• Journal of the korean academy of Pediatric Dentistry
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• v.29 no.3
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• pp.389-396
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• 2002

The purpose of this study was to compare the microtensile bonding strength of chemomechanically excavated dentin($Carisolv^{TM}$) to conventional caries removal(bur). The following adhesive systems were used; AB: All-Bond 2(3M, USA), PB: Prime & Bond 2.1(Dentsply, DE), AQ: AQ Bond(sun medical, Japan). 42 human molars with occlusal caries were assigned to 6 groups. Sequential caries removal was controlled with laser fluorescence. Each group was devided as follows; group A, B, C were $Carisolv^{TM}$ applied, group D,E,F were bur used. In group A and D, AB was used as a dentin adhesive. group B,E and group C,F was AQ and AQ was used each. The cavity was filled with composite resin(Z-100). The specimens were sectioned vertically into multiple serial 0.7 mm thick slabs. And then those slabs were sectioned into rectangular parts under 0.7 mm width. Finally 0.7-1.0 mm a right hexahedron shape stick become. Microtensile bonding test was carried out with testing apparatus at cross-head speed of $0.5\;mm/min^{-1}$ and fractured surfaces were observed with scanning electron microscope(JSM-6400, Jeol, Japan). The obtained results were summarized as follows ; 1. In the group of caries removal with $Carisolv^{TM}$, micro-tensile bonding strength decreased to $75.8{\sim}80$ percent of bur used group. 2. In the group of caries removal with $Carisolv^{TM}$, decreased degree of micro-tensile bonding strength is not so different in 3 kinds of dentin adhesives(p<0.05). 3. In the group of caries removal with $Carisolv^{TM}$, microtensile bonding strength of AB, PB, AQ was 32.6MPa(2.4), 30.1Mpa (1.8), 21.2Mpa(1.9). 4. In the group of caries removal with Bur and $Carisolv^{TM}$, microtensile bonding strength of AQ was significantly lower than that of AB and PB(p<0.01).