaining increased attention in a wide spectrum of precision production industries. Alternative methods such as EDM, laser drilling, etc. can sometimes replace mechanical micro-hole drilling but are not acceptable in PCB manufacture because they yield inferior hole quality and accuracy. The major difficulties in micro-hold drilling are related to wandering motions during the inlet stage, high aspect ratios, high temperature,etc. However, of all the difficulties, the most undesirable one is the increase of drilling force as the drill penetrates deeper into hold. This is caused mainly by chip related effects. Peck-drilling is thus widely used for deep hole drilling despite the fact that it leads to low productivity. Therefore, in this paper, a method of cutting force regulation is proposed to achieve continuous drilling. A proportional plus derivative (PD) and a sliding modecontrol algorithm will be implemented for controlling the spinle rotational frequeency. Experimental results will show that sliding mode control reduces the nominal cutting force and its variation better than the PD control, resulting in a number of advantages such as an increase in drill life, fast stabilization of the wandering motion, and precise positioning of the hole.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.561-569
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• 2002

Laser has been called a "Quantum Machine" because of its mechanism of generation since the development on July 7,1960.by T.H.Maiman. We can now use this machine as a tool for manufacturing in industries. At present, 45kW CO2 laser, 10kW Nd:YAG laser, 6kW LD pumped YAG laser and 4kW direct diode laser facilities are available for welding a heavy steel plate of 40mm in thickness and for cutting metals at high speed of 140m/min. Laser Materials Processing is no longer a scientific curiosity but a modern tool in industries. Lasers in manufacturing sector are currently used in welding, cutting, drilling, cladding, marking, cleaning, micro-machining and forming. Recently, high power laser diode, 10kW LD pumped YAG laser, 700W fiber laser and excimer laser have been developed in the industrialized countries. As a result of large numbers of research and developments, the modem laser materials processing has been realized and used in all kinds of industries now. In the present paper, metallurgical studies on laser materials processing such as porosity formation, hot cracking and the joint performances of steels and aluminum alloys and dissimilar joint are discussed after the introduction of laser facilities and laser applications in industries such as automotive industry, electronics industry, and steel making industry. The wave towards the use of laser materials processing and its penetration into many industries has started in many countries now. Especially, development of high power/quality diode laser will be accelerate the introduction of this magnificent tool, because of the high efficiency of about 50%, long life time and compact.

• 한국정밀공학회지
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• 제15권1호
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• pp.117-129
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• 1998

Micro-hole drilling (holes less than 0.5 mm in diameter with aspect ratio larger than 10) is recently having more attention in a wide spectrum of precision production industries. Alternative methods such as EDM. laser drilling, etc. can sometimes replace the mechanical micro-hole drilling but are not acceptable in PCB manufacture because of the inferior hole quality and accuracy. The major difficulties in micro-hole drilling are related to small signal to noise ratios, wandering motions of the inlet stage, high aspect ratios, high temperatures and so forth. Of all the difficulties. the most undesirable one is the increase of drilling force as the drill proceeds deeper into the hole. This is caused mainly from the chip effects. Peck-drilling is thus widely used for deep hole drilling despite that it suffers from low productivity. In the paper, a method of cutting force regulation is proposed to achieve continuous drilling. A PD and a sliding mode control algorithms were implemented through controlling the spindle rotating frequency. Experimental results show that the sliding mode control reduces the nominal cutting force and the variation of the cutting force better than the PD control. The advantages of the regulation, such as increase of drill life, fast stabilization of a wandering motion, and the precise positioning of the hole are verified in experiment.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2005년도 춘계 학술대회
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• pp.219-223
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• 2005

Nowadays laser cutting is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can also be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor The concept of this method is shown in picture 1. Laser beam heats glass up to strain point, not to melting point and cooling system chills glass to induce maximun thermal stress in glass surface and then the thermal stress generates micro thermal crack, in other words blind depth of crack, along laser beam and cooling line.