• Title/Summary/Keyword: LCD Glass

Search Result 294, Processing Time 0.025 seconds

Analysis of a micro-processed sample surface using SCM and AFM (공초점현미경과 원자현미경을 이용한 초정밀 가공된 시료 표면의 영상측정)

  • Kim Jong-Bae;Bae Han-Sung;Kim Kyeong-Ho;Nam Gi-Jung;Kwon Nam-Ic
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2005.06a
    • /
    • pp.577-580
    • /
    • 2005
  • Surface quality of a micro-processed sample with laser has been investigated by using of scanning confocal microscope(SCM) and atomic force microscope(AFM). Samples are bump electrodes and ITO glass of LCD module used in a mobile phone and a wafer surface scribed by UV laser. A image of $140\times120{\mu}m^2$ is obtained within 1 second by SCM because scan speed of a x-axis and y-axis are 1kHz and 1Hz, respectively. AFM is able to measure correctly hight and width of ITO and scribing depth and width of a wafer with a resolution less than 300 . However, the scan speed is slow and it is difficult to distinguish a surface composed of different nm kinds of materials. Results show that SCM is preferable to obtain a image of a sample composed of different kinds of material than AFM because the intensity of a reflected light from surface is different from each material.

  • PDF

전자종이의 기술동향

  • An, Seong-Deok;Kim, Cheol-Am;Seo, Gyeong-Su
    • Proceedings of the Materials Research Society of Korea Conference
    • /
    • 2011.10a
    • /
    • pp.11.1-11.1
    • /
    • 2011
  • 세계 최초의 전자종이가 등장한 때는 1975년 미국 제록스(Xerox)에서 개발된 '자이리콘(Gyricon)'이었으나, 2005년 상업성의 이유로 개발이 중단됐다. 2004년 소니(Sony)도 '리브리에(Librie)'라는 전자책 단말기를 출시했으나 콘텐츠 부족으로 판매가 워낙 부진해 시장에서 철수하였다. 그러나 2007년 인터넷 서점 아마존에서 베스트셀러를 포함한 8만 종 이상의 컨텐츠를 기반으로 전자책 '킨들(Kindle)'을 선보여 대 성공을 하였다. 2009년에만 540만대, 2010년에는 800만대 이상 팔리는 대히트를 기록한 것이다. 이러한 전자책의 성공의 이유는 다음과 같이 생각된다. 전자종이의 첫 번째 장점은 자체 발광을 하지 않는 '반사형'이기 때문에 눈에 피로감을 느끼진 않는다는 점이다. 컴퓨터 모니터, TV, 스마트폰 등은 LCD의 백라이트, AMOLED 등에서 직접 빛을 발산하기 때문에 피로감을 느낄 수밖에 없다. 두번째 장점은 유연하여 다양한 기판에 적용할 수 있다는 것이다. 기존의 디스플레이용 기판으로 유리(glass)를 사용하기 때문에 그 유연성에 있어 한계를 가지고 있지만, 금속 호일(Metal Foil)이나 플라스틱 기판으로 대체하려는 연구가 활발하게 진행되고 있으며 접는 것이 가능한 (Foldable) 전자종이도 출현할 전망이다. 세 번째 장점으로는 소비전력량이 적다는 것이다. 백라이트도 필요 없고, 자체적으로 빛을 낼 필요도 없고, 빛에너지를 외부에서 얻기 때문이다. 이러한 전자종이에 대한 최신 기술동향에 대하여 논하고자 한다.

  • PDF

A Study on Properties on High Temperature Sintering Gravure Off-set Ag Paste (고온 소결형 그라비어 오프셋용 Ag 페이스트의 물성 연구)

  • Park, Chang-Won;HwangBo, Hyuck;Cho, Jung-Woo;Nam, Su-Yong
    • Journal of the Korean Graphic Arts Communication Society
    • /
    • v.29 no.2
    • /
    • pp.71-82
    • /
    • 2011
  • Electronic display markets has been developed. The cathode ray tube of brown form recently celebrated their 100th by first display. Also LCD of flat form recently celebrated their 25th by second display and it has advantage of small volume, lower consumption power. But FPD has problem that is property of brittle and noncarrying by glass substrate. Therefore the arrival of portable electronics devices has put an increasing premium on durable, lightweight and inexpensive display components. It is flexible display by third display. Also electronics field such as printed wiring board, RFID, membrane switch prefer flexible display. The conductive pattern can be used mostly in field of electronic displays and electronics. This manufacture of conductive pattern in present used is screen printing. The the conductive pattern. It has advantages of flexibility, high conductivity, drying in low temperature, good conductivity. screen printing has problem that is low productivity and use not flexible substrate because of high fire temperature. This study was developed novel method to form the conductive pattern. It has advantages of flexibility, high conductivity, drying in low temperature, good conductivity.

FPD 공정을 위한 램프하우스 열전달 특성 연구

  • Kim, Tae-An;Seo, Won-Ho;Kim, Jun-Hyeon;Kim, Yun-Je
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
    • /
    • 2006.10a
    • /
    • pp.132-137
    • /
    • 2006
  • With the help of the development of digital-multimedia in the middle of 1990's, FDP(Flat Panel Display) had attracted considerable attention. Collimation proximity exposure system that transfers the pattern on wafer or glass exactly using mask and light with appropriate wavelength is core process in semiconductor and liquid display element. The performances of resolution required in precision exposure system are evaluated by resolving power, depth of focus and storage area. Most of development has targeted on these three factors. The optical design including lamp house has played an important role on the performance of exposure process. In this study, we evaluate the cooling system, concerning on exposure device with mercury lamp among the kernel equipment for the production of LCD, to prevent the instability of lighting due to long term accumulation of excessive heating inside the lamp house. Numerical analysis is conducted on full-scale model. The characteristics of three-dimensional flow, pressure and temperature distribution on exposure system are graphically depicted to estimate the whole cooling system for lamp house and to establish the design criteria.

  • PDF

COG 플립칩 본딩 공정조건에 따른 Au-ITO 접합부 특성

  • Choe, Won-Jeong;Min, Gyeong-Eun;Han, Min-Gyu;Kim, Mok-Sun;Kim, Jun-Gi
    • Proceedings of the Materials Research Society of Korea Conference
    • /
    • 2011.05a
    • /
    • pp.64.1-64.1
    • /
    • 2011
  • LCD 디스플레이 등에 사용되는 글래스 패널 위에 bare si die를 직접 실장하는 COG 플립칩 패키지의 경우 Au 범프와 ITO 패드 간의 전기적 접속 및 접합부 신뢰성 확보를 위해 접속소재로서 ACF (anisotropic conductive film)가 사용되고 있다. 그러나 ACF는 고가이고 접속피치 미세화에 따라 브릿지 형상에 의한 쇼트 등의 문제가 발행할 수 있어 NCP (non-conductive paste)의 상용화가 요구되고 있다. 본 연구에서는 NCP를 적용한 COG 패키지에 있어서 온도, 압력 등의 열압착 본딩 조건과 NCP 물성이 Au-ITO 접합부의 전기적 및 기계적 특성에 미치는 영향을 조사하였다. NCP는 에폭시 레진과 경화제, 촉매제를 사용하여 다양하게 포뮬레이션을 하였고 DSC (Differential Scanning Calorimeter), TGA (Thermogravimetric Analysis), DEA (Dielectric Analysis) 등의 열분석장비를 이용하여 NCP의 물성과 경화 거동을 확인하였다. 테스트 베드는 면적 $5.2{\times}7.2\;mm^2$, 두께 650 ${\mu}m$, 접속피치 200 ${\mu}m$의 Au범프가 형성된 플립칩 실리콘 다이와 접속패드가 ITO로 finish된 글래스 기판을 사용하였다. 글래스 기판과 실리콘 칩은 본딩 전 PVA Tepla사의 Microwave 플라즈마 장비로 Ar, $O_2$ 플라즈마 처리를 하였으며, Panasonic FCB-3 플립칩 본더를 사용하여 본딩하였다. 본딩 후 접합면의 보이드를 평가하고 die 전단강도로 접합강도를 측정하였다.

  • PDF

Parametric Study for Excimer Laser-induced Crystallization in the a-Si thin film

  • Moon, Min-Hyung;Kim, Hyun-Jae;Choi, Kwang-Soo;Souk, Jun-Hyung;Seo, Chang-Ki;Kim, Do-Young;Dhungel, Suresh Kumar;Yi, Junsin
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2003.07a
    • /
    • pp.630-633
    • /
    • 2003
  • Integrating the driver circuitry directly onto the glass substrate would be one of the advantages of polycrystalline Si (poly-Si) TFT-(LCD). Low-temperature poly-Si TFT(LTPS) is well-suited for higher-definition display applications due to its intrinsically superior electrical characteristics. In order to improve LTPS electrical characteristics, currently the excimer laser-induced crystallization (ELC) processes and sequential lateral solidification method were developed. Grain size of the poly-Si is mainly affected by beam pitch and energy density. Key parameter for making a larger poly-Si using excimer laser annealing(ELA) and increasing a throughput is due to increase in beam pitch and energy density to a certain degree. Furthermore, thin $SiO_{2}$ capping is effective to suppress the protrusion of the poly-Si thin films and to reduce the interface state density. From the ELA process, we are able to control grain size by varying different parameters such as number of shots and energy density.

  • PDF

Electrical Properties of Transparent Indium-Tin-Zinc Oxide Semiconductor for Thin-Film Transistors

  • Lee, Gi-Chang;Choe, Jun-Hyeok;Han, Eon-Bin;Kim, Don-Hyeong;Lee, Jun-Hyeong;Kim, Jeong-Ju;Heo, Yeong-U
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2008.11a
    • /
    • pp.159-159
    • /
    • 2008
  • 투명전도체 (transparent conducting oxides: TCOs) 는 일반적으로 $10^3\Omega^{-1}Cm^{-1}$의 전도도, 가시광 영역에서 80%이상의 투명성을 가지는 재료로서, 액정 박막 표시 장치(TFT-LCD), 광기전성 소자, 유기 발광 소자, 에너지 절약 창문, 태양전지(sollar cell) 등 전극으로 사용되고 있다. 최근에는 TCO의 전도도특성을 조절하여 반도성특성을 가진 투명 산화물 반도체(transparent oxide semiconductor: TOS) 을 이용한 박막 트랜지스터 연구가 활발히 진행 중이다. 기존의 실리콘을 기반으로 하는 박막 트랜지스터의 낮은 이동도, 불투명성의 특성을 가지고 있지만, 산화물 박막트랜지스터는 높은 이동도를 발현 할 수 있을 뿐만 아니라, 넓은 밴드갭 에너지를 갖는 산화물을 이용하므로 투명한 특성도 발현 할 수 있어 차세대 디스플레이의 구동소자로서 응용연구가 되고 있다. 이에 본 연구에서는 박막트랜지스터 channel layer로서의 Indium-Tin-Zinc oxide 적용특성을 조사하였다. Indium, Tin, Zinc 의 혼합비율을 다양하게 조절하여 타겟을 제작하였다. 이를 RF magnetron sputtering 를 이용하여 박막으로 성장시켰으며, 기판으로는 glass 기판을 사용하였다. 박막 성장시 아르곤과 산소의 비율을 다양하게 조절하였다. 성장시킨 박막은 Hall effect, Transmittance, Work function, XRD등을 이용하여 전기적, 광학적, 구조특성을 평가하였다. Indium-Tin-Zinc Oxide(ITZO) 을 channel layer로 사용하여 Thin-film transistor 을 제작하여, TFT의 I-V 및 stability특성을 평가하였다.

  • PDF

Preparation and Adhesive Properties of Acrylate Copolymer with Siloxane Group (실록산기를 함유한 아크릴 공중합체의 제조 및 점착특성)

  • Yoon, Keun-Byoung;Noh, Young-Joo;Lee, Dong-Ho
    • Applied Chemistry for Engineering
    • /
    • v.18 no.2
    • /
    • pp.121-125
    • /
    • 2007
  • Siloxane monomer and oligomer were introduced to n-butyl acrylate and methyl methacrylate copolymer for improvement of water resistance and tactile sensation of acryl-type emulsion. Terpolymerimerization of n-butylacrylate, methyl methacrylate and siloxane monomer or oligomer was carried out in aqueous solution. The glass transition temperature (Tg) of terpolymer decreased with increasing siloxane monomer, however, the Tg of terpolymer increased with increasing siloxane oligomer due to the crosslinking of acrylated end group. The adhesion property and surface energy of the obtained terpolymer decreased with introducing siloxane monomer or oligomer in terpolymer. Decrement of tack and surface energy means the enhancement of water resistance and tactile sensation of the emulsion.

Analysis of a processed sample surface using SCM and AFM (공초점현미경과 원자현미경을 이용한 가공된 시료 표면의 형상측정)

  • Bae Han-Sung;Kim Kyeong-Ho;Moon Seong-Wook;Nam Gi-Jung;Kwon Nam-Ic;Kim Jong-Bae
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.23 no.4 s.181
    • /
    • pp.52-59
    • /
    • 2006
  • Surface qualities of a micro-processed sample with a pulse laser have been investigated by making use of scanning confocal microscope(SCM) and atomic force microscope(AFM). Samples are bump electrodes and ITO glass of LCD module used in a mobile phone and a wafer surface scribed by UV laser. A image of $140{\times}120{\mu}m^2$ is obtained within 1 second by SCM because scan speed of a x-axis and y-axis are 1kHz and 1Hz, respectively. AFM is able to correctly measure the hight and width of ITO, and scribing depth and width of a wafer with a resolution less than 300nm. However, the scan speed is slow and it is difficult to distinguish a surface composed of different kinds of materials. Results show that SCM is preferable to obtain a image of a sample composed of different kinds of material than AFM because the intensity of a reflected light from the surface is different for each material.

Enhanced Light Outcoupling on Photo-luminescent Devices with Microcavity (Microcavity 적용 광자 발광 소자의 광 추출 향상 연구)

  • Lee, Han Byul;Lee, Eun Hye;Sung, Min Ho;Ryu, Si Hong;Lee, Seong Eui
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.26 no.5
    • /
    • pp.391-396
    • /
    • 2013
  • Recently, microcavity is studied to reduce the optical loss of BLU and OLED. In this paper, we suggest applying microcavity to photo-luminescent lamp with plasma discharge technology to meet the display applications for a BLU for LCD. The structure of photo-luminescent lamp consists of SUS foil and ITO glass with microcavity. The opto-electric characteristics of photo-luminescent lamp with microcavity was evaluated. The brightness of photo-luminescent device was increased over $111cd/m^2$ with the adaptation of patterned microcavity at $30{\mu}m$. The 3D optical simulation verified the enhanced light outcoupling when microcavity applied to the device.