• ETRI Journal
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• 제41권6호
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• pp.811-819
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• 2019

We propose a substrate with high thermal conductivity, manufactured by the low-temperature co-fired ceramic (LTCC) multilayer circuit process technology, as a new DC/DC converter platform for power electronics applications. We compare the reliability and power conversion efficiency of a converter using the LTCC substrate with the one using a conventional printed circuit board (PCB) substrate, to demonstrate the superior characteristics of the LTCC substrates. The power conversion efficiencies of the LTCC- and PCB-based synchronous buck converters are 95.5% and 94.5%, respectively, while those of nonsynchronous buck converters are 92.5% and 91.3%, respectively, at an output power of 100 W. To verify the reliability of the LTCC-based converter, two types of tests were conducted. Storage temperature tests were conducted at -20 ℃ and 85 ℃ for 100 h each. The variation in efficiency after the tests was less than 0.3%. A working temperature test was conducted for 60 min, and the temperature of the converter was saturated at 58.2 ℃ without a decrease in efficiency. These results demonstrate the applicability of LTCC as a substrate for power conversion systems.

• 전자공학회논문지
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• 제50권10호
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• pp.41-49
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• 2013

본 논문에서는 차량 충돌 방지용 밀리미터파 레이더 시스템용 안테나에 적용 가능한 LTCC(low temperature co-fired ceramic) 공정을 사용한 유전체 공진기 안테나(DRA, dielectric resonator antenna)를 제안한다. 76-77 GHz에서 공진하는 DRA를 설계하며, LTCC 공정을 사용하여 유전체 공진기 내부에 SRR(split ring resonator)을 넣은 구조와 모노폴을 넣은 구조를 제안한다. 또한 모노폴을 넣은 구조는 선형 편파를 제공하는 안테나와 원형편파를 제공하는 두 가지 구조로 설계한다. 유전체 공진기 내부 구조 및 편파, 급전 마이크로스트립 선로 길이 및 마이크로스트립 구조에 따라 총 3가지 모델의 DRA를 설계하고, EM 해석 소프트웨어인 CST를 사용하여 각 안테나의 반사손실 특성 및 방사 패턴을 계산한다. 설계된 안테나를 실제 제작하여 특성을 측정하고 계산치와 비교한다. 제작된 DRA 측정결과 원하는 대역인 76-77GHz 대역에서 공진 특성을 나타내고, 8.15 dBi에서 10.82 dBi의 안테나 이득을 획득하였다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제11권4호
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• pp.229-237
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• 2011

In this paper, a 60 GHz LTCC SiP with low-power CMOS OOK modulator and demodulator is presented. The 60 GHz modulator is designed in a 90-nm CMOS process. The modulator uses a current reuse technique and only consumes 14.4-mW of DC power in the on-state. The measured data rate is up to 2 Gb/s. The 60 GHz OOK demodulator is designed in a 130nm CMOS process. The demodulator consists of a gain boosting detector and a baseband amplifier, and it recovers up to 5 Gb/s while consuming low DC power of 14.7 mW. The fabricated 60 GHz modulator and demodulator are fully integrated in an LTCC SiP with 1 by 2 patch antenna. With the LTCC SiP, 648 Mb/s wireless video transmission was successfully demonstrated at wireless distance of 20-cm.

• 한국전자파학회논문지
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• 제23권11호
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• pp.1228-1238
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• 2012

본 논문에서는 RF 비아 구조를 이용하여 2가지 종류의 K-대역 CMOS FMCW 레이더 칩용 고주파 패키지를 설계, 제작 및 평가하였다. 패키지는 범용 PCB와 LTCC 공정을 이용하여 각각 제작되었다. 24 GHz를 기준으로 설계가 진행되었으며, 3차원 전자기 시뮬레이션을 통해 와이어 본딩과 RF 비아 구조의 임피던스 변화를 확인하였다. 비아 구조는 임피던스 부정합에 의한 손실을 억제하기 위해 $50{\Omega}$의 특성 임피던스를 가지도록 하였다. PCB 기반 패키지와 LTCC 패키지의 설계 검증을 위해 각 패키지의 RF 경로를 back-to-back 연결하여 시험용으로 제작하였고, 측정 결과 24 GHz에서 0.4 dB 이하의 우수한 삽입 손실을 얻었으며, 20~29 GHz 주파수 영역에서 0.5 dB 이하의 삽입 손실을 보였다. 반사 손실의 경우, 전체 주파수 영역에서 PCB 기반 패키지는 -13 dB 이하, LTCC 패키지는 -15 dB 이하의 특성이 측정되었고, back-to-back 연결의 리플 특성이 일반적으로 5 dB 정도의 반사 손실 열화를 초래하므로 패키지 자체의 RF 경로는 약 5 dB 정도 개선될 것으로 예측되었다.

• 한국재료학회지
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• 제19권7호
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• pp.349-355
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• 2009

Metal thin film patterns on a LTCC substrate, which was connected through inner via and metal paste for electrical signals, were formed by a screen printing process that used electric paste, such as silver and copper, in a conventional method. This method brought about many problems, such as non uniform thickness in printing, large line spaces, and non-clearance. As a result of these problems, it was very difficult to perform fine and high resolution for high frequency signals. In this study, the electric signal patterns were formed with the sputtered metal thin films (Ti, Cu) on an LTCC substrate that was coated with protective oxide layers, such as $TiO_2$ and $SiO_2$. These electric signal patterns' morphology, surface bonding strength, and effect on electro plating were also investigated. After putting a sold ball on the sputtered metal thin films, their adhesion strength on the LTCC substrate was also evaluated. The protective oxide layers were found to play important roles in creating a strong design for electric components and integrating circuit modules in high frequency ranges.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.259-259
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• 2008

The LTCC (Low Temperature Co-fired Ceramic) technology meets the requirements for high quality microelectronic devices and microsystems application due to a very good electrical and mechanical properties, high reliability and stability as well as possibility of making integrated three dimensional microstructures. The wet process, which has been applied to the etching of the metallic thin film on the ceramic substrate, has multi process steps such as lithography and development and uses very toxic chemicals arising the environmental problems. The other side, Plasma technology like ion beam sputtering is clean process including surface cleaning and treatment, sputtering and etching of semiconductor devices, and environmental cleanup. In this study, metallic multilayer pattern was fabricated by the ion beam etching of Ti/Pd/Cu without the lithography. In the experiment, Alumina and LTCC were used as the substrate and Ti/Pd/Cu metallic multilayer was deposited by the DC-magnetron sputtering system. After the formation of Cu/Ni/Au multilayer pattern made by the photolithography and electroplating process, the Ti/Pd/Cu multilayer was dry-etched by using the low energy-high current ion-beam etching process. Because the electroplated Au layer was the masking barrier of the etching of Ti/Pd/Cu multilayer, the additional lithography was not necessary for the etching process. Xenon ion beam which having the high sputtering yield was irradiated and was used with various ion energy and current. The metallic pattern after the etching was optically examined and analyzed. The rate and phenomenon of the etching on each metallic layer were investigated with the diverse process condition such as ion-beam acceleration energy, current density, and etching time.

• 한국세라믹학회지
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• 제44권3호
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• pp.157-161
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• 2007

Line width under $100\;{\mu}m$ with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of $30\;{\mu}m$ with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

• 한국재료학회지
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• 제16권9호
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• pp.533-537
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• 2006

The effects of binary solvent mixtures with various ratios of toluene and ethanol on the properties of slurries and green sheets were investigated. Viscosity of slurry was changed by varying the ratio of solvent mixture which affected the solubility of binder. The relative solvency behavior of a solvent mixture could be predicted with the Hildebrand solubility parameter(${\delta}$) and hydrogen bonding index( ${\gamma}$). The minimum viscosity, the best dispersion of binder, was reached at the composition of toluene:ethanol=4:6, which corresponded to our forecast. The mechanical properties of green sheets related to evaporation of solvents were influenced by the composition of the solvent mixture. At the azeotrope the skin was formed on a drying cast during the drying process because of fast evaporation. At a range of concentrations over 50wt% toluene, green sheets could not be fully dried at low temperature due to excessive toluene. The mechanical properties of green sheets were excellent at the azeotrope-like composition of toluene:ethanol=4:6 which has a little excess of toluene over the azeotrope.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.127-130
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• 2002

In this study, development of a new LTCC material using a non-glassy system was attempted with respect to reducing the fabrication process steps and cost down. Lowering the sintering temperature can be achieved by liquid phase sintering. For LTCC application, the starting material must have quality factor as high as possible in microwave frequency range. And also, the material should have a low dielectric constant for enhancing the signal propagation speed. Regarding these factors, dielectric constants of various materials were estimated by the Clausius-Mosotti equation. Among them, CaWO$_4$ was tamed out the suitable LTCC material. CaWO$_4$ can be sintered up to 98% of full density at 1200$^{\circ}C$ for 3 hours. It's measured dielectric constant, quality factor, and temperature coefficient of resonant frequency were 10.15, 62880GHz, and -27.8ppm/$^{\circ}C$, respectively. In order to modify the dielectric properties and densification temperature, 0.5∼1.5 wt% LiF were added to CaWO$_4$. LiF addition reduced the sintering temperature/time down to 800$^{\circ}C$/10∼30min due to the reactive liquid phase sintering. Dielectric constant lowered from 10.15 to 9.38 and Q x fo increased up to 92000GHz with increasing LiF content.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.628-631
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• 2003

In this paper, 2.4 GHz WLAN BPF(Band Pass Filter) using LTCC(Low temperature cofiring ceramic) multilayer technology was simulated and manufactured. A modified ${\lambda}/4$ Hair-pin resonator with shunt-to ground loaded capacitor is used to shorten resonator length and improve circuit Q factor. Proposed BPF has a combline structure. Electro-magnetic Coupling between coupled strip-line resonators is controlled to provide attenuation poles at finite frequencies. The overall size of the filter is $3.2{\times}1.6{\times}1.3mm^3$. The measured result shows good agreement with simulated data.