• Title/Summary/Keyword: Kerf

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A Study on Discharge Gap in CAD/CAM Wire Electric Discharge Machining (CAD/CAM 와이어 방전가공의 가공확대여유에 관한 연구)

  • 강상훈;박원조;배성한
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.17 no.2
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    • pp.380-384
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    • 1993
  • In precision wire electrode discharge machining by CAD/CAM, it is the most important problem on machining method to determine the wire electrode offset amout from the accurate calculation of discharge gap in order to increase the machining accuracy, after fixing the main machining conditions such as machining speed, wire tension, coolant conductivity, gap vlotage. The present study shows the relationships between discharge gap and main machining conditions by means of a series of experiment concerned with the gap using the workpiece of STD 11, and suggests the experimental eguation to calculate the accurate wire electrode offset amount under the given machining conditions for spot workers.

Experimental Study of Influence of Nozzle Design on Removal of Melted Materials in Laser Cutting Process (레이저 절단가공에서 노즐설계가 용융물질 제거에 미치는 영향에 관한 실험적 연구)

  • Son, Sang-Hyuk;Lee, Seok-Joon;Lee, Yeol
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.1
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    • pp.33-38
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    • 2012
  • An experimental study was carried out to observe the characteristics of impingement of assist gas from a rectangular supersonic nozzle on kerf surface in laser machining. A micro-scale supersonic (Mach number 2.0) rectangular nozzle system was designed and fabricated for the purposes, and hot tests of the performance of the nozzle system was proceeded in the ITI corporation laboratory. For various related parameters such as laser powers, nozzle pressures and cutting speeds, the quality of the frontal view of cut edge surfaces was observed by a microscope. In the study, it was shown that the application of the present micro-rectangular supersonic nozzle in an off-axis configuration made it possible to cut a mild steel, by combinations of relatively low laser - powers, large standoff distances, and assist gas with no oxygen, which was not achieved by conventional laser cutting processes.

On Partitioning and Subtractive Subsemimodules of Semimodules over Semirings

  • Chaudhari, Jaiprakash Ninu;Bond, Dipak Ravindra
    • Kyungpook Mathematical Journal
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    • v.50 no.2
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    • pp.329-336
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    • 2010
  • In this paper, we introduce a partitioning subsemimodule of a semimodule over a semiring which is useful to develop the quotient structure of semimodule. Indeed we prove : 1) The quotient semimodule M=N(Q) is essentially independent of choice of Q. 2) If f : M ${\rightarrow}$ M' is a maximal R-semimodule homomorphism, then $M/kerf_{(Q)}\;\cong\;M'$. 3) Every partitioning subsemimodule is subtractive. 4) Let N be a Q-subsemimodule of an R-semimodule M. Then A is a subtractive subsemimodule of M with $N{\subseteq}A$ if and only if $A/N_{(Q{\cap}A)}\;=\;\{q+N:q{\in}Q{\cap}A\}$ is a subtractive subsemimodule of $M/N_{(Q)}$.

CW 및 Pulsed 레이져를 이용한 세라믹 절단

  • 방세윤
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1994.10a
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    • pp.156-160
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    • 1994
  • Use of engineering ceramics has been increasing due to the outstanding physical and chemical properties. Conventional machining processes, however, are not applicable due to their hardness and brittleness. Laser cutting is a promising alternative for these ceramics. In this study, experimental data of CO $_{2}$ laser cutting of $Al_{2}$ $O_{3}$ and Si $_{3}$ N $_{4}$ are obtained to give a guide in the industry. Results of $Al_{2}$ $O_{3}$ cutting showed extreme weakness to thermal crack and it was found that pulsed beam has to be used for thick $Al_{2}$ $O_{3}$ specimen. Si $_{3}$ N $_{4}$ showed good results for both CW and pulsed beams. Using pulsed beam resulted narrower kerf width with increased surface roughness a nd reduced cutting speed. It was also found that a parameter call path energy is useful for representing minimum threshold value for possible cutting range with pulsed beam.

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응력 주입 층을 이용한 Kerf-less 웨이퍼링 기술 동향

  • Yang, Hyeon-Seok;Eom, Nu-Si-A;Kim, Ji-Won;Im, Jae-Hong
    • Ceramist
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    • v.21 no.2
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    • pp.75-82
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    • 2018
  • In the photovoltaics (PV) industry, there were many efforts to reduce the cost of production with high efficiency. The single most important cost factor in silicon technology is the wafer, accounting presently for ~35% of the module cost. it was already shown that the solar cell efficiency can be maintained up to the thickness range of $40-60{\mu}m$. The direct production of ultra-thin silicon wafer is very attractive and numerous different techniques, such as electrochemical process, ion implantation, and epitaxial growth, have been proposed and developed in many academic and industrial laboratories.

A study on the plasma arc cutting phenomena of plate materials (플라즈마 아크를 이용한 판재료의 절단현상에 관한 연구)

  • 엄기원;김동조
    • Journal of Welding and Joining
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    • v.9 no.4
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    • pp.69-74
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    • 1991
  • The Plasma Arc Cutting Method using high density and hight temperature beam is well applicable to the cutting of the nonferrous metal (Al alloy ) and stainless steel which are unable to be cut by the use of the oxy-fuel gas. This study focalizes on the cutting phenomena of the plate of (mm) thickness, since the cutting phenomena of thick plates have been rather thoroughly studied. In this study the cutting groove, adhesive phenomena of dross, surface roughness were measured according to the variation of cutting speed and compared with the case of mild steel plates. The result showed that the kerf width variation of Al alloy was similar to the case of mild steel, while that of the stainless steel differed from the mild steel. In the adhesive phenomena of dross, 6(mm) thick plates of Al alloy showed a difference from those of thick plates, but the stainless steel was similar to thick plates. The surface roughness variation of Al alloy wias minimum at 67 cm/min, while that of stainless steel was at 30cm/min.

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Two-dimensional Laser Drilling Using the Superposition of Orthogonally Polarized Images from Two Computer-generated Holograms

  • Lee, Hwihyeong;Cha, Seongwoo;Ahn, Hee Kyung;Kong, Hong Jin
    • Current Optics and Photonics
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    • v.3 no.5
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    • pp.451-457
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    • 2019
  • Laser processing using holograms can greatly improve processing speed, by spatially distributing the laser energy on the target material. However, it is difficult to reconstruct an image with arrays of closely spaced spots for laser processing, because the specklelike interference pattern prevents the spots from getting close to each other. To resolve this problem, a line target was divided in two, reconstructed with orthogonally polarized beams, and then superposed. Their optical reconstruction was performed by computer-generated holograms and a pulsed laser. With this method, we performed two-dimensional (2D) laser drilling of polyimide film, with a kerf width of $20{\mu}m$ and a total processing length of 20 mm.

Mitigation of gap formation resulting from saw blade in single-cut osteotomy

  • Mu-Young Kim;Stanley Eunwoo Kim
    • Journal of Veterinary Science
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    • v.25 no.2
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    • pp.26.1-26.6
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    • 2024
  • Bone loss from the kerf of the sawblade may influence the final outcomes when employing three-dimensional-printed surgical guides. However, no studies have systematically addressed saw blade-induced bone loss. This study aims to quantify bone loss and propose a reduction guide to minimize the fracture gap. The postoperative gap tended to decrease as the amount of gap compensation increased. Osteotomy gaps can be attributed to the thickness of the saw blade, and the proposed methodology addresses this surgical error. Surgeons can proactively plan and design reduction guides with applied compensation using the method described in this study.

A Study on the Deep Kerfing Technique in Rock Using High Pressure Water Jet (워터젯을 이용한 암석의 슬롯절삭에 관한 연구)

  • 최병희;양형식
    • Explosives and Blasting
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    • v.19 no.3
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    • pp.105-113
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    • 2001
  • 채석, 굴착, 가공과 같은 워터젯 응용분야에서 대상재료에 깊은 홈(kerf)을 절단할 수 있는 실험실용 회전식 슬로터(slotter)를 제작하여 암석을 대상으로 워터젯 시스템의 절단효율을 시험하였다. 고압펌프는 유율 7.5 l/min, 압력 379 MPa, 용량 75 kW급의 JETPAC을 주로 사용하였고, 암석시료는 화강석인 제천석, 거창석을 사용하였다. 시험과정에서는 물과 연마재 투입에 의한 절단 및 진동식 슬로터에 의한 슬롯절단 기초시험을 먼저 수행하고, 그 결과를 토대로 회전식 슬로터에 의한 절단시험을 실시하였다. 순수한 물에 의한 시험의 결과 고압수류의 토출압력은 절단심도에 정비례하였고, 노즐의 이송속도는 이차함수 형태의 반비례 관계를 보였다. 연마재 투입시험에서는 순수한 물에 의한 경우에 비해 연마재로 인한 충격력의 증가로 절단심도가 크게 증가하였는데, 유사한 조건하에서 3~5배 이상의 절단심도의 증가를 보였다. 진동식 슬로터에 의한 슬롯절삭에서는 생성된 슬롯의 내벽면이 바닥으로 갈수록 좁아짐으로써 넓은 폭의 슬롯형성은 가능하나 절삭심도가 제한되었다. 회전식 슬로터에 의한 시험에서 생성된 슬롯들은 평균 22 mm의 폭으로 내벽면이 바닥까지 서로 평행하여 깊은 심도까지 비트진입이 가능하였다. 절단율은 16~32 mm/sec의 속도범위에서 $40~160{\;}\textrm{mm}^2/sec$로 나타났다. 한편, 최대유율 24 l/min의 HUSKY S-200 펌프에 의한 시험결과 JETPAC 펌프에 비해 1.13~3.47 배의 절단심도를 보였다

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A Study for Reducing the Acoustic Cross Talk Level in an Array Type Piezoelectric Ultrasonic Transducer Using Acoustic Wells (음향 벽을 이용한 배열형 압전형 초음파 변환기의 음향 간섭 수준 감소를 위한 연구)

  • 김영신;노용래
    • The Journal of the Acoustical Society of Korea
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    • v.22 no.3
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    • pp.208-216
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    • 2003
  • In one dimensional linear array type piezoelectric ultrasonic transducers widely used for medical diagnosis, the acoustic cross talk caused by the structural acoustic coupling between the adjacent piezoelectric elements reduces significantly their performance. In the study, we have proposed an acoustic wall to reduce the acoustic cross talk by wave propagation through the surface the transducer which can not be prevented by conventional kerf and have analyzed using a finite element method the acoustic cross talk level with respect to the shape, size and materials of the acoustic wall mounted on a convex one dimensional piezoelectric ultrasonic transducer. We expect that the simulated results provide us with a valuable information to make an optimized design of the way type ultrasonic transducer minimizing the acoustic cross talk level.