• Journal of the Korean Society for Precision Engineering
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• v.26 no.10
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• pp.25-31
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• 2009

• Journal of the Korean Society of Radiology
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• v.13 no.2
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• pp.313-318
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• 2019

To improve the sensitivity, a detector using a block scintillator was developed. In the pixelated scintillator, a reflector is located between pixels to move the light generated from the scintillator to the photosensor as much as possible, and sensitivity loss occurs in the reflector portion. In order to improve the sensitivity and to have the characteristics of the pixelated scintillator, the block scintillator was processed into a scintillator in pixel form through three-dimensional laser engraving. The energy spectra and energy resolution of each pixel were measured, and sensitivity analysis of block and pixel scintillator was performed through GATE simulation. The measured global energy resolution was 20.7%, and the sensitivity was 18.5% higher than that of the pixel scintillator. When this detector is applied to imaging devices such as gamma camera and positron emission tomography, it will be possible to shorten the imaging time and reduce the dose of patient by using less radiation source.

• Laser Solutions
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• v.15 no.4
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• pp.16-19
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• 2012

Due to the fact that the dimensions of circuit lines of IC substrates have been forecast to reduce rapidly, engraving the circuit line patterns with laser has emerged as a promising alternative. To engrave circuit line patterns in an IC substrate, we used a projection ablation technique in which a metal (INVAR) mask and a DPSS UV laser instead of an excimer laser are used. Results showed that the circuit line patterns engraved in the IC substrate have a width of about 15um and a depth of $13{\mu}m$. This indicates that the projection ablation with a metal mask and a DPSS UV laser could feasibly replace the semi-additive process (SAP).

• Laser Solutions
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• v.17 no.3
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• pp.10-14
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• 2014

By the specific character of femtosecond laser controlled volume of magnitude of micrometer scale could be ablated without melting phase in SKD11 and SUS304. According to the laser machining parameters various sectional shapes could be engraved on the surface of metals. Typical engraved lines were $10{\mu}m$ wide and deep. Coarse-milled surface was made $10{\mu}m$ lower than the original elevation by a bunch of laser-engraved lines in suitable spacing. The repeated banks with a height of $10{\mu}m$ could be made with the combination of the intact area.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.119-120
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• 2011

• Laser Solutions
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• v.13 no.2
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• pp.6-9
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• 2010

In printed electronics, printing rolls are used to transfer electronic ink onto a flexible substrate. Generally printing rolls are being made by the indirect laser method which is based on the etch process, thus not environment-friendly and not suitable for making a large printing roll. For the pursuit of making a large printing roll for mass printing of electronic devices, we have directly engraved micro-patterns into a Zn plated printing roll using a 30W pulse-modulated fiber laser. We have successfully engraved line patterns ranging from about 15-30${\mu}m$ in width.

• Laser Solutions
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• v.16 no.4
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• pp.17-23
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• 2013

The research for the development of roll-to-roll printing process is actively underway on behalf of the existing semiconductor process. The roll-to-roll printing system can make the electronic devices to low-cost mass production. This study is performed for developing the manufacturing technology of the printing roll used in the printing process of electronic devices. The indirect laser engraving technology is used to create printable roll and the printable roll is made out of the chrome coated roll after coating copper and polymer on the surface of steel roll, ablating the polymer on the surface of roll and etching the roll. The 3 dimensional laser scanner and roll rotating systems are constructed and the system control program is developed. We have used the fiber laser of 100 W grade, the 3 dimensional laser scanner and the 3 axes moving stage system with a rotating axis. We have found the optimal conditions by performing the laser patterning experiments and can make the minimum line width of $24{\mu}m$ by using the developed 3 dimensional laser scanner system.

• Laser Solutions
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• v.11 no.1
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• pp.1-6
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• 2008

We proposed new light guide panel (LGP) fabrication method exploiting laser-processed inner scatterers and surface pattern. The proposed method has achieved LGP performance improvement in both brightness and uniformity. The inner scatterers and surface pattern of grid type were fabricated with a 2nd harmonic Nd:YAG pulse laser engraving system and a $CO_2$ laser scanning system, respectively. In the implementation of LGP, inner scatterers was arranged in accordance with linear or curved pattern with changing density and surface pattern was engraved on the surface of an inner-scatterers embedded LGP. The increase of scatterers' density and the use of surface patterns in both linear and curved pattern provided high luminance and uniformity enhancement. While thecurved pattern incorporated with increased scatterers' density and surface patterns yielded brightness improvement with preserving good uniformity, the linear pattern showed highly localized brightness near the light entrance of the LGP. We can also observe that the uniformity was mainly determined by pattern of inner scatterers, and the brightness was improved by the higher density and the utilization of surface patterns. From the results, the use of laser-processed inner and surface patterns can be a potential alternative for efficient and simple LGP fabrication method.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.2
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• pp.216-223
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• 2010

The general way to process the surface by means of the laser was heat treatment for strengthening the surface hardness. They have used the laser for changing the property of the surface, especially for metal. Generally, it is recent increasing tendency to use the thin plate panel for making things smaller and lightweight. However, thin plate should be strengthened or let the thin plate panel have moment of inertia by means of engraving the groove or wave on them for lightweight and strengthening. Therefore it is expected that the thin plate panel can be harder and more stable through processing the metal surface by laser beam irradiation and the hardness of thin plate possibly can be also changed how many parts of them are harden. Through this research, it can be grasped how the hardness and mechanical characteristic changes according to width and depth of groove by laser affect the max stress by the ratio of $A_H/A_T$ (hardening area/total area) and characteristic of displacement and structural characteristic for making the thin plate harder by the strengthening metal surface of thin plate by laser through the experiment and analysis of FEA can be presented.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.432-432
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• 2007

We studied optical simulation method for ultra slim backlight system. We designed 0.7mm thickness light guide plate and combined 48 white color LEDs for 12 inch wide size TFT-LCD. We designed flat shape PMMA light guide plate with both side patterned. It have vertical prism shape on upper side and ellipse dot pattern on the other side. We targeted 4500 nit brightness and uniform emission characteristic without hot spot or dark area. At first, we designed uniform emission area with more high brightness in center area and then, debugged light entering hot spot zone and direction of outgoing light flux. Although it was designing step, we obtained good result with reverse prism optical sheet and it had good repeatability because it was based on the stamper method in injection process without laser engraving or micro groove engraving method.