• 한국세라믹학회지
• /
• 제50권1호
• /
• pp.43-49
• /
• 2013

${\beta}$-SiC was deposited onto a graphite substrate by a LPCVD method and the effect of the crystallographic orientation on mechanical properties of the deposited SiC was investigated. The deposition was performed at $1300^{\circ}C$ in a cylindrical hot-wall LPCVD system by varying the deposition pressure and total flow rate. The texture and crystallographic orientation of the SiC were evaluated by XRD. The deposition rate increased linearly with the gas flow rate from 800 sccm to 1600 sccm. It also increased with the pressure but became saturated above a total pressure of 3.3 kPa. In the range of 3.3 - 10 kPa, the preferred orientation changed from the (220) and (311) planes to the (111) plane. The hardness and elastic modulus showed maximum values when the SiC had the (111) preferred orientation, though it gradually decreased upon a change to the (220) and (311) preferred orientations.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1991년도 추계학술대회 논문집 학회본부
• /
• pp.299-303
• /
• 1991

A lamp heated LPCVD equipment has been made. Wafer is heated by an array of fifteen tungsten halogen lamps above the front side of a wafer and pyrometer views the back side of the wafer through $CaF_2$ window. Reactor which consisits of a quartz window and a water cooled-stainless steel plate can be evacuated to $5{\times}10^{-3}$ torr with a rotary vane pump. By pyrolysis of $SiH_4$ at about $600^{\circ}C$, polysilicon has been formed on the silicon dioxide film. The measured results show that thickness nonuniformity is 15% and temperature nonuniformity is 1.1%. Because activation energy of pyrolysis of $SiH_4$ is very high, about 1.8eV, small temperature variation will induce large thickness nonuniformity. The main cause of temperature nonuniformity is unsymmetry of lamp power and an unbalanced cooling structure. Charls & Evans' SIMS result shows that the oxygen content in the deposited polysilicon is comparable to that of silicon substrate but carbon content is ten times higher.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
• /
• pp.61-61
• /
• 2003

다결정 실리콘 박막은 박막 트랜지스터와 실리콘 태양전지등에 응용되며, 비정질 실리콘을 재결정화 하여 얻어지는 다결정 실리콘 박막이 주로 이용되고 있다. 비정질 실리콘 박막을 금속 원소와 접촉시킨 상태에서 열처리할 경우 결정화 온도가 낮아지고 결정화에 필요한 열처리 시간이 짧아지게 된다. 금속을 실리콘 박막 표면에 가하는 방법은 진공증착법등으로 비정질 실리콘 박막 위에 금속원소 층을 형성하는 방법이 주로 이용되었다. 본 연구에서는 AlCl$_3$와 NiCl$_2$ 금속화합물 분위기에서 LPCVD 비정질 실리콘 박막을 열처리하여 결정화 거동을 관찰하였다. 금속화합물과 결정화할 비정질 실리콘 박막을 각각 다른 온도로 가열해 줄 수 있는 노를 이용하여 열처리를 시행하였다. AlCl$_3$와 NiCl$_2$ 분말을 혼합하여 소스로 이용한 경우 48$0^{\circ}C$ 5시간 열처리로 결정화가 완료되었으며, 박막 전체에 걸친 균일도와 재현성이 우수하였다. AlCl$_3$와 NiCl$_2$를 이용한 결정화 초기 상태에는 박막 전면에 걸쳐 등근 형태의 결정립이 균일한 핵 생성으로 나타났다. 이와 같은 결과는 Al과 Ni이 고상결정화에 동시에 작용하면서 나타난 것으로, Al이 가해진 비정질 실리콘으로 인해 결정화 속도가 빨라지고 결함이 작은 결정립을 얻을 수 있었으며, Ni로 인해 결정화의 균일성과 재현성을 높일 수 있었다.

• 한국진공학회지
• /
• 제11권1호
• /
• pp.16-21
• /
• 2002

$Si_2H_6$가스를 이용한 LPCVD내에서의 실리콘의 선택적 에피텍시 성장을 $1000^{\circ}C$ 이하의 초청정 분위기하의 저온에서 수행하였다. HCI 첨가없이 초청정 공정으로 인한 양질의 에피텍시 Si층이 균일하게 얻어 졌으며, $SiO_2$위에 증착된 실리콘의 잠복기를 발견할 수 있었다. 단결정위의 에피텍시 층은 산화물 층위 보다 더 두껍게 증착되었다. 산소첨가로 잠복기가 20~30초간 증가하였다. 증착된 박막의 절단면과 표면 형상은 SEM으로 관찰되었으며, XRD를 통해 막질을 평가하였다.

• 한국진공학회지
• /
• 제11권4호
• /
• pp.225-229
• /
• 2002

LPCVD로 $560^{\circ}C$와 $650^{\circ}C$ 온도에서 실리콘 박막을 제작하였다. 온도에 따른 천이온도를 살펴보았으며, 비정질로 제작된 실리콘 박막을 $900^{\circ}C$와 $1100^{\circ}C$에서 열처리하였다. 제작된 박막에 대해서 XRD, SEM, ellipsometer, $Tektak^3$, Tencer FLX-2320등 그 외 장비를 사용하여, 박막의 결정 방향, 표면 거칠기, 활성화 에너지, 잔류 응력 등을 조사하였다. 본 실험을 통해 $560^{\circ}C$에서 비정질로 증착시키고 $900^{\circ}C$ -$1100^{\circ}C$ 열처리 통해 얻은 다결정실리콘 박막은 처음부터 다결정으로 제작한 박막에 비해 낮은 잔류 응력과 표면 거칠기를 보였다.

• 한국세라믹학회지
• /
• 제34권8호
• /
• pp.825-833
• /
• 1997

Silicon carbide films were deposited by low pressure chemical vapor deposition(LPCVD) using MTS(CH3SICl3) in hydrogen atmosphere on (100) Si substrate. To prevent the unstable interface from being formed on the substrate, the experiments were performed through three deposition processes which were the deposition on 1) as received Si, 2) low temperature grown SiC, and 3) carbonized Si by C2H2. The microstructure of the interface between Si substrates and SiC films was observed by SEM and the adhesion between Si substrates and SiC films was measured through scratch test. The SiC films deposited on the low temperature grown SiC thin films, showed the stable interfacial structures. The interface of the SiC films deposited on carbonized Si, however, was more stable and showed better adhesion than the others. In the case of the low temperature growth process, the optimum condition was 120$0^{\circ}C$ on carbonized Si by 3% C2H2, at 105$0^{\circ}C$, 5 torr, 10 min, showed the most stable interface. As a result of XRD analysis, it was observed that the preferred orientation of (200) plane was increased with Si carbonization. On the basis of the experimental results, the models of defect formation in the process of each deposition were compared.

• Transactions on Electrical and Electronic Materials
• /
• 제9권3호
• /
• pp.101-104
• /
• 2008

The electrical properties and microstructure of nitrogen-doped poly 3C-SiC films were studied according to different thickness. Poly 3C-SiC films were deposited by LPCVD(low pressure chemical vapor deposition) at $900^{\circ}C$ and 4 Torr using $SiH_2Cl_2$ (100 %, 35 sccm) and $C_2H_2$ (5 % in $H_2$, 180 sccm) as the Si and C precursors, and $NH_3$ (5 % in $H_2$, 64 sccm) as the dopant source gas. The resistivity of the 3C-SiC films with $1,530{\AA}$ of thickness was $32.7{\Omega}-cm$ and decreased to $0.0129{\Omega}-cm$ at $16,963{\AA}$. In XRD spectra, 3C-SiC is so highly oriented along the (1 1 1) plane at $2{\theta}=35.7^{\circ}$ that other peaks corresponding to SiC orientations are not presented. The measurement of resistance variations according to different thickness were carried out in the $25^{\circ}C$ to $350^{\circ}C$ temperature range. While the size of resistance variation decreases with increasing the films thickness, the linearity of resistance variation improved.

• 한국전기전자재료학회논문지
• /
• 제12권1호
• /
• pp.18-26
• /
• 1999

In this study, the undoped amorphous layers and phosphorus doped amorphous layers are fabricated using LPCVD at 531$^{\circ}C$ with SiH$_4$ gas or at same temperature with PH$_3$ gas during deposition, respectively. The thickness of deposited amorphous layer from this experiments was 5000 ${\AA}$. In this experiments, undoped amorphous layers are deposited with SiH$_4$and Si$_2$H$\_$6/ gas in a low pressure reactor using LPCVD. These amorphous layers can be doped for poly-silicon by phosphorus ion implantation. The experiments of this study are carried out by phosphorus ion implantation with energy 40 keV into P doped and undoped amorphous silicon layers. The distribution of phosphorus profiles are measured by SIMS(Cameca 6f). Recoiling effects and two dimensional profiles are also explained by comparisions of experimental and simulated data. Finally range moments of SIMS profiles are calculated and compared with simulation results.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 1994년도 추계 학술발표 강연 및 논문 개요집
• /
• pp.31-31
• /
• 1994

• 전자통신동향분석
• /
• 제2권4호
• /
• pp.51-68
• /
• 1987