• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2009년도 하계학술발표대회 논문집
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• pp.1379-1384
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• 2009

High power light emitting diode(LEDs), a strong candidate for the next generation general illumination applications are of interest. With major advantages of power saving, increased life expectancy and faster response time over traditional incandescent bulb, the LEDs are rapidly taking over many applications such as LCD backlighting, traffic light, automotive lighting, signage, etc. The increased electrical currents used to drive the LEDs have focused more attention on the thermal management because the efficiency and reliability of the solid-state lighting devices strongly depend on successful thermal management. There exist some problems that are caused by heat generation in the LED package, such as wire breakage, yellowing of epoxy resin, lifted chip caused by reflow of thermal paste chip attach and interfacial separation between LED package and silicon resin. The goal of this study is to analyze high power LED thermal properties of using pulsating heat pipe.

• 한국에너지공학회:학술대회논문집
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• 한국에너지공학회 2004년도 추계 학술발표회 논문집
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• pp.257-262
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• 2004

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.315-316
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• 2009

본 논문에서는 1W 급 이상의 고출력 LED 용 패키지로서 세라믹 LTCC 적층 패키지의 방열 특성을 평가하고 열해석 결과와의 차이에 대해 고찰하였다. 특히, 세라믹 패키지의 방열 특성을 향상시키기 위해 Thermal Via와 Heat slug를 LED Chip 하단부에 위치시켰을 때 방열 특성을 평가하기 위해 Transient Thermal Test를 이용하여 각각의 경우에 대한 열저항을 평가하여 방열 특성의 항상 정도를 확인하였으며, 열해석 시뮬레이션을 통해 얻은 결과와 비교하였다. 평가 결과 Heat slug를 배치한 패키지가 열저항이 $8^{\circ}C/W$로서 가장 우수한 특성을 보여주었으며, 열해석 결과와의 차이에 대해서는 광출력으로 방출된 전력을 계산하여 보정함으로써 $1^{\circ}C$ 이하의 편차를 보여주는 결과를 얻을 수 있었다.

• 반도체디스플레이기술학회지
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• 제18권1호
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• pp.10-14
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• 2019

In this study, we synthesized two $Y_3Al_5O_{12}:Ce^{3+}$ phosphors ($7{\mu}m$-sized and $2{\mu}m$-sized YAG) with different sizes by controlling particles sizes of starting materials of the phosphors for white LED. In the smaller one ($2{\mu}m$-sized YAG), its photoluminescence intensity in the reflective mode was 63 % that of the bigger one ($7{\mu}m$-sized YAG); the quantum efficiencies were 93 % and 70 % for the smaller and the bigger ones. Two kinds of white LED packages with the same color coordinates were fabricated with a blue package (chip size $53{\times}30$) and two phosphors. The luminous flux of the white LED package with the smaller YAG phosphor was 92 % of that with the bigger one, indicating that the quantum efficiency of phosphor dispersed inside LED package was higher than that of the pure powder. It was consistently confirmed by the optical simulation (LightTools 6.3). It is notable according to the optical simulation that the white LED with the smaller phosphor showed 24 % higher luminous efficiency. If the smaller one had the same quantum efficiency as the bigger one (~93 %). Therefore, it can be suggested that the higher luminous efficiency of white LED can be possible by reducing the particle size of the phosphor along with maintaining its similar quantum efficiency.

• 조명전기설비학회논문지
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• 제27권4호
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• pp.1-7
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• 2013

Optical characteristics including the view angle and color temperature uniformity of LED packages with an integrated lens fabricated by compression molding method are investigated according to lens shape, lens materials, and phosphor coating methods. Four types of lens shape are designed and their optical output power dependence on the refractive index of silicone encapsulant are evaluated. Also, spatial color temperature uniformities of packages fabricated with different phosphor coating methods-direct coating on a chip vs. uniformly mixed with silicone encapsulant- are compared at various view angles. As the result, it is found that phosphor coating method is more effective on color temperature uniformity than lens shape. The maximum color temperature difference of a package with direct coating of phosphor on a chip is 1,340K according to the view angle at the color temperature of 5,000K, and that of a package with uniformly mixed phosphor is 250K, which indicates 1,090K improvement of color uniformity for the latter case.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.1163-1164
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• 2011

• 한국생산제조학회지
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• 제23권6호
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• pp.609-617
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• 2014

We have studied a chip-on-board LED lighting optical system for various luminous-intensity-distribution angles of the LED. An optical system that can accept different LEDs was made to reduce the systems's weight and size as we selected the chip-on-board LED, which is easy to apply to optical systems, unlike existing package-on-board LEDs. The luminous-intensity-distribution angles were $45^{\circ}$, $60^{\circ}$, $90^{\circ}$, and $120^{\circ}$. We researched these four types of optical systems. The $45^{\circ}$ and $60^{\circ}$ units were developed into reflectors, and the $90^{\circ}$ and $120^{\circ}$ units, into lenses. We checked the performance of the designed optical system through simulation and made a mock-up. Then we made a prototype of the chip-on-board LED high bay for use with the mock-up. After measuring its performance, we tested the luminous-intensity-distribution angles and compared them with simulation data. The resulting prototype was developed considering brightness, light uniformity, age, and economics which are suitable for a factory environment.

• 한국전기전자재료학회논문지
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• 제26권2호
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• pp.158-163
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• 2013

In this paper, thermal analysis of heatsink for 30 W class Chip-on-Board (COB) LED light source is performed by using SolidWorks Flow Simulation package. In order to increase the convection heat transfer, number of fin and shape of the heatsink is optimized. Furthermore, a copper spread is applied between the COB LED light source and the heatsink to mitigate the heat concentration on the heatsink. With the copper spread, the junction temperature between the COB LED light source and the heatsink is $50.9^{\circ}C$, which is $5.4^{\circ}C$ lower than the heatsink without the copper spread. Due to the improvement of the junction temperature, the light output is improved by 5.8% when the LED light source is stabilized. The temperature difference between the simulation and measured result of the heatsink with the copper spread is within $2^{\circ}C$, which verifies the validity of the thermal design method using a simulation package.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.480-481
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• 2012

LED (Light Emitting Diode)는 친환경적이며 고수명 등의 여러 장점을 가지고 있어서 액정디스플레이의 광원으로 널리 사용되고 있다. 그러나 LED 제품을 제조하기 위해서는 칩, 패키지, 모듈, 시스템으로 구성된 4단계의 복잡한 제조공정을 거쳐야 하므로 가격이 높은 단점이 있다. 이를 개선하기 위해서 패키지, 모듈, 시스템의 3단계의 공정을 하나로 통합한 hybrid LED package(HLP) 개념이 제시되었다. HLP는 LED chip을 PCB에 직접 실장한 뒤 초정밀 가공 및 성형 기술을 활용하여 일체형 광학패턴을 인가함으로써 공정을 단순화하면서도 광효율을 향상시킬 수 있다. 이에 본 연구에서는 다구찌 실험계획법을 사용하여 디스플레이에서 중요시되는 휘도를 높일 수 있는 일체형광학패턴 형상 최적화를 실시하였으며, 최적화된 일체형 광학패턴을 제조하기 위한 초정밀 가공 및 성형기술을 개발하였다. 최적화 결과 높이 25um, 꼭지각 90도의 음각형태의 사각피라미드 패턴이 최적형상으로 결정되었으며, 패턴이 없을 때와 비교하여 휘도가 약 32.3% 높아지는 것으로 나타났다. 이러한 일체형 광학패턴을 제품으로 구현하기 위하여 초정밀 절삭기술을 활용하여 마스터 금형을 제작하였다. 최종적으로 사출성형을 통해 일체형 광학패턴을 제작하게 되는데 이때 사출기 내부 공기흐름 및 진공도를 최적화함으로써 패턴 내부에 불필요한 기포가 발생하지 않도록 하는데 성공하였다. 이를 통해 생산성이 높은 사출성형으로 HLP 제품을 양산할 수 있는 가능성을 확인하였고, 추후에는 실제 제품을 제작하는 연구를 수행할 예정이다.

• Journal of Information Display
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• 제10권2호
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• pp.49-53
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• 2009

In this study, a very small LED packaging lead frame with a low thermal resistance was developed. The cost of the package process was reduced by the use of many small LED lamps, which increased the light emission efficiency. Compared to the large lead frame lamp, however, the optical property of the small LED packaging lead frame lamp was not sufficiently improved because its reflection structure was changed and its reflection area was reduced. The luminous efficiency of the LED lamp reaches 58 lm/W at the current density of 0.16 A/$cm^2$. Using the LED lamps, 46-inch LCD BLU was manufactured. The BLU-made LED lamps have a low power consumption of 146 W and have a slim (10-mm-thick) BLU, keeping good uniformity in terms of brightness, and maintaining good thermal properties.