• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.312-316
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• 1999

The interfacial structure of duplex treated AISI 4140 consisting of iron nitride and TiN layer was characterized by optical microscope, SEM and XRD. A black layer was formed from the decomposition of iron nitride during Ti ion bombardment. The black layer was characterized as an a-Fe phase transformed from the iron nitride by XRD. In order to identify the formation mechanism of the black layer, a thermal analysis of iron nitride undertaken by DSC method. As an iron nitride was mostly consisted of ${\gamma}$'-Fe$_4$N and $\varepsilon$-$Fe_3$N phase after plasma nitriding, in this study, a ${\gamma}$'$-Fe_4$N and $\varepsilon$-$Fe_3$N powders were separately prepared by the different processing conditions of gas nitriding of iron powder in the fluidized bed. From the DSC thermal analysis, the phase transformation of ${\gamma}$'$-Fe_4$N, $\varepsilon$-$Fe_3$N was followed the path of transformation; $ \Upsilon{'}-Fe_4$Nlongrightarrow${\gamma}$-Felongrightarrowa-Fe and of $\varepsilon$-$Fe_3$Nlongrightarrow$\varepsilon$-$Fe_{2.5}$ /N+${\gamma}$'$-Fe_4$Nlongrightarrow${\gamma}$'-Fe$_4$Nlongrightarrow${\gamma}$longrightarrowFelongrightarrowalongrightarrowFe, respectively. It explains the reason why the $\varepsilon$ $-Fe_3$N phase disappeared in the first time and then ${\gamma}$'-Fe$_4$N in the formation of the black layer in the duplex coating.

• Proceedings of the Korea Concrete Institute Conference
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• 1999.10a
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• pp.131-134
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• 1999

Microstructure modification and electrochemical properties are investigate to estimate the effects of internal chlorides on the steel corrosion in the blended cement systems. According to the test results, slag cement system showed high chloride binding capacity and low corrosion rate. The impedance data showed three distince arcs from lowest(mHz) frequency to highest (MHz) frequency due to product layer, interfacial reaction and bulk matrix. Through the microstructural investigation, fine steel-matrix interface of slag cement system was observed but rough steel-matrix interface of OPC system was observed. Friedel's salt was thought that the substantial material contributed to the chloride binding of slag cement system.

• Journal of the Korean Ceramic Society
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• v.30 no.3
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• pp.206-214
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• 1993

Coherent precipitation of Zn3P2 during Zn diffusion in a GaInAsP/InP heterostructure was studied using high-resolution transmission electron microscopy. Zn-diffusion-induced intermixing of Ga and In across the GaInAsP/InP heterointerface provided a Ga-mixed InP region which was nearly lattice-matched with Zn3P2 crystal and thus allowed thecoherent precipitation of Zn3P2. The Zn3P2 precipitates were preferentially nucleated at stacking faults which were formed to relax interfacial strain built up by the intermixing. The precipitates were grown to planar epitaxial layer along (100) plane in the lattice-matched region. The TEM images and diffraction pettern revealed that the tetragonal Zn3P2 crystals were coherently matched to the fcc structured GaInP matrix by the {{{{ SQRT {2} $\times$ SQRT {2} $\times$2 }} arrangement. The precipitation reaction of Zn3P2 was explained by an atomic migration model based on the kick-out mechanism.

• Journal of the Korean Ceramic Society
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• v.29 no.6
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• pp.496-504
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• 1992

Alumina tubes suitable for the support of gas separation membranes have been prepared by the slipcasting technique. These supports have the average pore size of 0.1 ${\mu}{\textrm}{m}$ within the narrow distribution. The sol-gel dipcoating process of nanoparticulate sols is very sensitive to microstructure of the support, and the coating on the inside surface of the tube is found to be more successful than on the outside surface. Nanoparticulate silica sols (0.82 mol/ι) have been synthesized by an interfacial hydrolysis reaction between TEOS and high alkaline water. When coating an alumina tube with these sols, the minimum limits of the particle size and the aging time required for forming the coated gel layer at the given pH are provided. It is optimum to coat the support with less concentrated sols stabilized through aging for the appropriate time (more than 22 days) at the lower pH (pH 2.0) for producing a reproducible crack free thin film coating in composite membranes.

• Journal of the Korean Ceramic Society
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• v.33 no.3
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• pp.251-258
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• 1996

The reactions between an active metal brazing alloy and interlayers together with the effects of interlayer type on the interfacial microstructure change were investiaged for silicon nitride/stainless steel joint. The bending strengths were measured for joints with Mo, Cu, Ni interlayer type of different thicknesses. It was found that the interlayer with a low yield strength value is effective to improve the bending strength of the Si3N4/stainless steel joint. The maximum joint strength obtained at room temperature for a laminated Cu/Mo interlayer was about 460 MPa. The combined use of Mo and thin Cu layer was found to be effective in enhancing the bending strength for the Si3N4/S.S.316 joint.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.133-137
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• 2003

The effect of Bi additions to the eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compound (IMC) layers during solid-state aging of Sn-Ag-Bi/Cu solder joints has been Investigated. The Bi additions enhanced the growth rate of the total IMC layer comprising of $Cu_6Sn_5$ and $Cu_3Sn$ sublayers. This enhanced IMC growth rate was primarily due to the rapid increase In the growth rate of $Cu_6Sn_5$ sublayer. The growth rate of $Cu_3Sn$ sublayers was little influenced and appeared to be retarded by the Bi additions. The observed growth behavior of $Cu_6Sn_5$ and $Cu_3Sn$ sublayers could be understood if the interfacial reaction barrier at the $Cu_6Sn_5/solder$ interface were reduced by the segregation of Bi at the interface.

• Applied Microscopy
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• v.46 no.3
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• pp.167-169
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• 2016

Solder/electroless nickel immersion gold (ENIG) joint sample which is comprised of dissimilar materials with different mechanical properties has limited the level of success in preparing thin samples for transmission electron microscopy (TEM). This short technical note reports the operation parameters for ultramicrotomy of solder joint sample and TEM analysis results. The solder joint sample was successfully sliced to 50~70 nm thick lamellae at slicing speed of 0.8~1.2 mm/s using a boat-type $45^{\circ}$ diamond knife. Ultramicrotomy can be applied as a routine sample preparation technique for TEM analysis of solder joints.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.609-609
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• 2013

나노선은 대표적인 일차원 나노구조로 높은 부피-표면적 비율과, 조절 가능한 밴드갭 에너지, 뛰어난 광학적/전기적 특성으로 인해 다양한 잠재적 응용처를 가지며, 많이 연구되고 있다. 특히 ZnO 나노선은 대표적인 광촉매로, 높은 감광성과 높은 부피-표면적 비율 등의 특징을 가지지만, 상대적으로 넓은 밴드갭 에너지 때문에 가시광선 영역을 사용하지 못하는 단점이 있다. 본 연구에서는 CuS 나노입자/ZnO 나노선 이종구조를 간단한 두 가지의 방법으로 합성하였다. ZnO 나노선은 간단한 수열합성 방법으로 합성하였고, 그 위에 CuS 나노입자를 successive ionic layer adsorption and reaction (SILAR) 방법으로 증착하였다. 합성된 나노 구조는 기존의 ZnO 구조와는 달리 가시광 영역에서도 향상된 광촉매 특성을 보였으며, 이는 ZnO와 CuS사이의 interfacial charge transfer (IFCT)에서 기인한 것이다. SEM, TEM, XRD를 통해 CuS/ZnO 이종구조의 형태와 결정구조, 구성성분을 분석할 수 있었고, Acid Orange 7의 광분해 실험을 통해 향상된 광촉매 특성을 확인 할 수 있었다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.75-87
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• 2001

Three different kinds of substrate used in this study : bare Cu substrate, Ni-P/Cu substrate with a Ni-P layer thickness of $5\mu\textrm{m},$ and Au/Ni-P/Cu substrate with the Ni-P and Au layers of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness respectively. The wettability of various Sn-base solders was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the Au/Ni-F/Cu substrate, Sn-base solders wet better than any of the other substrate metal finishes tested. The interfacial reaction between various substrate and Sn-base solder was investigated at $70^{\circ}C,$ $100^{\circ}C,$ $120^{\circ}C,$ $150^{\circ}C,$ $170^{\circ}C$ and $200^{\circ}C$ for reaction times ranging from 0 day to 60 day. Intermetallic phases was formed along a Sn-base solder/ various substrate interface during solid-state aging. The apparent activation energy for growth of Sn-Ag/Cu, Sn-Ag-Bi/Cu, and Sn-Bi/Cu couples were 65.4, 88.6, and 127.9 Kj/mol, respectively. After isothermal aging, the fracture surface shoved various characteristics depending on aging temperature and time, and the types of BGA pad.

• Journal of the Korean Ceramic Society
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• v.55 no.5
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• pp.498-503
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• 2018

Using the thermal ablation method, the oxidation behavior of $SiC_f/SiC$ composites was investigated in air and in the temperature range of $1,300^{\circ}C$ to $2,000^{\circ}C$. At the relatively low temperature of $1,300^{\circ}C$, passive oxidation, which formed amorphous phase, predominantly occurred in the thermal ablation test. When the oxidation temperature increased, SiO (g) and CO (g) were formed by active oxidation and the dense oxide layer changed to a porous one by vaporization of gas phases. In the higher temperature oxidation test, both active oxidation due to $SiO_2$ decomposition on the surface of the oxide layer and active/passive oxidation transition due to interfacial reaction between oxide and base materials such as SiC fiber and matrix phase simultaneously occurred. This was another cause of high temperature degradation of $SiC_f/SiC$ composites.