• 제목/요약/키워드: Large Scale Diametrical Silicon Wafer

검색결과 2건 처리시간 0.022초

로타리 연삭에 의한 대직경 Si-wafer의 ELID 경면 연삭특성 (Characteristic of Mirror Surface ELID Grinding of Large Scale Diametrical Silicon Wafer with Rotary Type Grinding Machine)

  • 박창수;김원일;왕덕현
    • 한국공작기계학회논문집
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    • 제11권5호
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    • pp.58-64
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    • 2002
  • Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some finding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.

로타리 연삭에 의한 대직경 Si-wafer의 ELID 경면 연삭특성 (Characteristic of Mirror Surface ELID Grinding of Large Scale Diametrical Silicon Wafer with Rotary Type Grinding Machine)

  • 박창수;김원일;이윤경;왕덕현;김경년
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2002년도 춘계학술대회 논문집
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    • pp.660-665
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    • 2002
  • Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels ware conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding n/c equipment with an ELID wit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2 - 6 nm in Ra.

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