• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.119-119
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• 2015

Ion beam sputtering has been widely used in Secondary Ion Mass Spectrometry (SIMS), X-ray Photoelectron Spectroscopy (XPS), and Auger Electron Spectroscopy (AES) for depth profile or surface cleaning. However, mainly due to severe matrix effects such as surface composition change from its original composition and damage of the surface generated by ion beam bombardment, conventional sputtering skills using mono-atomic primary ions with energy ranging from a few hundred to a thousand volts are not sufficient for the practical surface analysis of next-generation organic/inorganic device materials characterization. Therefore, minimization of the surface matrix effects caused by the ion beam sputtering is one of the key factors in surface analysis. In this work, the electronic structure of a $Ta_2O_5$ thin film on $SiO_2/Si$ (100) after Ar Gas Cluster Ion Beam (GCIB) sputtering was investigated using X-ray photoemission spectroscopy and compared with those obtained via mono-atomic Ar ion beam sputtering. The Ar ion sputtering had a great deal of influence on the electronic structure of the oxide thin film. Ar GCIB sputtering without sample rotation also affected the electronic structure of the oxide thin film. However, Ar GCIB sputtering during sample rotation did not exhibit any significant transition of the electronic structure of the $Ta_2O_5$ thin films. Our results showed that Ar GCIB can be useful for potential applications of oxide materials with sample rotation.

• Applied Science and Convergence Technology
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• 제24권5호
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• pp.162-166
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• 2015

Linear ion beams have been introduced for the ion beam treatments of flexible substrates in roll-to-roll web coating systems. Anode layer linear ion sources (300 mm width) were used to make the linear ion beams. Oxygen ion beams having an ion energy from 200 eV to 800 eV used for the adhesion improvement of Cu thin films on PET substrates. The Cu thin films deposited by a conventional magnetron sputtering on the oxygen ion beam treated PET substrates showed Class 5 adhesion defined by ASTM D3359-97 (tape test). Argon ion beams with 1~3 keV used for the ion beam sputtering deposition process, which aims to control the initial layer before the magnetron sputtering deposition. When the discharge power of the linear ion source is 1.2 kW, static deposition rate of Cu and Ni were 7.4 and $3.5{\AA}/sec$, respectively.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.581-584
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• 2005

Ion beam processing is one of the key technologies to realize mastless and resistless sub 50nm nano fabrication. Unwanted effects, however, may occur since an energetic ion can interact with a target surface in various ways. Depending on the ion energy, the interaction can be swelling, deposition, sputtering, re-deposition, implantation, damage, backscattering and nuclear reaction. Sputtering is the fundamental mechanisms in ion beam induced direct patterning. Re-deposition and backscattering are unwanted mechanisms to avoid. Therefore understanding of ion beam-solid interaction should be advanced for further ion beam related research. In this paper we simulate some important interaction mechanisms between energetic incident ions and solid surfaces and the results are compared with experimental data. The simulation results are agreed well with experimental data.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.259-259
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• 2008

The LTCC (Low Temperature Co-fired Ceramic) technology meets the requirements for high quality microelectronic devices and microsystems application due to a very good electrical and mechanical properties, high reliability and stability as well as possibility of making integrated three dimensional microstructures. The wet process, which has been applied to the etching of the metallic thin film on the ceramic substrate, has multi process steps such as lithography and development and uses very toxic chemicals arising the environmental problems. The other side, Plasma technology like ion beam sputtering is clean process including surface cleaning and treatment, sputtering and etching of semiconductor devices, and environmental cleanup. In this study, metallic multilayer pattern was fabricated by the ion beam etching of Ti/Pd/Cu without the lithography. In the experiment, Alumina and LTCC were used as the substrate and Ti/Pd/Cu metallic multilayer was deposited by the DC-magnetron sputtering system. After the formation of Cu/Ni/Au multilayer pattern made by the photolithography and electroplating process, the Ti/Pd/Cu multilayer was dry-etched by using the low energy-high current ion-beam etching process. Because the electroplated Au layer was the masking barrier of the etching of Ti/Pd/Cu multilayer, the additional lithography was not necessary for the etching process. Xenon ion beam which having the high sputtering yield was irradiated and was used with various ion energy and current. The metallic pattern after the etching was optically examined and analyzed. The rate and phenomenon of the etching on each metallic layer were investigated with the diverse process condition such as ion-beam acceleration energy, current density, and etching time.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1998년도 제14회 학술발표회 논문개요집
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• pp.20-20
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• 1998

I Ion beam technology has recently attracted much interest because it has exciting t technological p아:ential for surface analysis, ion beam mixing, surface cleaning and etching i in thin film growth and semiconductor fabrication processes, etc. Es야~cially, ion beam s sputtering has been widely used for sputter depth profiling with x-photoelectron S spectroscopy (XPS) , Auger electron s$\pi$~troscopy(AES), and secondary-ion mass S야i따oscopy(SIMS). However, The problem of surface compositional ch없1ge due to ion b bombardment remains to be understo여 없ld solved. So far sputtering processes have been s studied by s따face an외ysis tools such as XPS, AES, and SIMS which use the sputtering p process again. It would be improbable to measure the modified surface composition profiles a accurately due to ion beam bombardment with surface analysis techniques based on sputter d depth profiling. However, recently Medium energy ion scattering spectroscopy(MEIS) has b been applied to study the sputtering of solid surface at ion bombardment and has been p proved that it has been extremely valuable in probing the surface composition 뻐d s structure nondestructively and quantita디vely with less than 1.0 nm depth resolution. To u understand the sputtering processes of solid surface at ion bombardment, The Molecular D Dynamics(MD) and Monte Carlo(MC) simulation has been used and give an intimate i insight into the sputtering processes of solid surfaces. In this presentation, the sputtering processes of alloys and compound samples at ion b bombardment will be reviewed and the MEIS results for the Ar+ sputter induced altered l layer of the TazOs thin film 뻐dd없nage profiling of Ar+ ion sputt얹"ed Si(100) surface will b be discussed with the results of MD and MC simulation.tion.

• 한국세라믹학회지
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• 제42권1호
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• pp.28-32
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• 2005

이중 이온빔 스퍼터링(Dual ion-Beam Sputtering, DIBS)과 단일 이온빔 스피터링(Single ion-Beam Sputtering, SIBS)을 사용하여 기판의 온도와 보조 이온빔 에너지 변화에 따라 $Ta_{2}O_{5}$ 박막의 광학적 특성과 박막에 존재하는 응력의 변화에 과해 관찰하였다. SIBS 방법에 의해 증착되어진 박막의 굴절률은 150^{circ}C$에서 최고 2.144를 나타내었으며, $150^{circ}C$ 이상에서는 감소하였다. DIBS 방법에 의해 증착된 732린 박막은 기판의 온도가 증가함에 따라 $200^{circ}C$에서 최고 2.117의 굴절률을 나타내었다. $100^{circ}C$ 미만의 저온 DIBS 증착은 박막에 존재하는 응력을 낮추었으나 100^{circ}C 이상의 고온 증착시에는 박막에 존재하는 응력이 켰다. 보조 이온빔 어시스트 한 경우, 보조 이온빔 에너지가 250V에서 350V로 증가함에 따라 증착된 T놀달 박막의 굴절률은 2.185로 증가하였으나, $350\~650V$인 구간에서는 굴절률이 감소하는 경향을 나타냈다. 또한, 보조 이온빔 에너지가 증가함으로써 박막에 존재하는 응력이 감소하여 650 V에서 0.1834 GPa를 나타내었다.

• Journal of information and communication convergence engineering
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• 제4권4호
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• pp.158-161
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• 2006

[ $Bi_2Sr_2Ca_nCu_{n+1}O_y(n{\geq}0)$ ] thin film is fabricatedvia two different processes using an ion beam sputtering method i.e. co-deposition and layer-by-layer deposition. A single phase of Bi2212 can be fabricated via the co-deposition process. While it cannot be obtained by the layer-by-layer process. Ultra-low growth rate in our ion beam sputtering system brings out the difference in Bi element adsorption between the two processes and results in only 30% adsorption against total incident Bi amount by layer-by-layer deposition, in contrast to enough Bi adsorption by co-deposition.

• Applied Science and Convergence Technology
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• 제27권1호
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• pp.1-4
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• 2018

A sputtering-assisted magnetic field system was successfully developed for depositing crystalline Cu thin films at room temperature. This system employs a plasma source and an ion-beam gun with two magnetic field generators, which is covered with sputtering target and the ion-beam gun, simultaneously serving as sputtering plasma and a magnetic field generator. The formation of crystalline Cu thin films at room temperature was dominated by magnetic fields, which was revealed by preliminary experiments. This system can be employed for producing crystalline metal thin films at room temperature.

• 한국진공학회지
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• 제10권4호
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• pp.396-402
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• 2001

전자빔 증착기를 이용하여 1000 $\AA$의 두께를 가진 MgO박막을 구리 기판위에 상온에서 증착하였다. 스퍼터링수율 측정시 MgO 층에 충전현상을 없애주기 위해서 1000 $\AA$ 두께의 Al을 증착하였다. 갈륨 액체금속을 집속이온빔 이온원으로 사용하였다. 두 개의 정전렌즈를 사용하여 이온빔을 집속하였고, MgO에 이온빔을 주사하기 위해 편향기를 사용하였다. 가속전압의 변화에 따라 시료대 전류와 이차입자 전류를 측정하였고, 이 전류값은 소스에 인가하는 가속전압에 따라 변화되었다 MgO 박막의 스퍼터링 수율은 분석된 시료대 전류, 이차입자 전류 및 순수빔 전류의 값을 사용하여 결정하였다. 집속이온빔 장치의 가속전압이 15 kV일 때 MgO 박막의 스퍼터링 수율은 0.30으로 나왔고 가속전압의 값이 증가할 때 스퍼터링 수율이 선형적으로 증가하였다. 이러한 결과를 볼 때 집속이온빔 장치를 이용하면 MgO 박막의 스퍼터링 수율을 측정할 패 매우 효과적임을 알 수 있다.

• 한국광학회지
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• 제13권3호
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• pp.209-214
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• 2002

기판의 표면거칠기가 반사경의 산란에 미치는 영향을 조사하였다. 기판의 표면거칠기가 다른 다섯 종류의 기판에 이온빔 스퍼터링 방법과 전자총 증착 방법으로 각각 반사율이 1에 가까운 고반사율 박막을 증착하고 산란을 TIS 방법으로 측정하였다. 기판의 표면거칠기가 2$\AA$ 이상인 경우의 기판의 산란에 대한 반사경 산란 비율은 표면거칠기가 2$\AA$ 미만인 경우의 산란 비율에 비하여 급격한 증가를 나타냄을 알 수 있었으며, 기판의 표면거칠기가 낮은 경우 반사경의 산란은 기판의 표면거칠기보다 반사경을 구성하는 박막의 미세구조에 의존하는 것으로 판단되었다. 한편 반사경 중에서 가장 작은 산란은 2.1 ppm이었고, 이것은 표면거칠기 0.23$\AA$인 기판에 이온빔 스퍼터링 방법으로 제작되었다.