• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.8
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• pp.34-41
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• 1993

Effect of high temperature annealing conditions on Ta$_{2}O_{5}$ thin films was investigated. Ta$_{2}O_{5}$ thin films were deposited on P-type silicon substrates by plasma-enhanced chemical vapor deposition (PECVD) using tantalum ethylate. Ta(C$_{2}H_{5}O)_{5}$, and nitrous oxide. N$_{2}$O. The microstructure changed from amorphous to polycrystalline above 700.deg. C annealing temperature. The refractive index, dielectric onstant and leakage current of the film increased as annealing temperature increased. However, annealing in oxygen ambient reduced leakage currents and dielectric constant due to the formation of interfacial SiO$_{2}$ layer. By optimizing annealing temperature and ambient, leakage current lower than 10$^{-8}$ A/cm$^{2}$ and maximum capacitance of 9 fF/${\mu}m^{2}$ could be obtained.

• Bulletin of the Korean Chemical Society
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• v.35 no.12
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• pp.3583-3589
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• 2014

This study evaluated a simple and useful route to the synthesis of mesoporous $TiO_2$ microcapsules with a hollow macro-core structure. A hydrophilic precursor sol containing the surfactants in the hydrophobic solvents was deposited on PMMA polymer surfaces modified by non-thermal plasma to produce mesoporous shells after calcination. The surface of the PMMA polymer spheres was coated with $NH_4F$ and CTAB to control the interfacial properties and promote the subsequent deposition of inorganic sols. These hollow type mesoporous $TiO_2$ microcapsules could be applied as an efficient substrate for the immobilization of DNA oligonucleotides.

• 한국초전도학회:학술대회논문집
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• v.10
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• pp.140-140
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• 2000

The effects of partial pressures of various gases on the qualities of coated conductors are studied, where the long samples were fabricated in a vacuum of a large physical vapour deposition system. The various gases such as $0_25,$H_2$,H_20$,$C_n H_m$, and CO come out from the large heating system and gives somewhat complicated effects on the interfacial chemistry at CeO/Ni which Is Important for the epitaxial growth of the film. The results of XRD measurements on the films fabricated in the controlled partial pressures of thoes gases will be presented.

• Journal of Industrial Technology
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• v.19
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• pp.101-105
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• 1999

Ultra thin $Ta_2O_5$ gate dielectrics were prepared by RTMOCVD (rapid thermal metal organic chemical vapor deposition) using Ta source $TaC_{12}H_{30}O_5N$ and $O_2$ gaseous mixtures. As a result, $Ta_2O_5$ thin films showed significantly low leakage current compared to $SiO_2$ of identical thickness, which was due to the stabilization of the interfacial layer by NO ($SiO_xN_y$) passivation layer. The conduction of leakage current in $Ta_2O_5$ thin films was described by the hopping mechanism of Poole-Frenkel (PF) type.

• Korean Journal of Materials Research
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• v.1 no.1
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• pp.9-17
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• 1991

TiC coating formed on $Si_3N_4-TiC$ composite ceramic by chemical vapor deposition (CVD) has an improved microstructures, better thermal shock resistance and interfacial bonding than TiN coating does. TiN coating formed by CVD, however, has lower friction coefficients against steels and better chemical stability. The experimental results indicate that the coated insert is superior to the uncoated one in flank and crater wear resistance. And the multilayer coating shows an improved wear resistance than the monolayer coating.

• Tribology and Lubricants
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• v.4 no.2
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• pp.44-51
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• 1988

Titanium carbide(TiC), Titanium nitride(TiN), and Titanium carbonnitride(Ti(C,N)) films were deposited on $Si_3N_4$-TiC composite cutting tools by chemical vapor deposition(CVD) using $TiCl_4-CH_4-H_2$, $TiCl_4-N_2-H_2$, and $TiCl_4-CH_4-N_2-H_2$ gas mixtures, respectively. The experimental results indicate that TiC coatings compared with TiN coatings on $Si_3N_4$ -TiC ceramic have an improved microstructural property, good thermal shock resistance, and good interfacial bonding. However TiN coatings compared with TiC coatings have a low friction coefficient with steel and good chemical stability. It is found by cutting test that coated insert compared with $Si_3N_4$-TiC ceramic have a superior flank and crater wear resistance. And multilayer coating compared with monolayer coating shows a improved wear resistance.

• Journal of the Korean institute of surface engineering
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• v.56 no.1
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• pp.77-83
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• 2023

The reliability of leadframe-based semiconductor package depends on the adhesion between metal and epoxy molding compound (EMC). In this study, the Ag surface was electrochemically treated in a solution containing silanes in order to improve the adhesion between Ag and epoxy substrate. After electrochemical treatment, the thin silane layer was deposited on the Ag surface, whereby the peel strength between Ag and epoxy substrate was clearly improved. The improvement of peel strength depended on the functional group of silane, implying the chemical linkage between Ag and epoxy.

• Progress in Superconductivity and Cryogenics
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• v.8 no.4
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• pp.19-21
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• 2006

Biaxially textured Ni was fabricated by electrodeposition process and delaminated from the biaxially textured cathode surface for further buffer layer deposition process. Those electrode posited Ni substrates showed well-developed biaxial texture and smooth surface. In order to improve the thermal stability of Ni substrates, Mn was alloyed by adding Mn precursor into the electrodeposition bath. Subsequently, $CeO_2$ buffer layers are deposited by MOD process to prevent interfacial reaction between superconductor and substrates. In particular, Bismuth oxide was added to $CeO_2$ to realize lower temperature processing of buffer layers. The microstructure and texture development of each layers have been investigated. Preliminary results shows that all electro/chemical process can be a candidate for cost effective route to YBCO coated conductor.

• Journal of Powder Materials
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• v.18 no.2
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• pp.159-167
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• 2011

The influence of sulfate on the selective catalytic reduction of $NO_x$ on the Ag/$Al_2O_3$ catalyst was studied when $CH_4$ was used as a reducing agent. Various preparation methods influenced differently on the $deNO_x$ activity. Among the methods, cogelation precipitation gave best activity. When sulfates were formed on the surfaces of samples prepared by impregnated and deposition precipitation, $deNO_x$ activity was enhanced as long as suitable forming condition is satisfied. The major sulfate formed in Ag/$Al_2O_3$ catalyst was the aluminum sulfate and it seems that this sulfate acted as a promoter. When Mg was added to the Ag/$Al_2O_3$ catalyst it promoted $deNO_x$ activity at high temperature. Intentionally added sulfate also enhanced $deNO_x$ activity, when their amount was confined less than 3 wt%.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.7
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• pp.1713-1721
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• 1994

Intermetallic-matrix composites(IMCs) have the potential of combing matrix properties of oxidation resistance and high temperature stability with reinforcement properties of high specific strength and modulus. One of the major limiting factors for successful applications of these composite at high temperatures is the formation of interfacial reactions between matrix and ceramic reinforcement during composite process and during service. The purpose of the present investigation is to develop a better understanding of the nature of creep fracture mechanisms in a $Ni_{3}Al$ composite reinforced with both $TiB_{2}$ and SiC particulates. Emphasis is placed in the roles of the products of the reactions in determining the creep lifetime of the composite. In the present study, creep rupture specimens were tested under constant ranging from 180 to 350 MPa in vacuum at $760^{\cric}C$. The experimental data reveal that the stress exponent for power law creep for the composite is 3.5, a value close to that for unreinforced $Ni_{3}Al$. The microstructural observations reveal that most of the cavities lie on the grain boundaries of the $Ni_{3}Al$ matrix as opposed to the large $TiB_{2}/Ni_{3}Al$ interfaces, suggesting that cavities nucleate at fine carbides that lie in the $Ni_{3}Al$ grain boundaries as a result of the decomposition of the $SiC_{p}$. This observation accounts for the longer rupture times for the monolicthic $Ni_{3}Al$ as compared to those for the $Ni_{3}Al/SiC_{p}/TiB_{2} IMC$. Finally, it is suggested that creep deformation in matrix appears to dominate the rupture process for monolithic $Ni_{3}Al$, whereas growth and coalescence of cavities appears to dominate the rupture process for the composite.