• Electrical & Electronic Materials
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• v.25 no.9
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• pp.15-23
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• 2012

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1722-1723
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• 2011

LED는 광학적 특성을 유지하기 위해서는 방열설계가 매우 중요한 문제로 요구된다. 대부분의 반도체 소자의 고장 원인은 85%정도가 열로 인한 것이며 고출력 LED의 인가된 에너지는 20%정도가 광으로 출력되며 나머지 80%정도가 열로 전환된다. 이러한 이유 때문에 LED소자의 신뢰성과 효율 향상을 위한 방열성능의 극대화가 필요하다. 본 연구에서는 AI MCPCB 기판에 기반을 둔 COB Type의 고출력 LED모듈의 구조를 제안 하였으며, LED Chip과 금속base 사이의 절연층 유무의 관점에서의 비교 열 시뮬레이션을 통해 결과를 분석하여 고출력 COB LED모듈의 방열 특성을 최적화 하였다.

• Journal of Industrial Technology
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• v.32 no.A
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• pp.103-107
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• 2012

Due to improvement of the semiconductor technology, the LED replaces the conventional lighting source and LED drivers have been studied and developed. The LED is driven by the constant current control method according to its characteristics. For the constant current control method, the linear regulator and the switching regulator is used. The switching regulator is usually used to LED drivers because it has specific characteristics as the wide input dynamic range and the high efficiency. In this paper, we have described the principle and the implement of the switching regulator, using the drive IC and the low cost DSP chip. Also, both methods have been implemented and its electrical characteristics had almost same experimental results in the steady state and the transient state.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.71-71
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• 2009

Recently several LCD TV makers including Samsung, LG and Sony actively have released LED LCD TV models on market. LED LCD TV is just which applied LED BLUs so that its color contrast ratio fairly enhance up to 1 million:1 and its thickness minimize to a few mm. Even this aspect seems somewhat to be each panel maker's strategies for prior market occupations on whole TV market. Without regard to the reasons, we do obviously meet a new era of technically advanced LCD TV. However we have still lots of problems or issues which we must overcome technically including LED chip/packaging process, secondary optics treatment, heat managements and cost reduction issues. Here I would like to forecast market volume and trend of LED LCD TV first and then discuss above almost of technical issues and suggest their possible solutions. Even these solutions looks better technologies and if they may increase production cost significantly, we will not prefer to choice that technology since lower cost policy can open the market. Finally I'm trying to suggest how well LED, as future light source, can apply to future LCD TV technologies.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.341-344
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• 2006

LED chips are produced by cutting the sapphire on which GaN is evaporated. To cut the sapphire wafer into each LED chip, at first the wafer is scribed by diamond tool. To get the sharp groove shape for the nice cutting plane it is important the diamond tool shape, load, etc when the wafer is scribed. Here we tried to simulate the scribing process and get the scribing condition to reduce the wear rate of diamond tool for the sharp groove shape.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1163-1164
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• 2011

• Journal of the Korean Society of Marine Environment & Safety
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• v.16 no.2
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• pp.235-240
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• 2010

In order to substitute incandescent lamps, a power supply device for 7W class LED lamps which are environmentally friendly and energy saving is designed LED lamps consist of a multitude of chip LED connected in parallel and series. 11ms it is necessary to supply LED lamps with DC voltage and current. However, when LED lamps are in use, they are connected directly to AC 220V. This is why we need to have AC/DC, DC/DC power converters including a control system of voltage and current. For this, a transformerless and simple LED lamp driver is designed 조ich can control the current and output voltage for LED string of LED lamp.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.1
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• pp.35-38
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• 2015

LEDs are considered to be an alternative for enhancement of energy efficiency, applied for numerous areas such as display, automotive headlight not only lights. Yellow phosphor is generally utilized with blue LEDs to generate WLED, $Y_3Al_{5}O_{12}:Ce^{3+}$ is typically used as the yellow phosphor. The phosphor, mixed with epoxy resin, has been used by being spread and hardened on the blue LED chip. This paste-based packaging gives rise to problems of degradation of phosphor by heat and decrease of luminous efficiency. Although phosphor plate is used instead of the epoxy-phosphor mixture to solve these problems, loss of luminous efficacy by total internal reflection inside the plate also should be solved. In this study, we coated the side of the plate with silver as one of the solution.

• Journal of Information Display
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• v.13 no.1
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• pp.1-6
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• 2012

Decreasing the thermal resistance is the critical issue for high-brightness light-emitting diodes. In this paper, the effects of some design factors, such as chip size (24 and 35 mil), substrate material (AlN and high-temperature co-fired ceramic), and die-attach material (Ag epoxy and PbSn solder), on the thermal-dissipation characteristics were investigated. Using the thermal transient method, the temperature sensitivity parameter, $R_{th}$ (thermal resistance), and junction temperature were estimated. The 35-mil chip showed better thermal dissipation, leading to lower thermal resistance and lower junction temperature, owing to its smaller heat source density compared with that of the 24-mil chip. By adopting an AlN substrate and a PbSn solder, which have higher thermal conductivity, the thermal resistance of the 24-mil chip can be decreased and can be made the same as that of the 35-mil chip.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.24 no.5
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• pp.1-7
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• 2010

LEDs, compared to conventional light sources, have many advantages and their applications are rapidly expanding, especially in areas such as back-lights for LCD. In this paper, we propose a new LED lamp structure suitable for applications requiring a low power. In the proposed LED lamp structures, LED chips are mounted on a transparent polycarbonate plate, and thus photons are transmitted through the both sides of the plate. The copper layer deposited on the polycarbonate plate is patterned to form circuit patten and the chip mount pad, on which LED chips are mounted. We speculate that our proposed LED lamp structures may be used as a type of plate light source.