• Title/Summary/Keyword: Large-scale assembly

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Large Scale Directed Assembly of SWNTs and Nanoparticles for Electronics and Biotechnology

  • Busnaina, Ahmed;Smith, W.L.
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.10a
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    • pp.9-9
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    • 2011
  • The transfer of nano-science accomplishments into technology is severely hindered by a lack of understanding of barriers to nanoscale manufacturing. The NSF Center for High-rate Nanomanufacturing (CHN) is developing tools and processes to conduct fast massive directed assembly of nanoscale elements by controlling the forces required to assemble, detach, and transfer nanoelements at high rates and over large areas. The center has developed templates with nanofeatures to direct the assembly of carbon nanotubes and nanoparticles (down to 10 nm) into nanoscale trenches in a short time (in seconds) and over a large area (measured in inches). The center has demonstrated that nanotemplates can be used to pattern conducting polymers and that the patterned polymer can be transferred onto a second polymer substrate. Recently, a fast and highly scalable process for fabricating interconnects from CMOS and other types of interconnects has been developed using metallic nanoparticles. The particles are precisely assembled into the vias from the suspension and then fused in a room temperature process creating nanoscale interconnect. The center has many applications where the technology has been demonstrated. For example, the nonvolatile memory switches using (SWNTs) or molecules assembled on a wafer level. A new biosensor chip (0.02 $mm^2$) capable of detecting multiple biomarkers simultaneously and can be in vitro and in vivo with a detection limit that's 200 times lower than current technology. The center has developed the fundamental science and engineering platform necessary to manufacture a wide array of applications ranging from electronics, energy, and materials to biotechnology.

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Policy for planned placement of sensor nodes in large scale wireless sensor network

  • Sharma, Vikrant;Patel, R.B;Bhadauria, HS;Prasad, D
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.10 no.7
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    • pp.3213-3230
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    • 2016
  • Sensor node (SN) is a crucial part in any remote monitoring system. It is a device designed to monitor the particular changes taking place in its environs. Wireless sensor network (WSN) is a system formed by the set of wirelessly connected SNs placed at different geographical locations within a target region. Precise placement of SNs is appreciated, as it affects the efficiency and effectiveness of any WSN. The manual placement of SNs is only feasible for small scale regions. The task of SN placement becomes tedious, when the size of a target region is extremely large and manually unreachable. In this research article, an automated mechanism for fast and precise deployment of SNs in a large scale target region has been proposed. It uses an assembly of rotating cannons to launch the SNs from a moving carrier helicopter. The entire system is synchronized such that the launched SNs accurately land on the pre-computed desired locations (DLs). Simulation results show that the proposed model offers a simple, time efficient and effective technique to place SNs in a large scale target region.

Quantity Management Model for Manufacturing and Assembly of Large-scale Modular Construction Projects during Construction Phase (대규모 모듈러 건축 프로젝트 현장 시공 시 공장 생산량 및 현장 시공량 관리 모델)

  • Choi, Onekyu;Lee, Hyunsoo;Park, Moonseo;Hyun, Hosang
    • Korean Journal of Construction Engineering and Management
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    • v.19 no.1
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    • pp.43-53
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    • 2018
  • Modular construction can improve construction quality and accuracy through manufacturing process, and it allow massive production and cost savings by repeatedly producing the same unit. In particular, it is possible to reduce the time because the on-site work and the manufacturing process can be carried out at simultaneously. However, according to the modular construction project survey report, there is no significant difference regarding the average construction period between modular construction and conventional construction. This is due to schedule delay problems that occur during construction phase. Therefore, it is necessary to select alternatives to prevent schedule delay during on-site construction progressing. Especially, in case of large-scale modular construction project, on-site module assembly and manufacturing process are performed concurrently. Hence, identification of alternatives should be done at the co-occurrence by taking both manufacturing and on-site work process in to account. In this research, the management factors of large-scale modular construction project were identified through the IDEF0 modeling, and the quantity management model for manufacturing and assembly is developed. This will reduce the schedule delay problem that occurs in the progression on-site work of a large scale modular construction.

Fabrication of Large-Scale Single-Crystal Organic Nanowire Arrays for High-Integrated Flexible Electronics

  • Park, Gyeong-Seon;Seong, Myeong-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.266.1-266.1
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    • 2013
  • Large-scale single-crystal organic nanowire arrays were generated using a direct printing method (liquidbridge- mediated nanotransfer molding) that enables the simultaneous synthesis, alignment and patterning of nanowires from molecular ink solutions. Using this method, single-crystal organic nanowires can easily be synthesized by self-assembly and crystallization of organic molecules within the nanoscale channels of molds, and these nanowires can then be directly transferred to specific positions on substrates to generate nanowire arrays by a direct printing process. Repeated application of the direct printing process can be used to produce organic nanowire-integrated electronics with two- or three-dimensional complex structures on large-area flexible substrates. This efficient manufacturing method is used to fabricate all-organic nanowire field-effect transistors that are integrated into device arrays and inverters on flexible plastic substrates.

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Robotic welding system for sub-assembly line in ship manufacturing (로봇을 이용한 조선 소조립 용접 자동화 시스템)

  • 김진오;신정식;김성권
    • 제어로봇시스템학회:학술대회논문집
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    • 1996.10b
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    • pp.516-519
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    • 1996
  • Sub-assembly in ship manufacturing is a sequence of filet joint welding of stiffeners on metal panels and the process is different depending on companies. In this paper, we introduce a new intelligent robotic system of the sub-assembly process in Samsung Heavy Industry, where one shift of 22m * 9m workspace includes one to ten panels and each panel includes up to 10 stiffeners. The inherent problems such as several hundreds of different panels, unstructured task environment and the large scale do not allow a fixed automation, but needs highly intelligent versatile automation. The robotic system is composed of four 14DOF macro-mini robots and a task recognition system. Application of this system has verified the task specification such as low temperature environment(-10.deg. C) and productivity is satisfied successfully.

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Mono and Multilayer Assembly of Zeolite Microcrystals on Substrates

  • Yoon, Kyung-Byung
    • Bulletin of the Korean Chemical Society
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    • v.27 no.1
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    • pp.17-26
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    • 2006
  • We have shown that zeolite microcrystals can be readily organized in the form of uniformly oriented monoand multilayers on various substrates by well-defined chemical linkages based on covalent, ionic, and hydrogen bondings between the microcrystals and the substrates. This finding establishes the fact that micrometer-scale building blocks can be readily organized into organized entities through interconnection of the surface-tethered large number of functional groups. Since zeolite crystals have highly regular and uniform nanochannels and nanopores within them, the resulting mono and multilayers of zeolite microcrystals bear great potential to be utilized in various novel applications.

An XML-based Digital Mock-Up System for Heterogeneous Multi-CAD Assembly (XML을 이용한 이기종 CAD 조립체 DMU시스템의 설계)

  • Song, In-Ho;Chung, Sung-Chong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.31 no.6 s.261
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    • pp.635-643
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    • 2007
  • As many engineers and technicians are involved in the design process of large scale and/or complex products, there are a lot of miss matches and interferences due to designers' faults and several kinds of CAD systems. Recently, CAD systems are applied to verify and check the assembly process. Digital Mock-Up(DMU) system, a tool to build a virtual mock-up in the design stage, has been used to prevent the interferences and miss matches during precision design processes. Using the virtual assembly tool, engineers are able to design precision and interference free parts without physical mock-ups. Instead of a single CAD source, several CAD systems are used to design a complex product. Several organizations are involved in the distributed design environment for heterogeneous multi-CAD assembly. XML and the lightweight CAD file are proposed for the multi-CAD assembly. XML data contains hierarchy of the heterogenenous multi-CAD assembly. STEP PDM schema and STEP ISO 10303-28 formations are applied to construct the XML data. The lightweight CAD file produced from various CAD files through ACIS kernel and InterOp not only contains mesn, B-Rep and topological data, but also is used to visualize CAD data and to verify dimensions. Developed system is executed on the desktop computers. It does not require commercial CAD systems to visualize 3D assembly data. Real-time interference and fitness checks, dimensional verification, and design and assembly verification are performed on the developed system. Assembly of heterogeneous models for a car is conducted to verify the effectiveness of the developed DMU system on the Internet.

Nanotransfer Printing for Large-Scale Integrated Nanopatterns of Various Single-Crystal Organic Materials

  • Baek, Jang-Mi;Park, Gyeong-Seon;Seong, Myeong-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.361.2-361.2
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    • 2016
  • The manufacture of organic electronic circuits requires effective heterogeneous integration of different nanoscale organic materials with uniform morphology and crystallinity in a desired arrangement on a substrate. Herein, we present a new direct printing method, which enables monolithic integration of crystalline nanowire arrays with a diverse range of organic materials. In this method, we use a nanoscale patterned soft mold, which contains an assembly of simple nanoline patterns but, in combination with droplet of various organic inks, can produce a large-scale integration of various nanopatterns with multiple kinds of organic materials. The morphology of organic nanowires can controlled by nanoconfinement in nanoline of mold. And mutual alignment of nanopatterns can be controlled by adjusting the ink droplet size, number of droplets, ink deposition locations.

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A Study of Beat Transfer Characteristics of Large Scale Vortex Flow Mixing Vane of Nuclear Fuel Rod Bundle (핵연료집합체에서의 대형이차와류 혼합날개의 열전달 특성에 관한 연구)

  • An, Jeong-Soo;Choi, Young-Don
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.30 no.1 s.244
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    • pp.24-31
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    • 2006
  • Mixing vanes have been installed in the space grid of nuclear fuel rod bundle to improve turbulent heat transfer. Split mixing vanes induce the vortex flow in the cooling water to swirl in sub-channel of fuel assembly. But, The swirling flow decays rapidly so that the heat transfer enhancing effect limited to short length after the mixing vane. In thi present study, the large scale vortex flow(LSVF) is generated by rearranging the mixing vanes to the coordinated directions. This LSVF mixing vanes generate the most strong secondary flow vortices which maintain about 35 $D_H$ after the spacer grid. The streamwise vorticity generated by LSVF sustain two times more than that split mixing vane. Heat transfer in the rod bundle occurs greatly at the same direction to cross flow, and maximum temperature at the surface of bundle drops about 1.5K

3D Calibration Method on Large-Scale Hull Pieces Profile Measurement using Multi-Slit Beams (선박용 곡판형상의 실시간 측정을 위한 다중 슬릿빔 보정법)

  • Kim, ByoungChang;Lee, Se-Han
    • Journal of Institute of Control, Robotics and Systems
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    • v.19 no.11
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    • pp.968-973
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    • 2013
  • In the transportation industry, especially in the shipbuilding process, 3D surface measurement of large-scale hull pieces is needed for fabrication and assembly. We suggest an efficient method for checking the shape of curved plates under the forming operation with short time by measuring 3D profiles along the multi lines of the target surface. For accurate profile reconstruction, 2D camera calibration and 3D calibration using gauge blocks were performed. The evaluation test shows that the measurement accuracy is within the boundary of tolerance required in the shipbuilding process.