• 한국기계가공학회지
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• 제20권8호
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• pp.18-24
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• 2021

Polymers, polymer compounds, are very moldable at low temperatures and have good strength against weight, and hence, are often used in the interior and exterior materials of cars. Owing to the increasing environmental problems, emission regulations have become stricter, which has increased the use of lightweight polymers as substitutes for metal materials. Therefore, as the use of polymer increases, extensive research is being conducted on the bonding technology of polymers, such as polyurethane and epoxy. However, the increased cost and environmental pollution by adhesives caused by the polymer manufacturing plant depend on the chemical composition or the manufacturer's mix ratio. To compensate for this issue, a laser beam is irradiated through a highly permeable polymer (PC) placed on top of an absorbent polymer (ABS) to transfer the laser output to the ABS polymer and fuse them at the interface. Moreover, enabling laser penetrating bonding by placing a stainless steel wire mesh between the two polymers can achieve improved bonding strength compared to conventional heterogeneous polymer bonding.

• 대한치과보철학회지
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• 제35권2호
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• pp.385-399
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• 1997

The purpose of this experiment was to determine the effects of etching with a Nd : YAG Laser on dentin, or porcelain surface on the bond strength with composite resin. The dentin specimens were devided into the following 4 groups. D1 : No treatment D2 : Etched with 10% phosphoric acid D3 : Laser etchded with 1W, 20PPs D4 : Laser etched with 2W, 20PPS The procelain specimens were devided into the following 4 groups. P1 : diamond roughened P2 : etched with HF acid P3 : Laser etched with 2W, 20PPS P4 : Laser etched with 3W, 20PPS All specimens were veneered with resin. One half of the specimens were stored in $37^{\circ}C$ water for one day and the other half were thermocycled 1000 times at temperature of $5^{\circ}C\;to\;55^{\circ}C$ at 20 seconds intervals. After that, the bonding strength of composite resin to the dentin and porcelain was measured. The surface treated state and fractured state were observed with SEM. The following results were obtained. 1. In the dentin specimens, the bond strength of group D2 was highter than that of groups D1 and D3 in the case of the specimens stored in $37^{\circ}C$ water for one day, there was a statistically significant difference between group D2 and D1, D3 (P<0.05). The bonding strength of the specimens that were thermocycled decreased in the following order : group D2,D4,D3 and then D1. 2. In the porcelain specimens, the bonding strength of groups P1,P2 were higher than that of group P3 in the case of the specimens stored in $37^{\circ}C$ water for one day (P<0.05). The bonding strength of the specimens of being thermocycled decreased in the following order : group P2,P1,P4 and then P3. 3. The groups of high bond strength had a rougher surface and a high level of microporosity with SEM findings.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.43-44
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• 2008

• 한국레이저가공학회지
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• 제2권1호
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• pp.38-42
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• 1999

As very large scale integration technology has been developed, much more accurate, reliable technology is needed for outer lead bonding. Laser soldering has been researched as an alternative for fine pitch device bonding. This study is focused on how to select optimal laser soldering variables with which solder wets parent material, the microstructural results of laser soldering and the reliability test One of popular packages, QFP100 was soldered successfully with two kinds of solder. The inspection of the joint for reliability was carried out by optical microscope, SEM, EDAX and pull test, which demonstrated the superiority of laser soldering.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.423-426
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• 2005

A new chip on glass(COG) technique by making use of a high power diode laser for LCD driver IC packaging of LCD has been developed. A laser joining technology of the connection of IC chip to glass panel has several advantages over conventional method such as hot plate joining: shorter process time, high reliability of joining, and better fur fine pitch joining. The reach time to cure temperature of ACF in laser joining is within 1 second. In this study, results show that the total process time of joining is reduced by halves than that of conventional method. The adhesion strength is mainly 100-250 N/cm. It is confirmed that the COG technology using high power diode laser joining can be applied to advanced LCDs with a fine pitch.

• ETRI Journal
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• 제46권2호
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• pp.347-359
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• 2024

A simultaneous transfer and bonding (SITRAB) process using areal laser irradiation is introduced for high-yield and cost-effective production of mini- or micro-light-emitting diode (LED) display panels. SITRAB materials are special epoxy-based solvent-free pastes. Three types of pot life are studied to obtain a convenient SITRAB process: Room temperature pot life (RPL), stage pot life (SPL), and laser pot life (LPL). In this study, the RPL was found to be 1.2 times the starting viscosity at 25℃, and the SPL was defined as the time the solder can be wetted by the SITRAB paste at given stage temperatures of 80℃, 90℃, and 100℃. The LPL, on the other hand, was referred to as the number of areal laser irradiations for the tiling process for red, green, and blue LEDs at the given stage temperatures. The process windows of SPL and LPL were identified based on their critical time and conversion requirements for good solder wetting. The measured RPL and SPL at the stage temperature of 80℃ were 6 days and 8 h, respectively, and the LPL was more than six at these stage temperatures.

• 대한의용생체공학회:학술대회논문집
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• 대한의용생체공학회 1997년도 춘계학술대회
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• pp.35-38
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• 1997

The interfacial bonding energy between laser surface treated HA layer and Ti alloy substrate was investigated using a mechanical push-out tester. The initial slope of shear-stress and reduced displacement curves, maximum interfacial bond strength and bonding energy were calculated from results of the push-out test. The calculated initial slpoes are 38 MPa for the Ti alloy(A), 65 MPa for the sandblast finished specimen(B), 95 MPa for the HA plasma spray coated specimen and 49 MPa for the laser surface treated specimen(D). The maximum interfacial bonding strength are 3 MPa for the A, 19 MPa for the B, 20 MPa for the C, 10 MPa for the D. The interfacial bonding energies are $3.3\times10^{-9}J/mm^2$ for the A, $15.5\times10^{-9}J/mm^2$ for the B, $15.6\times10^{-9}J/mm^2$ for the C and $18.3\times10^{-9}J/mm^2$ for the D. Microscopic observation shows that the breaking of the laser treated specimen had been occured through the boundary between HA layer and polymer resin, but the untreated specimen had been occured through the inside of HA coating layer.

• 전자통신동향분석
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• 제35권4호
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• Design & Manufacturing
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• 제13권4호
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• pp.10-16
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• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

• 마이크로전자및패키징학회지
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• 제29권2호
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• pp.113-119
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• 2022

플렉서블, 웨어러블 디바이스 등을 포함한 차세대 전자 기기의 기계적 신뢰성 향상을 위하여 다양한 유연 접합부에서 높은 수준의 기계적 신뢰성이 요구되고 있다. 기존 고분자 기판 접합을 위한 에폭시 등의 유기 접착소재는 접합부 두께 증가가 필연적이며, 반복 변형, 고온 경화에 의한 열기계적 파손 문제를 수반한다. 따라서 유연 접합을 위해서 접합부 두께를 최소화하고 열 손상을 방지하기 위한 저온 접합 공정 개발이 요구된다. 본 연구에서는 플렉서블 기판의 유연, 강건, 저 열 손상 접합이 가능한 플렉서블 레이저 투과 용접(flexible laser transmission welding, f-LTW)를 개발하였다. 유연 기판 위 탄소나노튜브(carbon nanotube, CNT)를 박막 코팅하여 접합부 두께를 줄였으며, CNT 분산 빔 레이저 가열을 통한 고분자 기판 표면의 국부적 용융 접합 공정이 개발되었다. 짧은 접합 공정 시간과 기판의 열 손상을 최소화하는 레이저 공정 조건을 구축하였으며 고분자 기판과 CNT 접합 형성 메커니즘을 분석하였다. 또한 접합부의 강건성 및 유연성 평가를 위해 인장강도 시험, 박리 시험과 반복 굽힘 시험을 진행하였다.