• 제목/요약/키워드: Ion Source

검색결과 968건 처리시간 0.03초

신경망을 이용한 SiN 박막 표면거칠기에의 이온에너지 영향 모델링 (Neural Network Modeling of Ion Energy Impact on Surface Roughness of SiN Thin Films)

  • 김병환;이주공
    • 한국표면공학회지
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    • 제43권3호
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    • pp.159-164
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    • 2010
  • Surface roughness of deposited or etched film strongly depends on ion bombardment. Relationships between ion bombardment variables and surface roughness are too complicated to model analytically. To overcome this, an empirical neural network model was constructed and applied to a deposition process of silicon nitride (SiN) films. The films were deposited by using a pulsed plasma enhanced chemical vapor deposition system in $SiH_4$-$NH_4$ plasma. Radio frequency source power and duty ratio were varied in the range of 200-800 W and 40-100%. A total of 20 experiments were conducted. A non-invasive ion energy analyzer was used to collect ion energy distribution. The diagnostic variables examined include high (or) low ion energy and high (or low) ion energy flux. Mean surface roughness was measured by using atomic force microscopy. A neural network model relating the diagnostic variables to the surface roughness was constructed and its prediction performance was optimized by using a genetic algorithm. The optimized model yielded an improved performance of about 58% over statistical regression model. The model revealed very interesting features useful for optimization of surface roughness. This includes a reduction in surface roughness either by an increase in ion energy flux at lower ion energy or by an increase in higher ion energy at lower ion energy flux.

Analysis of H-ICP Source by Noninvasive Plasma Diagnostics of Etching Process

  • Park, Kun-Joo;Kim, Min-Shik;Lee, Kwang-Min;Chae, Hee-Yeop;Lee, Hi-Deok
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.126-126
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    • 2009
  • Noninvasive plasma diagnostic technique is introduced to analyze and characterize HICP (Helmholtz Inductively Coupled Plasma) source during the plasma etching process. The HICP reactor generates plasma mainly through RF source power at 13.56MHz RF power and RF bias power of 12.56MHz is applied to the cathode to independently control ion density and ion energy. For noninvasive sensors, the RF sensor and the OES (Optical emission spectroscopy) were employed since it is possible to obtain both physical and chemical properties of the reactor with plasma etching. The plasma impedance and optical spectra were observed while altering process parameters such as pressure, gas flow, source and bias power during the poly silicon etching process. In this experiment, we have found that data measured from these noninvasive sensors can be correlated to etch results. In this paper, we discuss the relationship between process parameters and the measurement data from RF sensor and OES such as plasma impedance and optical spectra and using these relationships to analyze and characterize H-ICP source.

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이온 주입 공정시 발생한 실리콘 내 결함의 제어를 통한 $p^+-n$ 초 저접합 형성 방법 (Formation of ultra-shallow $p^+-n$ junction through the control of ion implantation-induced defects in silicon substrate)

  • 이길호;김종철
    • 한국진공학회지
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    • 제6권4호
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    • pp.326-336
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    • 1997
  • 트랜지스터의 소오스/드레인 접합 특성에 가장 큰 영향을 미치는 인자는 이온 주입 시 발생한 실리콘 내에 발생한 결합이라는 사실에 착안하여, 기존 소오스/드레인 접합 형성 공정과 다른 새로운 방식을 도입하여 이온 주입에 의해 생긴 결함의 제어를 통해 고품질 초 저접합 $p^+$-n접합을 형성하였다. 기존의 $p^+$소오스/드레인 접합 형성 공정은 $^{49}BF_2^+$ 이온 주입 후 층간 절연막들인 TEOS(Tetra-Ethyl-Ortho-Silicate)막과 BPSG(Boro-Phospho-Silicate-Glass)막을 증착 후 BPSG막 평탄화를 위한 furnace annealing 공정으로 진행된다. 본 연구에서는 이러한 기존 공정과는 달리 층간 절연막 증착 전 저온 RTA첨가 방법, $^{49}BF_2^+$$^{11}B^+$ 을 혼합하여 이온 주입하는 방법, 그리고 이온 주입 후 잔류 산화막을 제거하고 MTO(Medium temperature CVD oxide)를 증착하는 방법을 제시하 였으며, 각각의 방법은 모두 이온 주입에 의한 실리콘 내 결합 농도를 줄여 기존의 방법보 다 더 우수한 양질의 초 저접합을 형성할 수 있었다.

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Investigation of Ar ion-milling rates for ultrathin single crystals

  • 이민희;김규현
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2015년도 춘계학술대회 논문집
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    • pp.143-144
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    • 2015
  • Here we report the Ar-ion milling rates of ultrathin Si and GaAs single crystals. The thickness change is measured using convergent beam electron diffraction (CBED) technique with the help of Bloch wave simulation method. This study suggests the experimental procedures to determine the references for an etching rate to reduce a sample thickness or to remove the damaged sample surface using Ar-ion source.

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A preliminary study on real-time Rn/Tn discriminative detection using air-flow delay in two ion chambers in series

  • Sopan Das ;Junhyeok Kim ;Jaehyun Park ;Hojong Chang;Gyuseong Cho
    • Nuclear Engineering and Technology
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    • 제54권12호
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    • pp.4644-4651
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    • 2022
  • Due to its short half-life, thoron gas has been assumed to have negligible health hazards on humans compared to radon. But, one of the decay products with a long half-life can make it to be transported to a long distance and to cause a severe internal dose through respiration. Since most commercial radon detectors can not discriminate thoron signals from radon signals, it is very common to overestimate radon doses which in turn result in biased estimation of lung cancer risk in epidemiological studies. Though some methods had been suggested to measure thoron and radon separately, they could not be used for real-time measurement because of CR-39 or LR-115. In this study, an effective method was suggested to measure radon and thoron separately from the free air. It was observed that the activity of thoron decreases exponentially due to delay time caused by a long pipe between two chambers. Therefore from two ion chambers apart in time, it was demonstrated that thoron and radon could be measured separately and simultaneously. We also developed a collimated alpha source and with this source and an SBD, we could convert the ion chamber reading to count rate in cps.

이온주입기 Source Head Ass'y 개발에 관한 연구 (A Study on Implementation of Source Head Ass'y of Implanter)

  • 한정수
    • 한국산학기술학회:학술대회논문집
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    • 한국산학기술학회 2008년도 추계학술발표논문집
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    • pp.267-269
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    • 2008
  • 본 연구는 이온주입(Ion Implanter)장비의 성능향상과 재현성 있는 Source Head를 개발하기 위한 방법이다. 본 개발은 이온주입설비가 가지고 있는 Cathode 열전자를 이용하여 원자라는 Source Positive의 극성을 생성하여 보다 높은 이온화를 발생하여 많은 시간 동안 사용 가능하도록 하였다. 기존에는 Gas의 손실이 많아 원자의 이온화에 대한 열전자의 소모성을 증가하는 원인을 제공하였으나, 본 개발에서는 원자의 유입방식을 공중 분산방식으로 적용함으로써 열전자의 손실로 발생하는 부분을 억제하는 효과와 Arc Chamber의 압력을 낮게 가지고 갈 수 있고 Chamber의 오염을 억제하는 효과를 얻을 수 있었다.

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새로운 이온빔을 이용한 $SiO_x$ 박막 표면의 액정 배향 효과 (Homeotropic Alignment Effect for Nematic Liquid Crystal on the $SiO_x$ Thin Film Layer by New Ion beam Exposure)

  • 최성호;김병용;한진우;오용철;서대식
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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    • pp.311-312
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    • 2006
  • We studied homeotropic alignment effect for a nematic liquid crystal (NLC) on the $SiO_x$, thin film irradiated by the new ion beam method $SiO_x$ thin films were deposited by plasma enhanced chemical vapor deposition (PECVD) and were treated by the DuoPIGatron ion source. A uniform liquid crystal alignment effect was achieved over 2100 eV ion beam energy. Tilt angle were about $90^{\circ}$ and were not affected by various ion beam energy.

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Simulation Study to Improve Ion Transmission Efficiency in Mass Spectrometry with a Dual Ion Funnel Ion Source

  • Baek, Sun Jong;Kim, Seung Yong;Kim, Taeman;Kim, Hyun Sik
    • Mass Spectrometry Letters
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    • 제4권4호
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    • pp.91-94
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    • 2013
  • We performed computer simulations to improve transmission efficiencies of a dual ion funnel system implemented on an FT-ICR MS. We found that the low m/z range from 50 to 150 could be significantly improved by operating the two ion funnels at different RF amplitudes. These new operational conditions could be applied to analyze metabolome samples, which require high sensitivity in the m/z range from 50 to 1,000.

SCBF 장치에서 이온전류에 대한 포텐셜 우물 구조의 영향 (Effect of Potential Well Structure on Ion Current in SCBF Device)

  • 주흥진;박정호;고광철
    • 한국전기전자재료학회논문지
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    • 제20권5호
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    • pp.471-477
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    • 2007
  • SCBF(Spherically Convergent Beam Fusion) device has been studied as a neutron source. Neutron production rate is a most important factor for the application of SCBF device and is proportional to the square of the ion current[1]. It is regarded generally that some correlations between the potential well structure and the ion current exist. In this paper, the ion current and potential distribution were calculated in a variety of grid cathode geometries using FEM-FCT method. Single potential well structure was certified inside the grid cathode. The deeper the potential well became, the higher the ion current due to the high electric field near the grid cathode became.

IGZO 박막 표면의 수소 이온 빔 처리 효과

  • 이승수;민관식;윤주영;오은순;정진욱;김진태
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.154.1-154.1
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    • 2014
  • Indium gallium zinc oxide (IGZO)는 차세대 디스플레이 평판 패널에 사용되는 반도체 화합물의 일종으로 최근 주목받고 있는 물질의 하나이다. 기존의 IGZO를 사용하여 박막을 증착한 뒤 표면 처리를 통해 박막의 특성 변화에 대한 연구들이 진행되어 왔으며, 기존의 연구들은 plasma 환경에 노출을 시켜 간접적인 plasma treatment를 통해 박막의 특성을 향상시켜 왔다. 본 연구에서는 기존의 plasma treatment에서 발견된 방식인 ion beam treatment를 통해 플라즈마를 직접적으로 표면에 조사하여 박막의 특성 변화를 알아보았다. 한국표준과학연구원에서 자체 제작한 chamber를 이용하여 RF sputter로 Si wafer 위에 IGZO 박막을 증착하고 수소 ion beam treatment를 한 뒤, SEM과 XPS를 사용하여 박막 표면의 물성 변화를 분석하였다. 실험에 사용된 chamber에는 sputter gun과 ion beam이 함께 장착되어 있으며, scroll pump와 TMP를 사용하여 pressure를 유지하였다. 실험 시 base pressure는 $1.4{\times}10^{-6}Torr$였다. RF power 150 W. ion beam power 2,000 V에서 실험을 진행하였다.

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