• 한국방사성폐기물학회:학술대회논문집
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• 한국방사성폐기물학회 2004년도 Proceedings of the 4th Korea-China Joint Workshop on Nuclear Waste Management
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• pp.165-169
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• 2004

It was studied on the reductive extraction between the eutectic salt and Bi metal phases. The solutes were zirconium and the rare earth elements, where zirconium was used as the surrogate for the transuranic(TRU) elements. All the experiments were performed in a glove box filled with argon gas. Two types of experimental conditions were used -high and low initial solute concentrations in salt. Li-Bi alloy was used as a reducing agent to reduce the high chemical activity of Li. The reductive extraction characteristics were examined using ICP, XRD and EPMA analysis. Zirconium was successfully separated from the rare earth elements by the reductive extraction method. The LiF-NaF-KF system was favorable among the fluoride salt systems, whereas the LiCl-KCl system was favorable among the chloride salt systems. When the solute concentrations were high, intermetallic compounds were found near the salt-metal interface.

• 한국재료학회지
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• 제34권3호
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• pp.170-174
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• 2024

In this study, we report the microstructural evolution and shear strength of an Sn-Sb alloy, used for die attach process as a solder layer of backside metal (BSM). The Sb content in the binary system was less than 1 at%. A chip with the Sn-Sb BSM was attached to a Ag plated Cu lead frame. The microstructure evolution was investigated after die bonding at 330 ℃, die bonding and isothermal heat treatment at 330 ℃ for 5 min and wire bonding at 260 ℃, respectively. At the interface between the chip and lead frame, Ni₃Sn₄ and Ag₃Sn intermetallic compounds (IMCs) layers and pure Sn regions were confirmed after die bonding. When the isothermal heat treatment is conducted, pure Sn regions disappear at the interface because the Sn is consumed to form Ni₃Sn₄ and Ag₃Sn IMCs. After the wire bonding process, the interface is composed of Ni₃Sn₄, Ag₃Sn and (Ag,Cu)₃Sn IMCs. The Sn-Sb BSM had a high maximum shear strength of 78.2 MPa, which is higher than the required specification of 6.2 MPa. In addition, it showed good wetting flow.

• 한국재료학회지
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• 제17권6호
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• pp.293-297
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• 2007

Microstructure and tensile strength of the vacuum brazed stainless steel(STS303) and Cu were investigated. For brazing, the BNi-2, 3, 4, 6 and 7 (A.W.S standard) were used as filler metals. The Oxides such as $Cr_2O_3$ and $SiO_2$ were observed at brazed layers between STS303 and Cu matrix. Also, the intermetallic compounds of Cr-B and Ni-P were observed at brazed layers. Brazed STS303-Cu specimens with BNi-2, 3, 4 filler metals showed almost elastic deformation followed by plastic yielding and strain hardening up to a peak stress. On the other hand, it is likely that the fracture of the brazed specimens with BNi-6 and 7 was occurred in elastic range without plastic yielding up to a peak stress. Among these filler metals, the BNi-2 brazed at $1050^{\circ}C$ showed excellent wettability and the highest tensile strength (101.6MPa).

• 마이크로전자및패키징학회지
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• 제14권4호
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• pp.27-36
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• 2007

본 논문에서는 다양한 조성의 주석-은-구리 합금계 솔더볼과 ENIG 및 Cu-OSP 패드와의 계면 반응에 대해 연구하였다. ENIG 패드와 미량의 Sb이 첨가된 합금 솔더와의 계면 반응 시 다른 솔더에 비해 매우 얇은 100 nm 내외의 두께를 가진 P-rich Ni layer가 형성되었다. 미량의 Ni이 첨가된 합금 솔더와 Cu-OSP 금속 패드와의 계면 반응 시에는 다른 솔더와는 달리 균일한 두께의 $Cu_6Sn_5$ 금속간화합물이 형성되었으며 추가 리플로우 시에 금속간화합물 입자가 거의 성장하지 않았다. 또한 $150^{\circ}C$의 장시간 열처리 시에 다른 솔더에 비해 매우 얇은 두께의 $Cu_3Sn$ 금속간화합물이 형성되었다.

• 한국재료학회지
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• 제11권9호
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• pp.733-739
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• 2001

In Al-25Nb binary system, it was observed only formation of $D0_{22}$ $Al_3Nb$ intermetallic compound after 5hr milling but it was not observed formation of meta stable phase like L1$_2$ phase. In this state, $D0_{22}$ $Al_3Nb$ fabricated had nano sized grain of approximately 20nm. Ternary systems, transition metals such as Cr, Cu, Fe, Mn were added 6~12at.% as substitution of Al, showed formation of $D0_{22}$ $Al_3Nb$ like Al-25Nb binary system. In Al- l2Cu-25Nb system, it was observed that broad XRD pattern like amorphization of Al and not observed formation of $D0_{22}$ $Al_3Nb$ after 5hr milling. But there was mixed phase of a lot of amorphous Al and little $D0_{22}$ $Al_3Nb$ through TEM. In the states of unalloyed, 5~7hr milling time, those showed exothermic reaction at 35$0^{\circ}C$, which was formation of $D0_{22}$ $Al_3Nb$ like Al-25Nb binary system. With increasing milling time to 10hr, $D0_{22}$ $Al_3Nb$ was transformed to mixed phase of amorphous and nanocryatlline, having approximately 10nm grain but the meta stable $Al_3Nb$ was not fabricated by adding transition metals.

• 한국주조공학회지
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• 제25권6호
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.

• 한국주조공학회지
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• 제17권4호
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• pp.338-346
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• 1997

Mechanical properties of ($10%Al_2O_3{\cdot}SiO_2+5%Ni$)/Al hybrid composites fabricated by the reaction squeeze casting were compared with those of ($15%Al_2O_3{\cdot}SiO_2$)/Ai composites. Al-Ni intermetallic compounds ($10{\sim}20 {\mu}m$) formed by the reaction between nickel powder and molten aluminum were uniformly distributed in the Al matrix. These intermetallic compounds were identified as $Al_3Ni$ using X-ray diffraction analysis and they resulted in beneficial effects on room and high temperature strength and wear resistance. Microhardness values of ($10%Al_2O_3{\cdot}SiO_2+5%Ni$)/Al hybrid composite were greater by about 100Hv than those of ($15%Al_2O_3{\cdot}SiO_2$)/Al composite. Wear resistance of ($10%Al_2O_3{\cdot}SiO_2+5%Ni$)/Al hybrid composites was superior to that of ($15%Al_2O_3{\cdot}SiO_2$)/Al composites regardless of the applied load. While tensile and yield strength of ($10%Al_2O_3{\cdot}SiO_2+5%Ni$)/Al hybrid composites were greater at room temperature and $300^{\circ}C$, strength drop at high temperature was much smaller in hybrid composites.

• 마이크로전자및패키징학회지
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• 제29권2호
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• pp.73-79
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• 2022

본 연구에서는 최근 저온접합 소재로 각광받고 있는 Ga과 대표적인 전극 물질인 Cu와의 반응연구를 실시하여 저온 솔더링 적용시 필요한 정보들을 확인하고자 하였다. 80-200℃ 온도범위에서 Ga과 Cu/Au 기판을 반응시켜 계면반응 및 금속간화합물(IMC) 성장을 관찰하고 분석하였다. 반응계면에서 성장하는 주요한 IMC는 CuGa₂ 상이었으며 그 상부에는 작은 입자크기를 가지는 AuGa₂ IMC 그리고 하부에는 얇은 띠 형상의 Cu₉Ga₄ IMC가 형성되었다. CuGa₂ 입자들은 scallop 형상을 보이며 Cu₆Sn₅ 성장의 경우와 비슷하게 반응시간이 증가함에 따라서 큰 형상변화없이 입자 크기가 증가하였다. CuGa₂ 성장기구를 분석한 결과 120-200℃ 온도범위에서 시간지수는 약 3.0으로 산출되었고, 활성화에너지는 17.7 kJ/mol로 측정되었다.

• 한국표면공학회지
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• 제29권4호
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• pp.278-285
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• 1996

The structure of coating layer formed by hot dip Al-Cu alloy coating on Monel 1400 metal was studied. The coating layer consists of alloyed layer adjacent to the Monel 400 substrate and Al-Cu alloy. It was found that the hardness of coating increased with dipping time and heat treatment associated with the diffusion and the formation of intermetallic compound at the interface. However the thickness of coating layer was decreased at high dipping temperature due to tile higher viscosity of liquid coating alloy. Diffusion heat treatment at $600^{\circ}C$ after coating resulted in the disappearence of adhered Al(Cu) and $CuAl_2$ phases, and then they transformed into the new phases of CuAl and Al7Cu4Ni at coating layer.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1999년도 특별강연 및 추계학술발표대회 개요집
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• pp.297-298
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• 1999

Cemented carbides material (WC-Co hard alloy) were recognized very important and expensive tool or die assembly parts because of compose for the main elements of rare metal (W and Co etc). This research was developed to separate and recover of WC fine powder contained by WC-Co materials. Recycling process was a new method named by the Tin impregnation for decobaltification on cemented carbides. This reaction occurred to product a brittle Co-Sn intermetallic compounds, thereafter it carried out by acid cleaning solution and physical milling or powdering. New process was able to recover about 60％ WC fine powder from 1 to 5 ${\mu}{\textrm}{m}$.