• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.25 no.11
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• pp.26-32
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• 2011

In this study, a standard illuminant A type LED that has similar emission spectrum as the standard illuminant A was developed using LED chip(emission peak: 405[nm]) and four types of phosphors(blue, green orangered and red). Using the design of experiment for spectrum control, the trend of the change of spectrum shape influenced by the change of interaction among phosphors and their density could be examined. Computer simulation through the optimization of the design of experiment revealed that, among four phosphors, the most influential one on the shape of the spectrum was green phosphor. Using the obtained optimal combination ratio of the four phosphors, an alternative LED illuminant to the actual standard illuminant A was developed and the spectrums of these two were confirmed identical. Using this standard illuminant A type LED, a portable transmittance meter with the range of measurement error of ${\pm}1.0$[%] was developed.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.11
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• pp.2043-2047
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• 2010

This study is to solve problems of depletion of RF bandwidth frequency, confusion possibility, security that current wireless communications system have and is to confirm possibility of applying next generation network. To solve problems of current wireless communications system, visible light communications system for power line communications using ATmega16 Microcontroller is was realized and receiver property was analyzed. PLC exclusive chip APLC-485MA, Microcontroller ATmega16, 5pi bulb type LED and high flux LED, visible light receiving sensor LLS08-A1 were used for transmitter and receiver. Performance was analyzed by designed program and an oscilloscope. It was showed average 20% improved receiver rate rather than bulb type LED in the case of high flux LED through voltage change rate on communication distance and LED type of distance between 10 to 50 cm. The blue LED showed the best performance among measured LED types with above 10% of voltage decreasing rate. But As it gradually becomes more distant, the precise date was difficult to obtain due to weak light. To overcome these sort of problems, specific values such as changing conditions and efficiency value relevant to light emitting parts and visible light receiving sensor should be calculated and continuous study and improvements should also be accomplished for the better communications condition.

• Journal of Satellite, Information and Communications
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• v.7 no.2
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• pp.54-58
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• 2012

In this paper, we implemented total monitoring system in which LED light turned on only when user detected and LED light turned out only when user disappeared. This system is composed of two modules, one is HW board based on Micro Controller and the other is SW control system based on Web server. Micro controller board is based on ATMega2560 chip which is connected with Infra Red and Ultra sonic sensors. Web based monitoring system was designed can be used in smart device. The validity of this monitoring system was proved by integration test of two modules.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.6
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• pp.563-569
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• 2023

Micro light-emitting diodes (LEDs), with a chip size of 100 micrometers or less, have attracted significant attention in flexible displays, augmented reality/virtual reality (AR/VR), and bio-medical applications as next-generation light sources due to their outstanding electrical, optical, and mechanical performance. In the realm of bio-medical devices, it is crucial to transfer tiny micro LED chips onto desired flexible substrates with low precision errors, high speed, and high yield for practical applications on various parts of the human body, including someone's face and organs. This paper aims to introduce a fabrication process for flexible micro LED devices and propose micro LED transfer techniques for cosmetic and medical applications. Flexible micro LED technology holds promise for treating skin disorders, cancers, and neurological diseases.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.907-910
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• 2003

We have developed Logic Design Training Kit for studying, actual training, designing of FPGA(Xillinx) or CPLD(ALTERA CPLD), the Digital Logic Device. This training kit has 12 matrix keys, RS232 port for serial communication and uses LED array. six FND(Dynamic), LCD as display part. That is standard specification for digital logic training kit. Special point of this kit is that we make two logic device trainig kit. This two logic device kit have more smaller and simple architecture because only uses one chip. That chip already includes a lot of functions that need for training kit, such as : complex logic circuit needed the two kind of logic devices, 16 way of system clock deviding function, serial communication interrupt....etc. We called that one chip is Center Bridge Chipset ; Xillinx FPGA Spartan2. User can select between using one device of FPGA or CPLD, or uses both them. Because of, Center Bridge Chipset has profitable architecture. it can work as Logic Device's networking with Master-Slave connection When using both logic devices.

• Journal of information and communication convergence engineering
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• v.19 no.3
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• pp.175-179
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• 2021

Enhancing the reliability of the system is important for recent system-on-chip (SoC) designs. This importance has led to studies on fault diagnosis and tolerance. Fault-injection (FI) techniques are widely used to measure the fault-tolerance capabilities of resilient systems. FI techniques suffer from limitations in relation to environmental conditions and system features. Moreover, a hardware-based FI can cause permanent damage to the target system, because the actual circuit cannot be restored. Accordingly, we propose a simulation-based FI framework based on the Verilog Procedural Interface for measuring the failure rates of SoCs caused by soft errors. We execute five benchmark programs using an ARM Cortex M0 processor and inject soft errors using the proposed framework. The experiment has a 95% confidence level with a ±2.53% error, and confirms the reliability and feasibility of using proposed framework for fault analysis in SoCs.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.9
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• pp.2003-2008
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• 2012

A drive system is necessary to operate LED by an LED illumination system. Because Switched Mode Power Supply (SMPS) is higher in efficiency in the large capacity than Linear Regulator, it is used mainly and controls this in an analog form or digital method. A MCU and a DSP of the digital control central processing unit were higher in a unit price than existing analog control chip, so that an approach was not easy for application of SMPS. But it can take the earnings by it lets you integrate various digital control features like an LED illumination system in one MCU, and realizing a whole system. In this paper, we suggest the algorithm that can improve LED driving current in applying such a digital control method using low-priced type MCU.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.2
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• pp.158-163
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• 2013

In this paper, thermal analysis of heatsink for 30 W class Chip-on-Board (COB) LED light source is performed by using SolidWorks Flow Simulation package. In order to increase the convection heat transfer, number of fin and shape of the heatsink is optimized. Furthermore, a copper spread is applied between the COB LED light source and the heatsink to mitigate the heat concentration on the heatsink. With the copper spread, the junction temperature between the COB LED light source and the heatsink is $50.9^{\circ}C$, which is $5.4^{\circ}C$ lower than the heatsink without the copper spread. Due to the improvement of the junction temperature, the light output is improved by 5.8% when the LED light source is stabilized. The temperature difference between the simulation and measured result of the heatsink with the copper spread is within $2^{\circ}C$, which verifies the validity of the thermal design method using a simulation package.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.480-481
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• 2012

LED (Light Emitting Diode)는 친환경적이며 고수명 등의 여러 장점을 가지고 있어서 액정디스플레이의 광원으로 널리 사용되고 있다. 그러나 LED 제품을 제조하기 위해서는 칩, 패키지, 모듈, 시스템으로 구성된 4단계의 복잡한 제조공정을 거쳐야 하므로 가격이 높은 단점이 있다. 이를 개선하기 위해서 패키지, 모듈, 시스템의 3단계의 공정을 하나로 통합한 hybrid LED package(HLP) 개념이 제시되었다. HLP는 LED chip을 PCB에 직접 실장한 뒤 초정밀 가공 및 성형 기술을 활용하여 일체형 광학패턴을 인가함으로써 공정을 단순화하면서도 광효율을 향상시킬 수 있다. 이에 본 연구에서는 다구찌 실험계획법을 사용하여 디스플레이에서 중요시되는 휘도를 높일 수 있는 일체형광학패턴 형상 최적화를 실시하였으며, 최적화된 일체형 광학패턴을 제조하기 위한 초정밀 가공 및 성형기술을 개발하였다. 최적화 결과 높이 25um, 꼭지각 90도의 음각형태의 사각피라미드 패턴이 최적형상으로 결정되었으며, 패턴이 없을 때와 비교하여 휘도가 약 32.3% 높아지는 것으로 나타났다. 이러한 일체형 광학패턴을 제품으로 구현하기 위하여 초정밀 절삭기술을 활용하여 마스터 금형을 제작하였다. 최종적으로 사출성형을 통해 일체형 광학패턴을 제작하게 되는데 이때 사출기 내부 공기흐름 및 진공도를 최적화함으로써 패턴 내부에 불필요한 기포가 발생하지 않도록 하는데 성공하였다. 이를 통해 생산성이 높은 사출성형으로 HLP 제품을 양산할 수 있는 가능성을 확인하였고, 추후에는 실제 제품을 제작하는 연구를 수행할 예정이다.

• Bulletin of the Korean Chemical Society
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• v.28 no.8
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• pp.1280-1284
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• 2007

A series of Ca1-xSrxS:Eu (x = 0.0, 0.2, 0.4, 0.6, 0.8, 1.0) phosphors were synthesized by solid-state reactions. The Ca1-xSrxS:Eu phosphors have a strong absorption at 455 nm, which corresponds to the emission wavelength of a blue LED. The emission peak of Ca1-xSrxS:Eu is blue shifted from 655 to 618 nm with increasing Sr content. The characteristics of Ca1-xSrxS:Eu phosphors make them suitable for use as wavelengthtunable red-emitting phosphors for three-band white LEDs pumped by a blue LED. In support of this, we fabricated a three-band white LED by coating SrGa2S4:Eu and Ca0.6Sr0.4S:Eu phosphors onto a blue LED chip, and characterized its optical properties.