• 마이크로전자및패키징학회지
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• 제14권3호
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• pp.43-49
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• 2007

웨이퍼 레벨 솔더범핑시 under bump metallurgy (UBM)의 종류와 리플로우 시간에 따른 Sn 솔더범프의 평균 금속간화합물 층의 두께와 UBM의 소모속도를 분석하였다. Cu UBM의 경우에는 리플로우 이전에 $0.6\;{\mu}m$ 두께의 금속간화합물 층이 형성되어 있었으며, $250^{\circ}C$에서 450초 동안 리플로우함에 따라 금속간화합물 층의 두께가 $4\;{\mu}m$으로 급격히 증가하였다. 이에 반해 Ni UBM에서는 리플로우 이전에 $0.2\;{\mu}m$ 두께의 금속간화합물 층이 형성되었으며, 450초 리플로우에 의해 금속간화합물의 두께가 $1.7\;{\mu}m$으로 증가하였다. Cu UBM의 소모속도는 15초 리플로우시에는 100 nm/sec, 450초 리플로우시에는 4.5 nm/sec이었으나, Ni UBM에서는 소모속도가 15초 리플로우시에는 28.7 nm/sec, 450초 리플로우시에는 1.82 nm/sec로 감소하였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.54-56
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• 2005

Ultrasonic soldering using of Si-wafer to FR-4 PCB atroom temperature was investigated. Sn3.5Ag foil rolled $100{\mu}m$ was used for solder. The UBM of Si-die was Cu/ Ni/ Al from top to bottom and its thickness was $0.4{\mu}m$, $0.4{\mu}m$, $0.3{\mu}m$ respectively. Pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom and its thickness was $0.05{\mu}m$, $5{\mu}m$, $18{\mu}m$ respectively. The ultrasonic soldering time was changed from 0.5sec to 3.0sec and its power 1400W. As experimental result, reliable bond joint by ultrasonic at room temperature was obtained. The shear strength increased with soldering time up to 2.5 sec. That means at 2.5sec, the shear strength showed maximum rate of 65.23N. The strength decreased to 33.90N at 3.0 sec because the cracks generated along the intermetallic compound between Si-wafer and Sn-3.5mass%Ag solder. intermetallic compound produced by ultrasonic between the solder and the Si-die was $(Cu, Ni)_{6}Sn_{5}$ and the intermetallic compound between solder and pad on FR-4 was $(Ni, Cu)_{3}Sn_{4}$.

• 한국재료학회지
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• 제15권7호
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• pp.439-443
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• 2005

The oxidation behavior and the thermal stability of nanocrystalline Al-25Ti-8Mn intermetallic compound were investigated. $Al_3Ti$ intermetallic compound, which has a potential for high temperature structural material, was fabricated by mechanical alloying(MA) with $8at.\%$ Mn to enhance the thermal stability and ductility. And Al-25Ti-8Mn intermetallic compound was sintered by spark plasma sintering(SPS) at $700^{\circ}C$. After sintering process, cubic $Ll_2$ structure was maintained without phase transformation and the grain size was about 50nm. To investigate the oxidation behavior of the specimens, thermal gravimetric analysis(TGA) was performed at 700, 800, 900, and $1000^{\circ}C$ for 24 h in $O_2$. As the temperature increased from $700^{\circ}C\;to\;900^{\circ}C$ the weight gain of specimens increased. However at $1000^{\circ}C$, unlike the oxidation behavior of $700^{\circ}C\;to\;900^{\circ}C$, the weight gain of specimen decreased drastically and the transition from linear rate region to parabolic rate region occurred rapidly due to the dense $\alpha-Al_2O_3$.

• 한국표면공학회지
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• 제22권1호
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• pp.3-9
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• 1989

The intermetallic compount formation, growth rections, and growth kinetices as functions of the aging temperaturess, time, and the condition of substarte have invedtigted in the Sn/Cu and Sn/Ni bimetal couples. The η'-phase (Cu6Sn5) and $\delta$-phase (Ni3Sn4) were only found to grow at 20 and $70^{\circ}C$in the Sn/Cu and Sn/Ni bimetallic coples repectively. Above that temperatures, all other compounds were formed in sequence of high Sn content plase and the metastable Cu41Sn11 was formed at agend $200^{\circ}C$. The ectivation energy for the growth of intermetallic compounds was 14.7Kxal/mole in the Sn/Cu interface and 26.7Kcal/mole in the Sn/Ni interface.

• Corrosion Science and Technology
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• 제7권3호
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• pp.158-161
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• 2008

It is well known that iron is one of the most common impurity elements found in aluminum and its alloys. Iron in the aluminum forms an intermetallic compounds such as $FeAl_3$. The $FeAl_3$ particles on the aluminum surface are one of the most detrimental phases to the corrosion process and anodizing procedure for aluminum and its alloys. Trial and error surface treatment will be carried out to find the preferential and effective removal of $FeAl_3$ particles on the surfaces without dissolution of aluminum matrix around the particles. One of the preferable surface treatments for the aim of getting $FeAl_3$ free surface was an electrochemical treatment such as cathodic current density of $-2kAm^{-2}$ in a 20-30 mass% $HNO_3$ solution for the period of 300s. The corrosion characteristics of aluminum surface with $FeAl_3$ free particles are examined in a $0.1kmol/m^3$ NaCl solution. It is found that aluminum with free $FeAl_3$ particles shows higher corrosion resistance than aluminum with $FeAl_3$ particles.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.937-938
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• 2006

Tungsten heavy alloys with different ratios of Mo and Ni-Fe matrix were liquid-phase-sintered to investigate their microstructural evolution. Results indicated that increased Mo in the alloy promoted the formation of a (W,Mo)(Ni,Fe) type intermetallic compound in the furnace-cooled condition. It was a monoeutectic reaction when the added Mo content was higher than 49at.%, or a eutectic reaction when this value was between 37at,% to 49at.%. When Mo was added between 25at.% to 37at.%, the precipitation of the intermetallic compound took place by either a eutectoid or peritectoid reaction.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.534-538
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• 2002

Dissimilar friction stir welding of aluminum (AI) alloy 1050 and magnesium (Mg) alloy AZ31 was successfully done in the limited welding parameters. The dissimilar weld showed good quality and facility compared to conventional fusion weld. Transverse cross section perpendicular to the welding direction had no defects. The weld was divided into base material of Al alloy, an irregular shaped stir zone and base material of Mg alloy. The irregular shaped stir zone was roughly located around the initial weld center. The weld interface near plate surface shifted from initial weld centerline to the advancing side. Hardness profile of the weld was heterogeneous, and the hardness value of the stir zone was raised to about 150 Hv to 250 Hv. The mixed phase was identified to intermetallic compound $Mg_{17}$Al$_{12}$ using x-ray diffraction method, energy dispersive x-ray spectroscopy (EDX) and electron probe micro analysis (EPMA). The formation of intermetallic compound $Mg_{17}$Al$_{12}$ during FSW causes the remarkable increase in hardness value in the stir zone.one.

• 한국주조공학회지
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• 제39권3호
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• pp.33-43
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• 2019

In this study, the effects of Zn additions on the mechanical properties of Al-Si-Mg-Cu alloys were investigated by increasing the amount of Zn up to 8wt.%. As the Zn content was increased up to 6 wt.%, the yield strength and elongation changed linearly without any significant changes in the size and shape of the main reinforcement phase. However, it was confirmed by SEM observation that the Mg-Zn phase formed between the reinforcement phases when the amount of Zn added exceeded 7wt.%. A Mg-Zn intermetallic compound formed between the $Mg_2Si$ phase, becoming a crack initiation point under stress. Thus, the formation of the Mg-Zn phase may cause a sharp decrease in the elongation when Zn at levels exceeding 7 wt.%. It was also found that the matrix became more brittle with increasing the Zn content. From these results, it can be concluded that the formation of the Mg-Zn intermetallic compound and the brittle characteristics of the matrix are the main causes of the remarkable changes in the mechanical properties of this alloy system

• 마이크로전자및패키징학회지
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• 제16권2호
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• pp.27-31
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• 2009

Sn whiskers can grow from the pure Sn and high Sn-based finish and cause the electrical shorts and failures. Even with the wealth of information on whiskers, we have neither the clear understanding of whisker growth nor methods for its prevention. In this study, the whisker grain roots which connected with intermetallic layer were analyzed by high-resolution transmission electron microscopy (HR-TEM). In the Sn-Cu plated leadframe (LF) that was stored at ambient condition for 540 days, filament-shaped whiskers were grown on the Sn-plated surface and ${\eta}'-Cu_6Sn_5$ precipitates were widely distributed along the grain boundaries at the Sn matrix. The measured of the lattice fringes at the ${\eta}'-Cu_6Sn_5$ was $4.71{\AA}$ at the coarse grain and $2.91{\AA}$ at the fine grain. The $Cu_3Sn$ which generates the tensile stresses was not observed. The formation of $Cu_6Sn_5$ precipitates and intermetallic layer were strongly related to whisker growth, but, the whisker growth tendency does not closely relate with the geometric morphology of irregularly grown intermetallic compound (lMC).

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.245-247
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• 2007

Sn-base solder bump is mainly used in micro-joining for flip chip package. The quantity of intermetallic compounds that was formed between Cu pad and solder interface importantly affects reliability. In this research, micro-bump was fabricated by two binary electroplating and the intermetallic compounds(IMCs) was estimated quantitatively. When the micro Sn-Ag solder bump was made by electroplating, SiC powder was added in the plating solution for protecting of intermetallic growth. Then, the intermetallic compounds growth was decrease with increase of amount of SiC power. However, if the mount of SiC particle exceeds 4 g/L, the effect of the growth restraint decrease rapidly.