• 한국전자파학회지:전자파기술
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• 제12권3호
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• pp.12-24
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• 2001

최근에 이동통신 시스템의 다기능/고기능화에 따 라 여러 선진업체에서 RF부품의 모듈화 개발이 추 진되고 있으며, 이에 대응하여 LTCC를 이용한 MCM (Multi-Chip Module)적층기술의 개발이 확대되고 있 다. 이 기술은 세라믹기판 내부에 L, C, R등의 수 동소자를 3차원적으로 구성, 일체화할 수 있기 때문 에 이들 수동소자 뿐 아니라 세라믹 개별 부품으로 이용되고 있는 대역통과 여파기 및 바이어스라인, 임피던스 매칭 회로, 스트립라인등을 하나의 구조물 에 집적화 시킴으로써 제품의 소형화 및 대량생산 이 가능해진다. 본 논문에서는 LTCC를 활용한 고 집적 복합모듈 기술과 동향에 대한 개요 및 개발사례로서 적층 VCO 모듈의 제작에 대해 소개하기로 한다.

• 한국전기전자재료학회논문지
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• 제17권9호
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• pp.942-946
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• 2004

The crystalline and dielectric properties on Al$_2$O$_3$ filled glass frit (CaO-Al$_2$O$_3$-SiO$_2$-MgO-B$_2$O$_3$) with admixtures of TiO$_2$ have been investigated. The dielectric constant value of 7.5 ∼ 7.8, qualify factor value of 700 were obtained for glass frit : Al$_2$O$_3$(50 : 50 wt%) ceramics. Addition of TiO$_2$ less than 5 wt% slightly increased the dielectric constant from 7.8 to 8.8 due to higher dielectric constant of TiO$_2$. With increasing the amount of TiO$_2$ up to 5 wt%, the temperature coefficient of dielectric properties was improved. When the TiO$_2$ 5 wt% were added, dielectric properties were dielectric constant 8.8, quality factor 840 and the temperature coefficient of dielectric 45 ppm/$^{\circ}C$ at a sintering temperature 920$^{\circ}C$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.205-205
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• 2010

Recently, low temperature co-fired ceramic (LTCC) technology is widely used in sensors, actuators and microsystem fields because of its very good electrical and mechanical properties, high stability as well as possibility of making 3D micro structures. In this study, we investigated the effects of on $O_2$ annealing treatment on the electrical properties of Pb(ZrTi)$O_3$ (PZT) thin films deposited on LTCC substrate. The LTCC substrates with thickness of $400\;{\mu}m$ were fabricated by laminating 4 green tapes which consist of alumina and glass particle in an organic binder. The PZT thin films were deposited on Au / LTCC substrates by RF magnetron sputtering method. The change of the crystallization of the films were investigated under various atmosphere. The structural variation of the films were analyzed by using X-Ray diffraction (XRD) and field emission scanning electron microscopy (FESEM) and secondary ion mass spectrometry (SIMS).

• 전기전자학회논문지
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• 제27권1호
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• pp.53-58
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• 2023

본 논문에서는 차동 전력증폭기 출력단에서의 전력 결합 및 임피던스 정합을 위한 LTCC 기반의 RF 트랜스포머를 제시하였다. 기존의 인덕터와 커패시터를 이용한 정합회로 대신 회로의 면적을 덜 차지하며 직류 차단의 역할을 수행하는 트랜스포머를 LTCC 기판에 구현하고 시뮬레이션을 통해 결과를 검증하였다. 트랜스포머의 다운사이징과 결합계수의 개선을 위해 기판의 더 많은 금속층을 사용하는 트랜스포머를 구현하고 시뮬레이션을 통해 기존의 트랜스포머와 성능을 비교하였다. 3개의 금속층을 사용한 기존의 트랜스포머와 5개의 금속층을 사용한 변형된 트랜스포머를 비교한 결과 새롭게 제시한 트랜스포머가 55% 감소된 면적과 25% 증가한 결합계수를 가지며 5GHz에서 약 0.4dB의 삽입손실 개선을 확인하였다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제54권5호
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• pp.185-189
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• 2005

This paper focuses on the design for Rx/Tx switch module of GSM(global standard mobile) band, characterization of a miniature, low power and dual-band implementation of the front-end switch module with low-pass filer And the effort to make agreement between the simulated design and the measured data for these solutions takes the place through accumulated design and manufacturing data library. We present the design, modeling and measurement of switch module integrating GSM Rx/Tx switching circuit and LPF(low pass filter) on a LTCC(low temperature co-fired ceramic) substrate. For GSM application, insertion and return loss of the low pass filter designed was less than 0.3 dB which was less than 12.7 dB at 900 MHz. The LTCC switch module contained 10 embedded passives and 3 surface mount components integrated on 4.6$\times$4.8$\times$1.2 mm, 6-layer multi-layer integrated circuit. The insertion loss of switch module measured at 900 MHz was 11 dB. In both of the design approach yielded excellent agreement between measured and simulated results.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.117-117
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• 2009

Recently, low temperature co-fired ceramic (LTCC) technology has gained a remarkable application potential in sensors, actuators and microsystems fields. In this study, we investigated the effects of annealing treatment on the electrical properties of $Pb(ZrTi)O_3$ (PZT) thin films deposited on LTCC substrate. The LTCC substrates with thickness of 400 ${\mu}m$ were fabricated by laminating 12 green tapes which consist of alumina and glass particle in an organic binder. The PZT thin films were deposited on Au/LTCC substrates by RF magnetron sputtering method. Then, the change of the crystallization of the films was investigated under various annealing temperatures. The results showed that the crystallization of the films were enhanced as increasing annealing temperatures. The film, annealed at $700^{\circ}C$, 3min, was well crystallized in the ferovskite structure. The structural variation of the films were analyzed by using X-Ray diffraction (XRD) and field emmision scanning electron microscopy (FESEM).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.118-118
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• 2009

Low temperature co-fired ceramic (LTCC) is one of promising materials for MEMS structures because it has very good electrical and mechanical properties as well as possibility of making various three dimensional (3D) structures. In this work, piezoelectric pressure sensors based on hybrid LTCC technology were presented. The LTCC diaphragms with thickness of 400 um were fabricated by laminating 12 green tapes which consist of alumina and glass particle in an organic binder. The piezoelectric sensing layer consists of $Pb(ZrTi)O_3$ (PZT) thin film deposited by RF magnetron sputtering method on between top and bottom Au electrodes. The results showed that the fabrication method is very suitable for pressure sensor applications. The PZT films deposited on LTCC diaphragms were successfully grown and were analyzed by using X-ray diffraction method (XRD) and field emission scanning electron microscope (FESEM).

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 C
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• pp.1972-1975
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• 2002

In this paper, we have proposed low temperature co-fired ceramic (LTCC) based packaging for RF MEMS devices. The packaging structure is designed and evaluated with 3D full field simulation. 50 ${\Omega}$ matched coplanar waveguide(CPW) transmission line is employed as the test vehicle to evaluate the performances of the proposed package structure. The line is encapsulated with the LTCC packaging lid and connected to the via feed line. To reduce the insertion loss due to the packaging lid, the cavity with via post is formed in the packaging lid. The performances of the package structure is simulated with the different cavity depth and via-to-via length. Simulation results show that the proposed package structure has reflection loss better than 20 dB and insertion loss lower than 0.1 dB from DC to 30 GHz with the cavity depth and via-to-via length of 300 ${\mu}m$ and 350 ${\mu}m$, respectively. To realize the designed package structure, the cavity patterning is tested using the sandblast of LTCC.

• 한국분말재료학회지
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• 제25권3호
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• pp.232-239
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• 2018

In this paper, the recovery and nanoparticle synthesis of Ag from low temperature co-fired ceramic (LTCC) by-products are studied. The effect of reaction behavior on Ag leaching conditions from the LTCC by-products is confirmed. The optimum leaching conditions are determined to be: 5 M $HNO_3$, a reaction temperature of $75^{\circ}C$, and a pulp density of 50 g/L at 60 min. For the selective recovery of Ag, the [Cl]/[Ag] equivalence ratio experiment is performed using added HCl; most of the Ag (more than 99%) is recovered. The XRD and MP-AES results confirm that the powder is AgCl and that impurities are at less than 1%. Ag nanoparticles are synthesized using a chemical reduction process for recycling, $NaBH_4$ and PVP are used as reducing agents and dispersion stabilizers. UV-vis and FE-SEM results show that AgCl powder is precipitated and that Ag nanoparticles are synthesized. Ag nanoparticles of 100% Ag are obtained under the chemical reaction conditions.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2000년도 춘계학술대회 발표논문집
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• pp.145-152
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• 2000

일반적으로 제품을 개발하는 과정은 구상단계(Concept/Planning Phase), 설계 및 개발단계 (Design/Development Phase), 생산단계(Production/Manufacturing Phase)로 나누어 볼 수 있는데, 제품의 신뢰성은 거의 70∼80%가 구상단계와 설계 및 개발단계에서 결정된다. 그러므로 높은 신뢰성을 갖는 제품을 개발하기 위해서는 구상단계와 설계 및 개발단계에서부터 신뢰성을 고려하여야 한다. 본 논문에서는 D전자(주)에서 산업기술시험원과 함께 구상단계와 설계 및 개발단계에서부터 신뢰성을 고려하여 개발한 LTCC-M(Low Temperature Co-fired Ceramic on Metal) 모듈의 신뢰성설계 사례를 기술하였다. 개발과정에 있어서 신뢰성설계 절차를 제시하고, 각 단계에 있어서 수행한 분석 및 평가 내용을 구체적으로 기술하였다.