• 제목/요약/키워드: Interfacial bonding force

검색결과 14건 처리시간 0.025초

다양한 사이징제가 반응중합에 의해 제조된 나일론 6/탄소섬유 복합체의 물성에 미치는 영향 (Effect of Various Sizing Agents on the Properties of Nylon6/Carbon Fiber Composites Prepared by Reactive Process)

  • 박하늘;이학성;허몽영
    • Composites Research
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    • 제31권6호
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    • pp.299-303
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    • 2018
  • 탄소섬유 강화 PA6 복합재료의 탄소섬유-메트릭스간 계면결합력과 반응중합도 향상을 위해서 기존 탄소섬유의 에폭시 사이징제를 디사이징처리하여 에폭시를 제거한 후 우레탄계, 나일론계, 페녹시계 사이징제로 재처리해주었으며, 리사이징처리된탄소섬유의표면을관찰하였다. 리사이징처리된탄소섬유의계면결합력은 IFSS(Interfacial shear strength)를 통해서 확인하였으며, 계면 결합 강도 측정 후 파단면은 주사전자현미경을 통해서 관찰하였다. 나일론계와 페녹시계 사이징제로 처리된 탄소섬유가 우레탄계 사이징에 비해 계면 결합력이 상승한 것을 확인하였다. 우레탄계 리사이징 처리된 탄소섬유는 기존 에폭시 사이징 탄소섬유보다 계면 결합력이 감소한 것으로 확인되었다. 이 결과는 기존 탄소섬유의 저활성과 평활성을 제거하여 탄소섬유와 나일론6 사이의 계면 결합력이 향상된 것으로 판단된다.

Desmear 습식 표면 전처리가 무전해 도금된 Cu 박막과 FR-4 기판 사이의 계면 접착 기구에 미치는 영향 (Effect of Desmear Treatment on the Interfacial Bonding Mechanism of Electroless-Plated Cu film on FR-4 Substrate)

  • 민경진;박영배
    • 한국재료학회지
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    • 제19권11호
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    • pp.625-630
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    • 2009
  • Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

Simplified beam model of high burnup spent fuel rod under lateral load considering pellet-clad interfacial bonding influence

  • Lee, Sanghoon;Kim, Seyeon
    • Nuclear Engineering and Technology
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    • 제51권5호
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    • pp.1333-1344
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    • 2019
  • An integrated approach of model simplification for high burnup spent nuclear fuel is proposed based on material calibration using optimization. The spent fuel rods are simplified into a beam with a homogenous isotropic material. The proposed approach of model simplification is applied to fuel rods with two kinds of interfacial configurations between the fuel pellets and cladding. The differences among the generated models and the effects of interfacial bonding efficiency are discussed. The strategy of model simplification adopted in this work is to force the simplified beam model of spent fuel rods to possess the same compliance and failure characteristics under critical loads as those that result in the failure of detailed fuel rod models. It is envisioned that the simplified model would enable the assessment of fuel rod failure through an assembly-level analysis, without resorting to a refined model for an individual fuel rod. The effective material properties of the simplified beam model were successfully identified using the integrated optimization process. The feasibility of using the developed simplified beam models in dynamic impact simulations for a horizontal drop condition is examined, and discussions are provided.

Optimal pressure and temperature for Cu-Cu direct bonding in three-dimensional packaging of stacked integrated circuits

  • Seunghyun Yum;June Won Hyun
    • 한국표면공학회지
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    • 제56권3호
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    • pp.180-184
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    • 2023
  • Scholars have proposed wafer-level bonding and three-dimensional (3D) stacked integrated circuit (IC) and have investigated Cu-Cu bonding to overcome the limitation of Moore's law. However, information about quantitative Cu-Cu direct-bonding conditions, such as temperature, pressure, and interfacial adhesion energy, is scant. This study determines the optimal temperature and pressure for Cu-Cu bonding by varying the bonding temperature to 100, 150, 200, 250, and 350 ℃ and pressure to 2,303 and 3,087 N/cm2. Various conditions and methods for surface treatment were performed to prevent oxidation of the surface of the sample and remove organic compounds in Cu direct bonding as variables of temperature and pressure. EDX experiments were conducted to confirm chemical information on the bonding characteristics between the substrate and Cu to confirm the bonding mechanism between the substrate and Cu. In addition, after the combination with the change of temperature and pressure variables, UTM measurement was performed to investigate the bond force between the substrate and Cu, and it was confirmed that the bond force increased proportionally as the temperature and pressure increased.

ZrO2-Ti합금의 활성금속 브레이징 (Active Metal Brazing Applied to Joining of ZrO2-Ti Alloy)

  • 기세호;박상윤;정재필;김원중
    • Journal of Welding and Joining
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    • 제30권3호
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    • pp.38-43
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    • 2012
  • In this study, active metal brazing methods for $ZrO_2$ and Ti alloy were discussed. To get a successful metal-ceramic bonding, various factors (melting temperature, corrosion, sag resistance, thermal expansion coefficient etc. of base materilas and filler metal) should be considered. Moreover, in order to clarify bonding between the metal and ceramic, the mechanism of the interfacial structure of the joints should be identified. The driving force for the formation of metal and ceramic interfaces is the reduction of the free energy which occurs when their contact becomes complete. Interfacial bonding depends on the material combinations and the bonding processes. This study describes the bonding between ceramic and metal in an active metal brazing.

저 융점 바인더 복합화 및 압착공정을 통한 고강도 폴리에틸렌 테레프탈레이트(PET) 시트 개발 (Development of High-strength Polyethylene Terephthalate (PET) Sheet Through Low Melting Point Binder Compounding and Compression Process)

  • 문재정;박옥경;김남훈
    • Composites Research
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    • 제33권5호
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    • pp.282-287
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    • 2020
  • 본 연구에서는 저 융점 폴리에틸렌 테레프탈레이트(PET) 섬유(Low melting PET fiber: LMF)가 복합화된 PET 시트의 고밀도화 공정을 통해 고강도 PET 시트를 제조하였다. 복합화된 LMF는 열처리 과정에서 용융되어 개개의 PET 섬유를 연결해 섬유간의 계면결합력을 향상시켰다. 또한 PET시트의 고밀도화는 거대기공밀도를 감소시키고 중첩된 PET 네트워크간의 결합력을 향상시켜 결과적으로 압축 전 LMF-PET 시트와 비교하여 연신율은 유지하면서 약 410% 향상된 인장강도를 보여주었다. 또한 강화된 결합력은 PET 섬유 네트워크의 수축을 방지하여 우수한 치수안정성을 나타내었다.

열처리된 Pine/탄소섬유 복합재료의 기계적 및 계면물성 향상을 위한 최적 조건 (Optimum Conditions for Improvement of Mechanical and Interfacial Properties of Thermal Treated Pine/CFRP Composites)

  • 신평수;김종현;박하승;백영민;권동준;박종만
    • Composites Research
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    • 제30권4호
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    • pp.241-246
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    • 2017
  • 취성을 가진 섬유강화플라스틱은 충격을 받을 때 충격에너지를 흡수하면서 섬유와 기지재 간 계면에서 탈착 및 박리가 일어난다. 이는 복합재료의 에너지 충격흡수정도의 지표로 삼을 수 있다. 복합재료의 취성을 해결하기 위해 pine과 복합재료의 접착에 대한 연구가 되어 지고 있다. 이번 연구에서는 열처리 된 pine이 탄소섬유강화복합재료와 에폭시 접착제를 이용하여 접착되었다. 최적의 열처리 조건을 확인하기 위해, pine을 160도 및 200도 조건하에 열처리를 하였다. Pine 및 pine/탄소섬유복합재료의 기계적 및 계면물성을 파악하기 위해 인장, 인장중첩전단 및 아이조드 실험을 하였다. 또한, 열처리에 따른 나뭇결간의 결합력을 확인하기 위해 나뭇결 수직방향으로 인장시편 제조 후 파단될 때 탄성파를 음향방출시스템을 이용하여 분석하였다. 160도 조건으로 열처리 했을 때 나무강화 효과로 기계, 계면 및 나뭇결간의 결합력이 좋은 것을 확인하였다. 그러나 과한 열을 주게 되면 열에 약한 헤미셀룰로오스가 분해되면서 잡아주는 인자가 줄어들어 물성이 감소하였다.

용탕단조법으로 제조된 $Al_2O_3/AC4C$ 복합재료의 피로균열 전파거동에 관한 연구 (A Study on the Fatigue Crack Propagation Behavior of $Al_2O_3/AC4C$ Composites Made by Squeeze Casting Process)

  • 여인동;이지환
    • 한국주조공학회지
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    • 제15권4호
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    • pp.388-396
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    • 1995
  • This study has been conducted with the purpose of examining the fatigue crack growth characteristics of $Al_2O_3$ short fiber reinforced aluminum matrix composites made by squeeze casting process with different applied pressure and binder amount. Fatigue crack growth experiments have been performed under constant load amplitude method with a fixed load ratio. The rate of crack propagation was decreased with binder amount as well as applied pressure. Also fatigue crack growth path in matrix was changed from flat to rough mode with an increase of applied pressure. In the composites, fatigue crack was propagated to interface between matrix and reinforcement at 10MPa, but it was propagated to reinforcement at 20MPa. The major reason of thee result was considered that interfacial bonding force and microstructure of matrix were improved due to an increase of applied pressure. Localized ductile striation in the composites was observed at low growth rate region and such a phenominon was remarkable with an increase of applied pressure. At high growth rate region, the propensity of fracture appearance was changed from interfacial debonding to reinforcement fracture with an increase of applied pressure.

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카본판을 접착보강한 강재의 거동분석 (Structural behavior on the steel beam with strengthening bonded carbon plate)

  • Sung, Ikhyun
    • 한국재난정보학회 논문집
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    • 제12권1호
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    • pp.54-61
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    • 2016
  • 구조물에 복합재료를 사용한 보강과 복구에 대한 사용이 증가하고 있는 상황에서 갑작스러운 강도저하로 발생되는 재난을 피하기 위하여 임시 보강하고자 탄소섬유 판을 이용하여 기존금속재와 접합(접착방식)을 통한 강도증진효과를 연구하였다. 특히 실험을 통하여 강-탄소섬유보강재로 이루어진 복합 재 거동을 파악하였으며 여기에 적절한 시험을 위한 새로운 형태의 시험편을 제작하였다. 접합재로 레진을 접착하는 부착 면을 달리하여 거동을 비교하기 위하여 표면처리가 다른 시험편을 각각 고려하여 시험한 결과 강성보강효과는 물론 일체거동의 특성이 잘 나타남을 알 수 있었다.

무기화합물 첨가에 의한 C/C복합재료의 매트릭스 조직제어 (The Role of Inorganic Compounds Additions on the Matrix Microtexture Control of C/C Composite)

  • 박세민
    • 한국세라믹학회지
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    • 제34권11호
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    • pp.1151-1158
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    • 1997
  • Fracture of uni-directional carbon fiber reinforced carbon matrix composite is strongly dependent on the orientation of basal plane in graphite matrix when it is limited within matrix. The orientation of basal planes are vertically stacked to carbon fiber which results in the weakness for applied tensile or shear force in thermosetting resin derived-carbon matrix composite. Microtextural control of the matrix was tried through chemical interaction between metal carbides and furan resin derived-carbon matrix. SiC and TiO2 addition made the orientation disordered. However, porosity increased due to decomposition of SiC. Interfacial bonding could be controlled by TiO2 addition, but carbon fiber was considerably reacted with TiC during thermal treatment higher than 2$600^{\circ}C$. Therefore, it is desirable to control the thermal treatment temperature at which decomposition of SiC was not serious and TiC/C was not formed eutectoid.

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