• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.5
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• pp.616-621
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• 2010

New type of the base material of the light-emitting diode requires copper wafer in view of heat and electrical conductance. Therefore, polishing process of the substrate level is needed to get a nanometer level of surface roughness as compared with pattern structure of nano-size in the semiconductor industry. In this paper, a series of lapping and polishing technique is shown for the rough and deflected copper substrate of thickness 3mm. Lapping by sand papers tried air cooling method. And two steps of polishing used the diamond abrasives and the $Al_2O_3$ slurry of size 100mm considering the residual scratch. White-light interferometer proved successfully a mirror-like surface roughness of Ra 6nm on the area of $0.56mm{\times}0.42mm$.

• Journal of Mechanical Science and Technology
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• v.19 no.8
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• pp.1576-1581
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• 2005

Generally, the optical components are fabricated by grinding, lapping, and polishing. And, those processes take long time to obtain such a high surface quality. Therefore, in the case of large optical component, the on-machine inspection (OMI) is essential. Because, the work piece is fragile and difficult to set up for fabricating and measuring. This paper is concerned about a swing-arm method for measuring surface profile of large optical concave mirror. The measuring accuracy and uncertainty for suggested method are studied. The experimental results show that this method is useful specially in lapping process with the accuracy of $3\~5\;{\mu}m$. Those inspection data are provided for correcting the residual figuring error in lapping or polishing processes.

• 제어로봇시스템학회:학술대회논문집
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• 1990.10a
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• pp.190-193
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• 1990

Die finishing (polishing and lapping) after NC machining is characterized as one bottleneck process for reducing lead time. For automation of this typical manual work, a flexible polishing tool system using industrial robot has been developed. This tool system has three principal functions in order to achieve reduction of waviness, 3 D.O.F. compliance and constant pressure structure. This polishing tool shows that adaptability to free form surface is increased and programmability to various areas of die surface is also acquired.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.11 no.5
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• pp.218-223
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• 2001

The chemical-mechanical polishing process was carried out for 2"-dia. sapphire wafer grown by horizontalBridgman method on the urethane lapping pad with the silica sol. The polished wafer shows the full-width at halfmaximum of 200~400 arcsec in double-crystal X-ray diffraction, indicating that the slicing, grinding and lapping processes before the polishing process affected the crystalline structural property of the wafer surface by the mechanical residual stress. For the inclusion of surface treatments after chemical-mechanical polishing such as the thermal annealing at the temperature of $1,200^{\circ}C$for 4 hrs. and chemical etching, the crystalline quality was sigdicantly enhanced with the reduced full-width at half maximum up to 8.3 arcsec.arcsec.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.24-28
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• 1996

Mirror-like polishing system of hemisphericall high-speed precision bearing for digital VTR drum was developed. Mechamism of the polishing process was analyzed in the view point of polishing contact range and contact length between the tool and the workpiece surface. It was suggested that the two stage polishing process adoptiong the diamond grinding wheel and polishing tool instead of multistage lapping processes, which enables the mass production of the bearing by reduction of polishing time.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.3
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• pp.41-46
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• 2008

Generally optical components are fabricated by grinding, lapping and polishing processes. Those processes take long time to obtain optical high surface quality. In the case of large optical components, the on-machine measurement is strongly recommended because the workpiece is fragile and difficult to set up for fabricating and measuring. This paper is concerned about a swing-arm mechanism which can be used for on-machine measurement of a surface profile with a sensing probe end-effect, and also for grinding or lapping the surface with a corresponding tool. The measuring accuracy and uncertainty using a swing arm type profilometer have been studied. The experimental results show that this method is useful specially in lapping process with the accuracy of $5{\mu}m$. Those inspection data are provided for correcting the residual figuring error in next processes.

• Journal of the Korean Society for Heat Treatment
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• v.2 no.2
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• pp.33-37
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• 1989

In order to improve hardness uniformity of standard-hardness blocks. experimental procedure was designed using Taguchi Method. For this purpose the following factors were studied: austenitizing temperature, tempering condition, grinding condition, subzero treatment, lapping time, $15{\mu}m$ polishing time, final polishing time. These factors were processed and then ten hardness values were measured on each specimen. SN (signal to noise) ratio for each condition was calculated with standard variations of these values. Finally, from the calculated value of ANOVA on SN ratios, the lapping time was found to be the main factor Better uniformity with longer lapping time implies that residual stress that was formed after quenching is a dominent parameter that affects on the uniformity of hardness. Therefore, step-quenching method was adapted to minimize the residual stress. By this modification of quenching procedure, the hardness uniformity was improved remarkably and the yield ratio was increased from 55% to 88%.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1996.03a
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• pp.124-131
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• 1996

The use of small hemispherical high-speed precision bearing has increased drastically these days in the field of computer disk driver, highteech devices as well as communication and electronic device drivers. It was suggested that the new polishing process adopting the diamond grinding wheel and polishing tool instead of multi stage lapping processes, which enables the mass production of the bearing by reduction of polishing time. Polishing mechanism was analysed and the results were applied to the design and manufacturing of the polishing system. Experiments for selection of optimal polishing conditions were carried out using the polishing system.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.11
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• pp.211-220
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• 2002

Optical disk drives read information by replacing a laser beam on the disk track. As information has become larger, the more accurate position control of a laser beam is necessary. In this paper, we report the analysis and fabrication of the micro mirror for optical disk drivers. A coupled simulation of gas flow and structural displacement of the micro mirror using the Finite-Element-Method is applied to this. The mirror was fabricated by using MEMS technology. Especially, the process using the lapping and polishing step after the bonding of the mirror and electrode plates was employed for the Process reliability. The mirror size was 2.5mm${\times}$3mm and it needed about 35V for displacement of 3.2 ${\mu}$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.149-150
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• 2012