• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.1
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• pp.124-133
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• 2017

In the current lighting market, LEDs that have a high luminous efficiency, a long life and consume less power have emerged as next generation lighting. Owing to various designs and sizes of LEDs, the production process of existing LEDs involves many tasks that require manual labor; hence, the assembly of LEDs necessitates manpower. Because of the use of manpower, the production costs of LEDs increases and production efficiency decreases. Recently, the assembly parts of LEDs have been standardized for minimizing manual labor, and an LED is developed as an LED panel. The automatic assembly system produces LED convergent lighting by assembling two LED panels and one diffusion cover. To increase the production efficiency of the LED convergent lighting module, it is important that the development of a feeder can continuously supply the LED panels is required, and whose design has sufficient stability. The automatic assembly system of the LED convergent lighting module consists of two feeders, which convey LED panels and diffusion covers to a main conveyor, which assembles the lifted panels and covers. In this study, structural analysis and fatigue life for forced loads on the conveyer line of the feeder in the process of lifting LED panels and diffusion covers of each feeder, is analyzed. In addition, the drive of the belt constituting the conveyor line of each feeder is simulated, and the dynamic characteristics of the belt is analyzed using the virtual engineering method.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.7
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• pp.1391-1395
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• 2011

In this paper, would implement a transceiver for the visible light communication that based on wireless communication driving technology for LED illumination-based infrared ray communication, and measurement analyzed a design error rate of a transceiver variable rate has made about distance change -2.5m. The error rate measured a voltage variable along illuminate change between switchable circumstances, which has illuminated insight and outright. Each analyzed and measurement on the communication distance errors along the differences of disturbance light between night and days. The LED module has implemented for number of 6 through illumination dimming in case of different values. Also, implementation for the system module of a VLC transceiver based on the infrared sensors which used feedback outcome value has analyzed with error rate.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2006.05a
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• pp.20-24
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• 2006

In this paper we investigated the method of examining the accelerated life test on LED traffic signal module by the temperature. The longevity presumption of the LED type signal light by a general heat cycle test used and executed cycle when it was done to longevity by the heat cycle test number and the acceleration factor of a real system requirements of this heat cycle test. Therefore, it reports on the introduction of the acceleration type from which the LED traffic signal module is done here to clarify the above-mentioned acceleration factor with the object and the acceleration factor is requested the test atmosphere actually in the system requirements.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.13-16
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• 2013

A lot of various researches have been going on to use heat spreader for LED module. Nano porous aluminum anodic oxide (AAO) applied LED, which is produced from anodization, is easy and economically advantageous. Convensional LED module is consist of aluminum/adhesive/copper circuit. The polymer adhesive in this module is used as heat spreader. However the thermal emission of LED component is degraded because of low heat conductivity of polymer and also reliability of LED component is reduced. Therefore, AAO in this work was applied to heat spreader of LED module which has higher heat conductivity compare to polymer. Bonding strength between AAO and copper circuit was improved with Ti/Cu seed layer by copper sputtering process (DBC) before the bonding. And this copper circuit has been fabricated by electro plating method. Peel strength of AAO and copper circuit in this work showed range between 1.18~1.45 kgf/cm with anodizing process which is very suitable for high power LED application.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.8
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• pp.1-6
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• 2015

In this paper, we propose the LED(Light-Emitting-Diode) emergency lighting in a tunnel by using the thermoelectric devices. To achieve high generated power, thermoelectric device should be have high Seebeck coefficient and small contact area. Also, we reveal that a moderate heatsink required for high generated power. From the waste heat of LED tunnel lighting module (25W), the generated power was 0.062W by thermoelectric device, and it could illuminate for 1hour after charge the battery of emergency lighting during about 101hours.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.7
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• pp.1484-1488
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• 2009

This thesis is about Heat-sink design which is considered as the biggest problems for commercialization of LED lighting and suggests how to solve the problems though analysis on heat-sink using COMSOL. The temperature difference after simulation value and modelling was $10^{\circ}C$by Transient analysis of Heat Transfer Module which is in the COMSOL Multiphysics. The result approximated the object which is close to actual lighting, when various elements are used according to temperature change of interior and exterior surroundings LED lighting is set up.

• Journal of the Korean Solar Energy Society
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• v.35 no.3
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• pp.81-91
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• 2015

LED has received intensive research attention due to its long life, high efficacy, fast response and wide colour availability, and has secured extensive application areas. However, LED chips within the modules convert only fraction of electric energy into light, and majority of supplied energy needs to be dissipated as heat, which challenges in the performance and life of the LED modules. IEC 62717 specifies the performance requirements for LED modules together with the test methods and conditions. The present study examined the influence of different design parameters on performance temperature through series of experiments and numerical simulations. The economic means to change the module performance temperature during the measurement of mandatory markings were suggested based on predicted cooling performances.

• Journal of IKEEE
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• v.22 no.3
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• pp.742-746
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• 2018

In this paper, we implemented a VLC(Visible Light Communication) system capable of transmitting/receiving data on a 30MHz clock based on On/Off keying modulation/demodulation. The data rate of the implemented system can be verified by functional verification of VLC channel composed of LED/photodiode driver and VLC transmitting/receiving signal of Tx/Rx platform. But, In the experimental results with the VLC transmitting/receiving for combined module, the maximum transmission rate was measured at 15 MHz. Therefore, we describe the problems that can occur when implement the VLC system using the LED module with output power of 15W or more and propose ways to improve it.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

• The Journal of the Korea Contents Association
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• v.10 no.5
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• pp.62-69
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• 2010

LCD panel need BLU(Back Light Unit) that is outside source of light because can not emit light voluntarily. BLU is used in LCD module and is used in tester that examine LCD panel's badness. Lately, BLU had changed from CCFL(Cold Cathode Fluorescent Lamp) to LED(Light-Emitting Diode) fast. CCFL need extra-high tension power and produce much heat and is difficult to keep fixed brightness. LED is few electric power wastage and keeps fixed brightness. But, BLU that is used to detector that examine the LCD module is using CCFL until recently. This paper develops LED BLU that can examine LCD panel's badness. Also, this manufactures LED BLU to 24 inch size to examine all LCD panels(12~24 inch), and develops so that LED BLU may operate according to LCD panel's size.