• Journal of Mechanical Science and Technology
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• 제16권9호
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• pp.1078-1083
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• 2002

Ceramics are significantly used in many industrial applications due to their excellent mechanical and thermal properties such as high temperature strength, low density, high hardness, low thermal expansion, and good corrosion resistive properties, while their disadvantages are brittleness, poor formability and high manufacturing cost. To combine advantages of ceramics with those of metals, they are often used together as one composite component, which necessiates reliable joining methods between metal and ceramic. Direct brazing using an active filler metal has been found to be a reliable and simple technique, producing strong and reliable joints. In this study, the fracture characteristics of Si$_3$N$_4$ ceramic joined to ANSI 304L stainless steel with a Ti-Ag-Cu filler and a Cu (0.25-0.3 mm) interlayer are investigated as a function of strain rate and temperature. In order to evaluate a local strain a couple of strain gages are pasted at the ceramic and metal sides near joint interface. As a result the 4-point bending strength and the deflection of interlayer increased at room temperature with increasing strain rate. However bending strength decreased with temperature while deflection of interlayer was almost same. The fracture shapes were classified into three groups ; cracks grow into the metal-brazing filler line, the ceramic-brazing filler line or the ceramic inside.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1142-1143
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• 2006

Kinik Company pioneered diamond pad conditioners protected by DLC barrier ($DiaShield^{(R)}$ Coating) back in 1999 (Sung & Lin, US Patent 6,368,198). Kink also evaluated Cermet Composite Coating (CCC or $C^3$, patent pending) with a composition that grades from a metallic (e.g. stainless steel) interlayer to a ceramic (e.g. $Al_2O_3$ or SiC) exterior. The metallic interlayer can form metallurgical bond with metallic matrix on the diamond pad conditioner. The ceramic exterior is both wear and corrosion resistant. The gradational design of $C^3$ coating will assure its strong adherence to the substrate because there is no weak boundary between coating and substrate.

• 한국표면공학회지
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• 제36권1호
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• pp.9-13
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• 2003

Plasma polymerized organic thin films were deposited on Si(100), glass and metal substrates at $25∼100 ^{\circ}C$ using thiophene and toluene precursors by PECVD method. In order to compare physical and electrochemical properties of the as-grown thin films, the effects of the RF plasma power in the range of 30∼100 W and deposition temperature on both corrosion protection efficiency and physical properties were studied. We found that the corrosion protection efficiency ($P_{k}$), which is one of the important factors for corrosion protection in the interlayer dielectrics of microelectronic devices application, was increased with increasing RF power. The highest $P_{k}$ value of plasma polymerized toluene film (85.27% at 70 W) was higher than that of the plasma polymerized thiophene film (65.17% at 100 W), indicating inhibition of oxygen reduction. The densely packed and tightly interconnected toluene film could act as an efficient barrier layer to the diffusion of molecular oxygen. The result of contact angle measurement showed that the plasma polymerized toluene films have more hydrophobic surface than those of the plasma polymerized thiophene films.

• 한국표면공학회지
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• 제39권5호
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• pp.199-205
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• 2006

Titanium nitride (TiN) coatings were produced on AISI 420 stainless steel by DC magnetron sputtering of a Ti target changing the processing variables, such as the flow rate of $N_2/Ar$, substrate temperature and the existence of Ti interlayer between TiN coatings and substrates. The hardness and residual stress in the films were investigated using nanoindentation and a laser scanning device, respectively. The stoichiometry and surface morphology were investigated using X-Ray Diffraction and SEM. The corrosion property of the films was also studied using a polarization method in NaCl (0.9%) solution. Mechanical properties including hardness and residual stress were related to the ratio of $N_2/Ar$ flow rate. The corrosion resistance also was related to the processing variables.

• 한국재료학회지
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• 제7권3호
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• pp.203-212
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• 1997

This paper evaluated the feasibility of laser consolidation for improving the properties of the plasma coated layer, Further, the mechanim of the degradation sequence of the chrome carbide layer applied on the turbine blades was postualted. The laser consolidation could be successfully applied for improcing the surface properties of the plasma coated blade, if a proper condition was carefully chosen. The consolidated layer had erosion & corrosion resistance and vond strength superiro to those of the as-plasma coated layer. The properties of the consolidated layer were strongly dependent upon the degree of dilution, especially on the Fe pickup from the substrate. The degradation of the plasma coating layer was thought to be a reault of the repeating action of the solid particle erosion, corrosion penetration through the pores and oxide films formed along the interlayer surface and impact spalling.

• 한국표면공학회지
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• 제36권1호
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• pp.74-78
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• 2003

The corrosion failure of electronic devices has been a major reliability concern lately. This failure is an ongoing concern because of miniaturization of integrated circuits (IC) and the increased use of polymers in electronic packaging. Recently, plasma-polymerized cyclohexane films were considered as a possible candidate for a interlayer dielectric for multilever metallization of ultra large scale integrated (ULSI) semiconductor devices. In this paper the protective ability of above films as a function of deposition temperature and RF power in an 3.5 wt.% NaCl solution were examined by polarization measurement. The film was characterized by FTIR spectroscopy and contact angle measurement. The protective efficiency of the film increased with increasing deposition temperature and RF power, which induced the higher degree of cross-linking and hydrophobicity of the films.

• 마이크로전자및패키징학회지
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• 제6권1호
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• pp.75-79
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• 1999

차세대 저유전상수 층간 절연막중 하나로 대두되고 있는 polyimide를 플라즈마에 노출시키고 이때 나타나는 전기적 특성변화를 살펴보았다. polyimide를 알루미늄 식각시 사용되고 있는 Cl-based 플라즈마에 노출시켰을때 유전상수가 약간 증가함을 볼 수 있었고, F-based 플라즈마로 $SF_{6}$ 플라즈마에 노출시켰을 때는 유전상수 감소를 볼 수 있었다. 이는 fluorine또는 chlorine bond의 생성과 관련된 것으로 FTIR과 XPS분석을 통해 확인할 수 있었다. 따라서 Cl-based 플라즈마로 알루미늄 식각 후 $SF_{6}$플라즈마에 노출시킴으로써 이 부식문제의 해결뿐만 아니라 po1yimide의 유전상수도 낮출 수 있으리라 기대된다.

• 한국재료학회지
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• 제20권4호
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• pp.187-193
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• 2010

Chromium nitride (CrN) samples with two different layer structures (multilayer and single layer) were coated on bipolar plates of polymer electrolyte membrane fuel cells (PEMFC) using the reactive sputtering method. The effects with respect to layer structure on corrosion resistance and overall cell performance were investigated. A continuous and thin chromium nitride layer ($Cr_{0.48}\;N_{0.52}$) was formed on the surface of the SUS 316L when the nitrogen flow rate was 10 sccm. The electrochemical stability of the coated layers was examined using the potentiodynamic and potentiostatic methods in the simulated corrosive circumstances of the PEMFC under $80^{\circ}C$. Interfacial contact resistance (ICR) between the CrN coated sample and the gas diffusion layer was measured by using Wang's method. A single cell performance test was also conducted. The test results showed that CrN coated SUS316L with multilayer structure had excellent corrosion resistance compared to single layer structures and single cell performance results with $25\;cm^2$ in effective area also showed the same tendency. The difference of the electrochemical properties between the single and multilayer samples was attributed to the Cr interlayer layer, which improved the corrosion resistance. Because the coating layer was damaged by pinholes, the Cr layer prevented the penetration of corrosive media into the substrate. Therefore, the CrN with a multilayer structure is an effective coating method to increase the corrosion resistance and to decrease the ICR for metallic bipolar plates in PEMFC.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2003년도 추계학술발표회초록집
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• pp.119-119
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• 2003

Plasma polymerized organic thin films were deposited on Si(100) glass and Copper substrates at 25 ∼ 100 $^{\circ}C$ using cyclohexane and ethylcyclohexane precursors by PECVD method. In order to compare physical and electrochemical properties of the as-grown thin films, the effects of the RF plasma power in the range of 20∼50 W and deposition temperature on both corrosion protection efficiency and physical properties were studied. We found that the corrosion protection efficiency (P$\_$k/), which is one of the important factors for corrosion protection in the interlayer dielectrics of microelectronic devices application, was increased with increasing RF power. The highest P$\_$k/ value of plasma polymerized ethylcyclohexane film (92.1% at 50 W) was higher than that of the plasma polymerized cyclohexane film (85.26% at 50 W), indicating inhibition of oxygen reduction. Impedance analyzer was utilized for the determination of I-V curve for leakage current density and C-V for dielectric constants. To obtain C-V curve, we used a MIM structure of metal(Al)-insulator(plasma polymerized thin film)-metal(Pt) structure. Al as the electrode was evaporated on the ethylcyclohexane films that grew on Pt coated silicon substrates, and the dielectric constants of the as-grown films were then calculated from C-V data measured at 1㎒. From the electrical property measurements such as I-V ana C-V characteristics, the minimum dielectric constant and the best leakage current of ethylcyclohexane thin films were obtained to be about 3.11 and 5 ${\times}$ 10$\^$-12/ A/$\textrm{cm}^2$ and cyclohexane thin films were obtained to be about 2.3 and 8 ${\times}$ 10$\^$-12/ A/$\textrm{cm}^2$.

• Nuclear Engineering and Technology
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• 제41권1호
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• pp.21-38
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• 2009

The use of multi scale modeling concepts and simulation techniques to study the destabilization of an ultrathin layer of oxide interface between a metal substrate and the surrounding environment is considered. Of particular interest are chemo-mechanical behavior of this interface in the context of a molecular-level description of stress corrosion cracking. Motivated by our previous molecular dynamics simulations of unit processes in materials strength and toughness, we examine the challenges of dealing with chemical reactivity on an equal footing with mechanical deformation, (a) understanding electron transfer processes using first-principles methods, (b) modeling cation transport and associated charged defect migration kinetics, and (c) simulation of pit nucleation and intergranular deformation to initiate the breakdown of the oxide interlayer. These problems illustrate a level of multi-scale complexity that would be practically impossible to attack by other means; they also point to a perspective framework that could guide future research in the broad computational science community.