• Journal of Mechanical Science and Technology
• /
• v.19 no.8
• /
• pp.1576-1581
• /
• 2005

Generally, the optical components are fabricated by grinding, lapping, and polishing. And, those processes take long time to obtain such a high surface quality. Therefore, in the case of large optical component, the on-machine inspection (OMI) is essential. Because, the work piece is fragile and difficult to set up for fabricating and measuring. This paper is concerned about a swing-arm method for measuring surface profile of large optical concave mirror. The measuring accuracy and uncertainty for suggested method are studied. The experimental results show that this method is useful specially in lapping process with the accuracy of $3\~5\;{\mu}m$. Those inspection data are provided for correcting the residual figuring error in lapping or polishing processes.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.7 no.3
• /
• pp.41-46
• /
• 2008

Generally optical components are fabricated by grinding, lapping and polishing processes. Those processes take long time to obtain optical high surface quality. In the case of large optical components, the on-machine measurement is strongly recommended because the workpiece is fragile and difficult to set up for fabricating and measuring. This paper is concerned about a swing-arm mechanism which can be used for on-machine measurement of a surface profile with a sensing probe end-effect, and also for grinding or lapping the surface with a corresponding tool. The measuring accuracy and uncertainty using a swing arm type profilometer have been studied. The experimental results show that this method is useful specially in lapping process with the accuracy of $5{\mu}m$. Those inspection data are provided for correcting the residual figuring error in next processes.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.12 no.3
• /
• pp.1-7
• /
• 2003

In-process Electrolytic Dressing is a lapping method using electrolysis. This technology provides dressing to CIB-Diamond Lapping wheels during the lapping process for continuous protrude abrasive from super-abrasive wheels. so loading and glazing are disappeared apparently. Ultra-precision lapping of the machinable commies will be studied in the viewpoint of In-process Electrolytic Dressing. For ultra-precision lapping, need to develop an ultra-precision lapping system suitable metal bonded diamond wheel, and appropriate condition of u10a-precision lapping machining.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.17 no.4
• /
• pp.29-34
• /
• 2008

Application of ceramic has increased due to excellent mechanical properties, and machining of ceramic has demanded gradually a precision surface machining. For decreasing the surface roughness, the control of IED lapping parameters is very important. This paper deal with the analysis of the process parameters such as applied forces, percentage of h-BN and IED lapping time, developed based on Taguchi method. Also, SEM was used for monitoring of a machinable ceramic surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.152-152
• /
• 2009

We investigate micro-tip properties as Ni-Co plating and CMP processes for MEMS probe card and units. The micro-tip are fabricated by using Ni-Co plating machine, lapping machine, and chemo-mechanical polisher. In order to get high conductive and reliable micro-tip, we control Co contents and thickness by CMP speed. We have found that about 20-25% of Co contents are required and have to lapping speed of 30 rpm. Also, we investigate photolithography and Ni-Co plating processes conditions for the one-step and the three-step micro-tips.

• Bulletin of the Korean Space Science Society
• /
• 2004.04a
• /
• pp.33-33
• /
• 2004

Traditional bound abrasive grinding leaves the machine marks and subsurface damages ranging from 1 to few tens microns ms in height. These are removed typically by subsequent craftmen-based loose abrasive lapping, polishing and figuring. Using the multi-variable regression technique, we established a new automated grinding process control method for the removal of loose abrasive lapping from the traditional fabrication process. (omitted)

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.05a
• /
• pp.33-33
• /
• 2004

래핑은 상하정반 사이에 공작물과 공작물을 지지할 수 있는 캐리어를 삽입하여 유성치차운동 방식으로 가공하는 것으로, 오래 전부터 산업전반에 걸쳐 널리 사용되어 왔다. 래핑의 특징은 한번에 많은 수의 공작물을 가공할 수 있어 가공능률이 우수하고, 높은 형상 정밀도를 확보할 수 있을 뿐만 아니라 가공부의 표면 거칠기가 양호하고 가공 변질층이 작다는 이점을 가지고 있다. 특히 박판 형상의 가공물이나 경도에 비해 강도가 취약한 경취성 재질의 가공물을 정밀하고 효과적으로 가공할 수 있기 때문에 최근에는 정밀 기계산업 분야 이외에도 광통신 산업, 반도체 산업, 디스플레이 산업 등에서 그 활용이 점차 증가하고 있는 추세이다.(중략)

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.1-5
• /
• 2005

The grinding process is replacing lapping and etching process because significant cost savings and performance improvemnets is possible. This paper presents the experimental results of wafer grinding. A three-variable two-level full factorial design was employed to reveal the main effects as well as the interaction effects of three process parameters such as wheel rotational speed, chuck table rotational speed and feed rate on TTV and STIR of wafers. The chuck table rotaional speed was a significant factor and the interaction effects was significant. The ground wafer shape was affected by surface shape of chuck table.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 1999.05a
• /
• pp.128-133
• /
• 1999

In recent years, LSI devices have become more powerful and lower-priced, caused by a development of various wafer materials and an increase in the diameter of wafers. On the other hand, these have created some serious problems in manufacturing of wafers because materials used as semiconductor substrate are very brittle. In view of this fact, there are some trials to apply shear-mode(or ductile-mode) grinding for efficient manufacturing of semiconductor wafers instead of conventional lapping process. In fact grinding process that has not only more excellent degree of accuracy but also more adaptable to fully automated manufacturing than lapping, is already used in Si machining field. This paper described the elementary studies to establish the grinding technology of wafers. First, we investigated the variation of grinding force and the transition of grinding mode as various grinding conditions. Then, it was inspected that the change of grinding force affected the integrity such as the topography and the roughness of ground surfaces, and led to the chemical defects generation and distribution in damaged layer. The degree of defects was estimated by FT-IR(Fourier Transformed Infrared) Spectroscopy and Auger Electron Spectroscopy

• International Journal of Precision Engineering and Manufacturing
• /
• v.5 no.3
• /
• pp.62-68
• /
• 2004

Effectiveness of a corrective machining algorithm, which can construct the proper machining information to improve motion errors utilizing measured motion errors, is verified experimentally in this paper, Corrective machining process is practically applied to single and double side hydrostatic bearing tables. Lapping process is applied as a machining method. The machining information is obtained from the measured motion errors by applying the algorithm, without any information on the rail profile. In the case of the single-side table, after 3 times of corrective remachining, linear and angular motion errors are improved up to 0.13 $\mu\textrm{m}$ and 1.40 arcsec from initial error of 1.04 $\mu\textrm{m}$ and 22.71 arcsec, respectively. In the case of the double-side table, linear and angular motion error are improved up to 0.07 /$\mu\textrm{m}$ and 1.42 arcsec from the initial error of 0.32 $\mu\textrm{m}$ and 4.14 arcsec. The practical machining process is performed by an unskilled person after he received a preliminary training in machining. Experimental results show that the corrective machining algorithm is very effective and easy to use to improve the accuracy of hydrostatic tables.