• 제목/요약/키워드: LED Heat Radiant

검색결과 14건 처리시간 0.031초

자동차 LED 전조등 방열판 형상에 따른 융합 연구 (Convergence Study due to the Configuration of Radiant Heat Panel of Automotive LED Heat Lamp)

  • 최계광;조재웅
    • 한국융합학회논문지
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    • 제8권3호
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    • pp.199-204
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    • 2017
  • 최근, 자동차 전조등에 할로겐 램프가 아닌 LED 전조등을 사용하고 있는 추세이다. 이 LED 전조등 내부에는 방열판이 존재한다. 방열판은 LED 수명에 지대한 역할을 하는 중요한 부품이다. 방열판은 매개물로부터 나온 열을 흡수하여 다이오드의 오버히트를 방지하는 장치이다. 본 연구에서는 LED 전조등 방열판의 형상에 따른 열전달과 열응력에 대하여 알아보았다. 본 연구 결과로서, Model 1이 Model 2에 비해 열이 더 많이 내려가고 내구성면에서도 좋은 값이 나와 내구성이 더 있었다. 이러한 기반데이터로 방열판 형상에 융합기술 적용하여 자동차 전조등에 그 미적 감각을 나타낼 수 있다.

자동차 LED Head Lamp의 방열을 위한 Heat Sink의 수치해석적 연구 (A Study on the Numerical Analysis of Heat Sink for Radiant Heat of Automotive LED Head Lamp)

  • 최병희;김창오
    • 한국산학기술학회논문지
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    • 제13권10호
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    • pp.4398-4404
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    • 2012
  • 본 논문은 자동차 LED head lamp의 방열을 위한 히트싱크(heat sink)의 설계요소를 변화시켜 방열특성을 알아보고자 수치해석을 수행하였다. 수치해석에 적용한 히트싱크는 LED를 광원으로 사용하는 기존제품(Type 1)을 바탕으로 한정된 내부공간에 적합하도록 설계하여 5가지 Type으로 설계하였다. 설계된 히트싱크의 수치해석은 ANSYS CFD V12.1을 사용하여 히트싱크의 변화에 따른 온도분포와 평균온도, 공기유동특성, 열유속 등을 분석하였다. 수치해석을 통하여 방열판의 구조와 휜 형상에 따른 방열특성의 상관관계를 도출할 수 있었으며, 설계된 히트싱크의 온도분포, 공기의 유동특성, 열유속 등을 분석한 결과, 히트싱크 Type 2가 다른 Type들에 비해 LED head lamp의 방열을 위해 적합한 특성을 나타내었다.

LED 조명등 히트싱크 형상과 배열에 따른 방열특성에 관한 연구 (A Study on the radiant Heat Characteristic According to Type and Array of LED Lighting Heatsink)

  • 장현;서정세;이중섭
    • 한국기계가공학회지
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    • 제12권3호
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    • pp.54-60
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    • 2013
  • Numerical analysis of the radiant heat characteristic around heatsink according to arrangement and shape of fin on 60W-LED lamp is conducted in this study. In the case of top blow blowing from upper side on LED lamp, there is just little difference in cooling characteristics according to the height of fin. On the other hand, the fin arranged side by side has the advantage of heat transfer enhancement by comparing with zig-zag type because it leads to more loss of flow. In case of making fin round to increase the amount of heat transfer, designing arrangement with the minimized loss of flow has the advantage of characteristic.

CFD 해석을 이용한 한국도로공사 표준 25 [W] LED 모듈의 방열 특성 분석 (Analysis of Heat Dissipation Characteristics for Standard 25 [W] LED Module of Korea Expressway Corporation: Using CFD Analysis)

  • 이세일;허인성;이아람;정민주;유영문
    • 한국전기전자재료학회논문지
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    • 제27권8호
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    • pp.541-546
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    • 2014
  • Korea Expressway Corporation established standard of LED lighting fixture in Dec. 2013. To raise compatibility, the standard requires a fixed form and it is applied to street lights and tunnel lights, etc. Because streetlight has different circumstance condition from tunnel light that is down light and exposed to constant wind velocity over height of 8 meters, in case of LED module which has the same shape, characteristic of radiant heat can be different. In this paper, we designed 25 [W] LED Module that is designated by standard of Korea Expressway Corporation and analyzed characteristics of radiant heat about natural convection and forced convection. It is dropped 10.12[$^{\circ}C$] that max temperature is decreased by increasing 20 mm of bended height of heatsink at the condition of natural convection. Radiant heat characteristic of bended height 35 mm became 78.08[$^{\circ}C$] at the condition of natural convection, 55.30[$^{\circ}C$] at the condition of forced convection so that 22.78[$^{\circ}C$] is decreased that is 29.1[%] decrease. Bended height 55mm became 67.96[$^{\circ}C$] at the condition of natural convection, 48.04[$^{\circ}C$] at the condition of forced convection so that 19.92[$^{\circ}C$] is decreased that is 29.3% decrease.

동도금 EP방열판에 의한 소형LED조명등 방열 (Heat Radiation of LED Light using eu Plating Engineering Plastic Heat Sink)

  • 조영태
    • 한국생산제조학회지
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    • 제20권1호
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    • pp.81-85
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    • 2011
  • Recently, the electronic parts are to be thinner plate, smaller size, light weight material and CPU, HDD and DRAM in all the parts have been produced on the basis of the high speed and greater capacity. Also, conventional goods have replaced a LED (Light-Emitting Diode) in lighting products so; such industry devices need to have cooling. To maximize all the performance on the heat-radiated products, the area of heat-radiated parts is required to be cooled for keeping the life time extension and performance of product up. Existing cooling systems are using radiant heat plate of aluminum, brass by extrusion molding, heat pipe or hydro-cooling system for cooling. There is a limitation for bringing the light weight of product, cost reduction, molding of the cooling system. So it is proposed that an alternative way was made for bringing to the cooling system. EP (Engineering Plastic) of low-cost ABS (Acrylonitrile butadiene styrene Resin) and PC (Polycarbonate) was coated with brass and the coating made the radiated heat go up. The performance of radiant heat plate is the similar to the existing part. We have studied experimentally on the radiated heat plate for the light-weight, molding improvement and low-cost. From now on, we are going to develop the way to replace the exiting plate with exterior surface of product as a cooling system.

CNT 열전달 물질에 의한 50W LED의 방열 성능평가 (Performance Evaluation of Heat Radiant for 50W LED by the CNT Thermal Interface Material)

  • 조영태;이충호
    • 한국기계가공학회지
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    • 제13권6호
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    • pp.23-29
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    • 2014
  • In this study, cooling and heat-transfer tests are performed to compare and evaluate the thermal conductivity in a prepared CNT TIM (thermal interface material). A polymerized CNT heat-transfer resin and commercial thermal grease (Shinetsu G-747) were applied for a comparison test in both cases. Cooling experiments with an aluminum foil specimen were performed in order to measure the temperature distribution using an infrared camera, and in heat radiation experiments, performance testing of the thermal conductivity was conducted using high-power LEDs. Carbon resin with the polymerization of graphite and carbon black, and CNT-polymerized CNT resin with graphite and carbon black were tested and compared with using G-747. It was found that the cooling performance and the heat transfer ability in both the carbon resin and the CNT-polymerized CNT resin were greater than those of G-747 because the temperature by 5. $0^{\circ}C$ in both cases appeared lower than that of the G-747.

알루미늄 합금의 복사방열향상을 위한 코팅연구 (The Study on Coatings to Improve the Radiative Heat Dissipation of Aluminum Alloy)

  • 서미희;김동현;이정훈;정원섭
    • 한국표면공학회지
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    • 제46권5호
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    • pp.208-215
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    • 2013
  • The aim of the present study was to improve the radiative heat dissipation of aluminum alloy, Al 1050. Resin/CuO coating and Cu/CuO composite plating were applied on aluminum alloy to improve the radiative heat dissipation. Resin/CuO coating was made using thermosetting silicon resin and Cu/CuO composite plating was made in pyrophosphate copper plating bath. Radiant heat flux($W/m^2$) was measured by self-produced radiant heat measurement device to compare each specimen. The cross section of specimen and chemical bonding of surface were analyzed by FE-SEM, XPS and FT-IR. As a result, radiant heat of Resin/CuO coating was higher than Cu/CuO composite plating due to the adhesion with aluminum plate and the difference in chemical bonding. But, Both of them were higher than aluminum alloy. In order to confirm the result of experiment, aluminum plate, Resin/CuO coating and Cu/CuO composite plating sample were applied LED and measured the LED temperature. As a result, LED temperature of samples were matched previous results and confirmed coated samples were lower about 10 degrees than the aluminum alloy.

사무소건물의 LED조명기구 방열장치의 성능 분석 연구 - 덕트 내 유량변화 중심으로 - (Performance of heat sinks for LED luminaires in office buildings - Focused on the variation of air flow rate in duct -)

  • 박지우;안병립;김종훈;정학근;장철용;송규동
    • KIEAE Journal
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    • 제14권6호
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    • pp.81-86
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    • 2014
  • In recent years, many researchers have considered the building energy consumption reduction accordingly to deal with abnormal climate changes and greenhouse gas reduction. However, the lighting energy use ratio has increased in spite of the development of the high efficiency lighting device. Therefore, the study aims to produce the LED lighting applications for the effective lighting heat removal by using the heat characteristics of LED lighting and analyzing the heat removal effect. In order to increase radiant heat efficiency, the heat pipe and heat sink was attached on PCB as LED lighting applications. Experiment was conducted to verify the temperature and air velocity of inside duct: thermocouples, anemometer. The heat removal effect of LED lighting applications was measured by observing the temperature of the lighting applications and the change of air velocity in duct. The experiment shows that the temperature change in the duct according to air velocity was $0.9{\sim}5.8^{\circ}C$. It is also concluded that heat removal was calculated from 33 to 81W.

열전소자를 이용한 COB LED의 열적 특성 분석에 관한 연구 (A Study on the Thermal Characteristics of COB LED using Thermoelectric Element)

  • 김효준;김태형;김용갑;황근창
    • 한국전자통신학회논문지
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    • 제9권12호
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    • pp.1435-1440
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    • 2014
  • 본 논문에서는 13.2W급 COB LED의 공랭식 방열을 위해 열전소자를 이용하여 열적 특성을 분석하였다. 기존 방식과의 방열 성능을 비교 분석하기 위하여 Heat Sink를 설계 및 제작 하였고 실험은 100분간 COB LED를 구동시켜 접촉식 온도계를 통하여 온도 분포를 측정하였다. 접합부의 온도 측정 결과 열전소자를 사용하지 않는 방식에서는 약 $75^{\circ}C$로 나타났고, 열전소자에 0.8A의 전류를 인가하여 구동하였을 때 $57^{\circ}C$로 열 응집현상이 가장 심한 COB LED 접합부분의 열은 기존의 방식보다 약 31% 감소됨을 확인하였다.

굴절률이 다른 실리콘 봉지재의 봉지 방법에 따른 UV-A LED의 광 특성에 관한 연구 (Optical Properties of UV LEDs depending on Encapsulate Method using Silicone Encapsulants with Different Refractive Indices)

  • 김완호;구대형;노주현;이경원;전시욱;김재필;여인선
    • 조명전기설비학회논문지
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    • 제29권3호
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    • pp.39-44
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    • 2015
  • Optical characteristics including the radiant flux and viewing angle of UV LEDs were investigated according to both silicone encapsulants with different refractive indexes and lens shapes. Lead frame was fabricated using the enhanced heat dissipation characteristics with a heat slug structure and the reflector based on EMC(Epoxy Mold Compound) material. Four types of lens shapes were designed and their optical characteristics depending on the refractive index of silicone encapsulants were evaluated. The maximum radiant flux can be achieved when the height of lens are 1.32mm and 1.08mm for silicone encapsulants with low and high refractive indexes, respectively. Depending on the encapsulating method, the viewing angle changes from $148.9^{\circ}$ to $130.2^{\circ}$ for low refractive index and from $145.3^{\circ}$ to $136.8^{\circ}$ for high refractive index. As a result, it is found that the optical characteristics of UV LEDs can be controled through both encapsulating method and the refractive index of encapsulants.