• Title/Summary/Keyword: LED 방열

Search Result 174, Processing Time 0.028 seconds

Low Temperature Co-firing of Camber-free Ceramic-metal Based LED Array Package (세라믹-금속 기반 LED 어레이 패키지의 저온동시소성시 휨발생 억제 연구)

  • Heo, Yu Jin;Kim, Hyo Tae
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.23 no.4
    • /
    • pp.35-41
    • /
    • 2016

  • Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

  • https://doi.org/10.6117/kmeps.2016.23.4.035 인용 PDF KSCI

A Comparative Analysis of Thermal Properties of COB LED based on Thermoelectric Device Structure (열전소자 구조에 따른 COB LED의 방열 성능 비교 분석)

  • Kim, Hyo-Jun;Kang, Eun-Yeong;Im, Seong-Bin;Hoang, Geun-Chang;Kim, Yong-Kab
    • The Journal of the Institute of Internet, Broadcasting and Communication
    • /
    • v.15 no.2
    • /
    • pp.189-194
    • /
    • 2015

  • In this study, the heat radiation performance of COB LED according to the structure of thermoelectric device were compared. Thermoelectric device of the sheet copper structure and ceramic structure were used for bonding with the heating part of the COB LED. The temperature distribution in the bonding part of the thermoelectric device of COB LED was measured with a contact-type thermometer. The temperature variation of the thermoelectric device was measured by inputting the currents of 0.1A, 0.3A, 0.5A, and 0.7A. When 0.7A was applied, the temperature of the bonding part where there was a heat aggregation phenomenon of the COB LED was $59^{\circ}C$ for thermoelectric device of the sheet copper structure and $67^{\circ}C$ for the thermoelectric device of the ceramic structure. Therefore, the sheet copper thermoelectric device whose temperature was lower by $9^{\circ}C$ showed better heat radiation performance than those of the ceramic structure.

  • https://doi.org/10.7236/JIIBC.2015.15.2.189 인용 PDF KSCI

Development Trend of Element Technology for Shipboard LED Light Production (선박용 LED 조명등 제작을 위한 요소기술 개발동향)

  • Nam, Dae-Geun;Lee, Su-Hyung;Jung, Chang-Il;Yoon, Hyung-Pyo;Jo, Hyung-Ho
    • 한국신재생에너지학회:학술대회논문집
    • /
    • 2010.11a
    • /
    • pp.164.1-164.1
    • /
    • 2010

  • 최근 에너지 절감과 환경 문제에 대한 관심이 커지면서 친환경적이고 에너지 효율이 높은 LED에 대한 관심이 대두되고 있으며, 국가 저탄소 녹색성장에 맞는 신성장동력산업의 하나로 LED가 선정되어 적극적으로 육성되고 있다. LED를 활용한 조명등은 현재까지 활발한 연구개발이 진행되었으며 백열전구를 능가하는 조명 효율을 확보하여 조명 광원으로서 이용되고 있다. 그런데 선박용 조명등의 경우에는 아직 관련 기술개발이 초기단계에 머물러있어 대부분의 선박들이 기존의 백열등 및 형광등과 같은 조명등을 사용하고 있다. 이러한 유리 조명등은 고소비전력과 제한된 수명에 따른 높은 유지비 및 제품 누수나 파손 등과 같은 안전성의 문제가 있다. 이에 따라 장기적인 관점에서 선박용 LED 조명 등에 대한 기술 개발이 필요할 것으로 보이며 기술 개발을 저해하는 요소인 방열, 가격 등에 대한 추가적인 기술개발이 뒷받침 되어야 할 것으로 보인다. 한국생산기술연구원에서는 부산광역시 지원사업의 일환으로 선박용 LED 조명등을 개발하고 있으며, 체계적인 연구를 위하여 선박용 LED 조명등의 요소기술에 대한 연구동향과 기술특성을 분석하고 있다. 본 논문에서는 선박용 LED 조명등 개발에서 요구되는 요소기술에 대한 기술개발동향을 살펴보고자 한다. 고효율의 선박용 LED 조명등 개발에 필요한 요소기술로는 방열, SMPS, 광학, 제품 내진동, 제품 방수 등의 설계 및 제작기술이 있다. 이러한 요소기술을 알아보고 선박용 LED 조명등 개발의 방향을 제시하고자 한다.

  • PDF

A Basic Study on the Application of Composite Materials for the Light-weight LED Beacon (LED 등명기 경량화를 위한 복합재료 적용 기초 연구)

  • Yoo, Seong-Hwan;Shin, Kyung-Ho;Lee, Donghee
    • Composites Research
    • /
    • v.28 no.5
    • /
    • pp.322-326
    • /
    • 2015

  • We developed the high-power LED beacon and investigated the applicability of composite materials for the light-weight design of LED beacon. By means of the application of composite materials, the vertical deformation could be reduced by 17% and the total weight of LED beacon 8.9 kg comparable to 20% light-weighting against aluminum beacon. In thermal radiation test, the maximum temperature of LED package was measured to $63.5^{\circ}C$ under ambient temperature ($20^{\circ}C$), which is acceptable considering both performance and lifespan of LED packages. In this study, the applicability of composite materials was demonstrated for light-weight design of high-power LED beacon.

  • https://doi.org/10.7234/composres.2015.28.5.322 인용 PDF KSCI