• 한국재료학회지
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• 제20권6호
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• pp.319-325
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• 2010

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and $6.44\;J/m^2$ for 400, 450, and $500^{\circ}C$, respectively, in a $N_2$ atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

• 한국고분자학회:학술대회논문집
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• 한국고분자학회 2006년도 IUPAC International Symposium on Advanced Polymers for Emerging Technologies
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• pp.247-247
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• 2006

Chemical and physical synthesis routes were combined to prepare macroporous thin films of semiconducting metal-oxides such as $CaCu_{3}Ti_{4}O_{12}\;and\;TiO_{2}$ by sputtering onto (PMMA) microsphere templated substrates. Subsequently, the colloidal templates were removed by thermal decomposition. The remaining inorganic films comprised a monolayer of hollow hemispheres with diameter commensurate with that of the microspheres. This unique morphology increases the surface area and reduces the interfacial area between film and substrate. Consequently, the surface activity is markedly enhanced while deleterious interfacial effects between film and substrate are significantly reduced. Both effects are highly advantageous for gas sensing applications.

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 2003년도 춘계학술발표대회 요약집
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• pp.147-147
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• 2003

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 2002년도 춘계공동학술발표회요약집
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• pp.123.1-123
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• 2002

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 2004년도 요약집 춘계학술발표대회
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• pp.106-106
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• 2004

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 2005년도 추계학술발표회
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• pp.570-571
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• 2005

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 1999년도 추계학술발표회요약집
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• pp.125.2-125
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• 1999

• 한국미생물·생명공학회지
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• 제15권2호
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• pp.98-103
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• 1987

이상계를 이용해서 올리브유를 가수분해하는 데 있어서, 리파제의 반응동력학을 검토했다. 반응계는 Candide rugosa와 Rhizopus arrhizus 리파제를 수용액상에 녹이고 기질인 올리브유를 유기용매인 이소-옥탄에 녹여서 서로의 계면에서 효소반응이 일어나는 이상계 반응이다. 각각의 리파제에 대해서 이소-옥탄에 올리브유를 여러 농도로 녹여서 유지 분해속도를 측정함으로써 리파제의 반응 동역학을 보았다. 이상계 내에서 반응 속도 방정식은 일반 효소의 속도 방정식의 Michaelis-Menten식을 따르지 않았다. 이 결과는 이상계에서 유기용매내의 올리브유의 농도가 계면면적의 변화에 영향을 주기 때문에 비롯되는 것으로 생각된다. 그래서 올리브유의 농도가 계면면적에 영향을 주지 않는다고 가정한 식에 변형을 가해서 새로운 식을 유도했다. 이 식은 특히 올리브유가 낮은 농도에서 심하게 Michaelis-Menten 식에서 벗어나는 현상을 설명할 수 있다.

• Advanced Composite Materials
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• 제16권4호
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• pp.335-347
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• 2007

Green composites composed of long maize fibers and poly $\varepsilon$-caprolactone (PCL) biodegradable polyester matrix were manufactured by the thermo-mechanical processing termed as 'Sequential Molding and Forming Process' that was developed previously by the authors' research group. A variety of processing parameters such as fiber area fraction, molding temperature and forming pressure were systematically controlled and their influence on the tensile properties was investigated. It was revealed that both tensile strength and elastic modulus of the composites increase steadily depending on the increase in fiber area fraction, suggesting a general conformity to the rule of mixtures (ROM), particularly up to 55% fiber area fraction. The improvement in tensile properties was found to be closely related to the good interfacial adhesion between the fiber and polymer matrix, and was observed to be more pronounced under the optimum processing condition of $130^{\circ}C$ molding temperature and 10 MPa forming pressure. However, processing out of the optimum condition results in a deterioration in properties, mostly fiber and/or matrix degradation together with their interfacial defect as a consequence of the thermal or mechanical damages. On the basis of microstructural observation, the cause of strength degradation and its countermeasure to provide a feasible composite design are discussed in relation to the optimized process conditions.

• 한국분말재료학회지
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• 제18권5호
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• pp.430-436
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• 2011

Joining of NiO-YSZ to 316 stainless steel was carried out with B-Ni2 brazing alloy (3 wt% Fe, 4.5 wt% Si, 3.2 wt% B, 7 wt% Cr, Ni-balance, m.p. 971-$999^{\circ}C$) to seal the NiO-YSZ anode/316 stainless steel interconnect structure in a SOFC. In the present research, interfacial (chemical) reactions during brazing at the NiO-YSZ/316 stainless steel interconnect were enhanced by the two processing methods, a) addition of an electroless nickel plate to NiO-YSZ as a coating or b) deposition of titanium layer onto NiO-YSZ by magnetron plasma sputtering method, with process variables and procedures optimized during the pre-processing. Brazing was performed in a cold-wall vacuum furnace at $1080^{\circ}C$. Post-brazing interfacial morphologies between NiO-YSZ and 316 stainless steel were examined by SEM and EDS methods. The results indicate that B-Ni2 brazing filler alloy was fused fully during brazing and continuous interfacial layer formation depended on the method of pre-coating NiO-YSZ. The inter-diffusion of elements was promoted by titanium-deposition: the diffusion reaction thickness of the interfacial area was reduced to less than 5 ${\mu}m$ compared to 100 ${\mu}m$ for electroless nickel-deposited NiO-YSZ cermet.