• 한국정밀공학회지
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• 제26권10호
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• pp.25-31
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• 2009

• 한국방사선학회논문지
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• 제13권2호
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• pp.313-318
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• 2019

민감도 향상을 위해 블록형 섬광체를 사용한 검출기를 개발하였다. 픽셀형 섬광체는 섬광체에서 발생된 빛을 최대한 광센서로 이동시키기 위해 픽셀 사이에 반사체가 위치하며, 반사체 부분으로 민감도 손실이 발생한다. 민감도를 향상시키고 픽셀형 섬광체의 특징을 가지게 하기 위해 블록형 섬광체를 레이저 각인을 통해 픽셀 형태의 섬광체로 가공하였다. 본 섬광체를 위치민감형 광전증배관과 결합하여 평면 영상을 획득하였고, 각 픽셀별 에너지 스펙트럼과, 에너지 분해능을 측정하였으며, GATE 시뮬레이션을 통해 블록형 섬광체와 픽셀 섬광체의 민감도 분석을 수행하였다. 측정된 전체 에너지 분해능은 20.7%를 보였으며, 민감도는 픽셀 섬광체에 비해 18.5% 높은 결과를 나타내었다. 본 검출기를 감마카메라 및 양전자방출단층촬영기기 등의 영상화 기기에 활용할 경우 높은 민감도 향상을 통해 촬영시간의 단축 및 적은 방사선원 사용으로 환자의 피폭선량 감소를 이룰 수 있을 것이다.

• 한국레이저가공학회지
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• 제15권4호
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• pp.16-19
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• 2012

Due to the fact that the dimensions of circuit lines of IC substrates have been forecast to reduce rapidly, engraving the circuit line patterns with laser has emerged as a promising alternative. To engrave circuit line patterns in an IC substrate, we used a projection ablation technique in which a metal (INVAR) mask and a DPSS UV laser instead of an excimer laser are used. Results showed that the circuit line patterns engraved in the IC substrate have a width of about 15um and a depth of $13{\mu}m$. This indicates that the projection ablation with a metal mask and a DPSS UV laser could feasibly replace the semi-additive process (SAP).

• 한국레이저가공학회지
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• 제17권3호
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• pp.10-14
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• 2014

By the specific character of femtosecond laser controlled volume of magnitude of micrometer scale could be ablated without melting phase in SKD11 and SUS304. According to the laser machining parameters various sectional shapes could be engraved on the surface of metals. Typical engraved lines were $10{\mu}m$ wide and deep. Coarse-milled surface was made $10{\mu}m$ lower than the original elevation by a bunch of laser-engraved lines in suitable spacing. The repeated banks with a height of $10{\mu}m$ could be made with the combination of the intact area.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.119-120
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• 2011

• 한국레이저가공학회지
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• 제13권2호
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• pp.6-9
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• 2010

In printed electronics, printing rolls are used to transfer electronic ink onto a flexible substrate. Generally printing rolls are being made by the indirect laser method which is based on the etch process, thus not environment-friendly and not suitable for making a large printing roll. For the pursuit of making a large printing roll for mass printing of electronic devices, we have directly engraved micro-patterns into a Zn plated printing roll using a 30W pulse-modulated fiber laser. We have successfully engraved line patterns ranging from about 15-30${\mu}m$ in width.

• 한국레이저가공학회지
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• 제16권4호
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• pp.17-23
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• 2013

The research for the development of roll-to-roll printing process is actively underway on behalf of the existing semiconductor process. The roll-to-roll printing system can make the electronic devices to low-cost mass production. This study is performed for developing the manufacturing technology of the printing roll used in the printing process of electronic devices. The indirect laser engraving technology is used to create printable roll and the printable roll is made out of the chrome coated roll after coating copper and polymer on the surface of steel roll, ablating the polymer on the surface of roll and etching the roll. The 3 dimensional laser scanner and roll rotating systems are constructed and the system control program is developed. We have used the fiber laser of 100 W grade, the 3 dimensional laser scanner and the 3 axes moving stage system with a rotating axis. We have found the optimal conditions by performing the laser patterning experiments and can make the minimum line width of $24{\mu}m$ by using the developed 3 dimensional laser scanner system.

• 한국레이저가공학회지
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• 제11권1호
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• pp.1-6
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• 2008

We proposed new light guide panel (LGP) fabrication method exploiting laser-processed inner scatterers and surface pattern. The proposed method has achieved LGP performance improvement in both brightness and uniformity. The inner scatterers and surface pattern of grid type were fabricated with a 2nd harmonic Nd:YAG pulse laser engraving system and a $CO_2$ laser scanning system, respectively. In the implementation of LGP, inner scatterers was arranged in accordance with linear or curved pattern with changing density and surface pattern was engraved on the surface of an inner-scatterers embedded LGP. The increase of scatterers' density and the use of surface patterns in both linear and curved pattern provided high luminance and uniformity enhancement. While thecurved pattern incorporated with increased scatterers' density and surface patterns yielded brightness improvement with preserving good uniformity, the linear pattern showed highly localized brightness near the light entrance of the LGP. We can also observe that the uniformity was mainly determined by pattern of inner scatterers, and the brightness was improved by the higher density and the utilization of surface patterns. From the results, the use of laser-processed inner and surface patterns can be a potential alternative for efficient and simple LGP fabrication method.

• 한국생산제조학회지
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• 제19권2호
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• pp.216-223
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• 2010

The general way to process the surface by means of the laser was heat treatment for strengthening the surface hardness. They have used the laser for changing the property of the surface, especially for metal. Generally, it is recent increasing tendency to use the thin plate panel for making things smaller and lightweight. However, thin plate should be strengthened or let the thin plate panel have moment of inertia by means of engraving the groove or wave on them for lightweight and strengthening. Therefore it is expected that the thin plate panel can be harder and more stable through processing the metal surface by laser beam irradiation and the hardness of thin plate possibly can be also changed how many parts of them are harden. Through this research, it can be grasped how the hardness and mechanical characteristic changes according to width and depth of groove by laser affect the max stress by the ratio of $A_H/A_T$ (hardening area/total area) and characteristic of displacement and structural characteristic for making the thin plate harder by the strengthening metal surface of thin plate by laser through the experiment and analysis of FEA can be presented.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.432-432
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• 2007

We studied optical simulation method for ultra slim backlight system. We designed 0.7mm thickness light guide plate and combined 48 white color LEDs for 12 inch wide size TFT-LCD. We designed flat shape PMMA light guide plate with both side patterned. It have vertical prism shape on upper side and ellipse dot pattern on the other side. We targeted 4500 nit brightness and uniform emission characteristic without hot spot or dark area. At first, we designed uniform emission area with more high brightness in center area and then, debugged light entering hot spot zone and direction of outgoing light flux. Although it was designing step, we obtained good result with reverse prism optical sheet and it had good repeatability because it was based on the stamper method in injection process without laser engraving or micro groove engraving method.