• Korean Journal of Materials Research
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• v.20 no.6
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• pp.319-325
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• 2010

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and $6.44\;J/m^2$ for 400, 450, and $500^{\circ}C$, respectively, in a $N_2$ atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.247-247
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• 2006

Chemical and physical synthesis routes were combined to prepare macroporous thin films of semiconducting metal-oxides such as $CaCu_{3}Ti_{4}O_{12}\;and\;TiO_{2}$ by sputtering onto (PMMA) microsphere templated substrates. Subsequently, the colloidal templates were removed by thermal decomposition. The remaining inorganic films comprised a monolayer of hollow hemispheres with diameter commensurate with that of the microspheres. This unique morphology increases the surface area and reduces the interfacial area between film and substrate. Consequently, the surface activity is markedly enhanced while deleterious interfacial effects between film and substrate are significantly reduced. Both effects are highly advantageous for gas sensing applications.

• Proceedings of the Korean Nuclear Society Conference
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• 2003.05a
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• pp.147-147
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• 2003

• Proceedings of the Korean Nuclear Society Conference
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• 2002.05a
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• pp.123.1-123
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• 2002

• Proceedings of the Korean Nuclear Society Conference
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• 2004.05a
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• pp.106-106
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• 2004

• Proceedings of the Korean Nuclear Society Conference
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• 2005.10a
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• pp.570-571
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• 2005

• Proceedings of the Korean Nuclear Society Conference
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• 1999.10a
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• pp.125.2-125
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• 1999

• Microbiology and Biotechnology Letters
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• v.15 no.2
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• pp.98-103
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• 1987

Two phase reaction system was used to hydrolyze the olive oil for fat splitting. Kinetics of lipases in two phase system were investigated by determining the hydrolysis rate of triglycerides at various olive oil concentrations in isooctane using the microbial lipases from Candida rugosa and Rhizopus arrhizus. The rate equation in lipid hydrolysis for various olive oil concentrations in two phase system was deviated from the Michaelis-Menten kinetics. The results suggested that the olive oil concentration in isooctane affects the interfacial area. The dependency of the interfacial area on olive oil concentration is greater at the lower olive oil concentration than at the higher substrate concentration. We modified the rate equation by considering the interfacial area between two phases depending on the olive oil concentration in solvent phase.

• Advanced Composite Materials
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• v.16 no.4
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• pp.335-347
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• 2007

Green composites composed of long maize fibers and poly $\varepsilon$-caprolactone (PCL) biodegradable polyester matrix were manufactured by the thermo-mechanical processing termed as 'Sequential Molding and Forming Process' that was developed previously by the authors' research group. A variety of processing parameters such as fiber area fraction, molding temperature and forming pressure were systematically controlled and their influence on the tensile properties was investigated. It was revealed that both tensile strength and elastic modulus of the composites increase steadily depending on the increase in fiber area fraction, suggesting a general conformity to the rule of mixtures (ROM), particularly up to 55% fiber area fraction. The improvement in tensile properties was found to be closely related to the good interfacial adhesion between the fiber and polymer matrix, and was observed to be more pronounced under the optimum processing condition of $130^{\circ}C$ molding temperature and 10 MPa forming pressure. However, processing out of the optimum condition results in a deterioration in properties, mostly fiber and/or matrix degradation together with their interfacial defect as a consequence of the thermal or mechanical damages. On the basis of microstructural observation, the cause of strength degradation and its countermeasure to provide a feasible composite design are discussed in relation to the optimized process conditions.

• Journal of Powder Materials
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• v.18 no.5
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• pp.430-436
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• 2011

Joining of NiO-YSZ to 316 stainless steel was carried out with B-Ni2 brazing alloy (3 wt% Fe, 4.5 wt% Si, 3.2 wt% B, 7 wt% Cr, Ni-balance, m.p. 971-$999^{\circ}C$) to seal the NiO-YSZ anode/316 stainless steel interconnect structure in a SOFC. In the present research, interfacial (chemical) reactions during brazing at the NiO-YSZ/316 stainless steel interconnect were enhanced by the two processing methods, a) addition of an electroless nickel plate to NiO-YSZ as a coating or b) deposition of titanium layer onto NiO-YSZ by magnetron plasma sputtering method, with process variables and procedures optimized during the pre-processing. Brazing was performed in a cold-wall vacuum furnace at $1080^{\circ}C$. Post-brazing interfacial morphologies between NiO-YSZ and 316 stainless steel were examined by SEM and EDS methods. The results indicate that B-Ni2 brazing filler alloy was fused fully during brazing and continuous interfacial layer formation depended on the method of pre-coating NiO-YSZ. The inter-diffusion of elements was promoted by titanium-deposition: the diffusion reaction thickness of the interfacial area was reduced to less than 5 ${\mu}m$ compared to 100 ${\mu}m$ for electroless nickel-deposited NiO-YSZ cermet.