• Korean Journal of Materials Research
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• v.8 no.9
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• pp.807-812
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• 1998

Interfacial reaction and mechanical properties between Sn-Bi-X ternary alloys(X : 2Cu. 2Sb 5In) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 60days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3mm $\textrm{min}^{-1}$ to measure strength and elongation. According to the result of EDS, it is supposed that the soldered interfacial zone was composed of $\textrm{Cu}_{3}\textrm{Sn}$ and $\textrm{Cu}_{6}\textrm{Sn}_{5}$. According to the tensile test of Cu/solder joint, joint strength was decreased by aging treatment. Fractographs of Cu/Sn-Bi solder detailed the effect of aging on fracture behavior. When intermetallic was thin, the fracture occurred through the solder. But as the interfacial intermetallic is thickened, the fracture propagated along the intermetallic/solder interface.

• Journal of Ocean Engineering and Technology
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• v.25 no.4
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• pp.66-71
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• 2011

The flexural strength of $MoSi_2$ based composites reinforced with Nb sheets has been investigated, based on the detailed examination of their microstructure and fractured surface. Both sintered density and porosity of Nb/$MoSi_2$ composites were also examined. Nb/$MoSi_2$ composites were fabricated by different conditions such as temperature, applied pressure and its holding time, using a hot-press device. The volume fraction of Nb sheet in this composite system was fixed as 10%. The characterization of Nb/$MoSi_2$ composites were investigated by means of optical microscopy, scanning electron microscope and three point bending test. Nb/$MoSi_2$ composites represented a dense morphology at the interfacial region, accompanying the creation of two types of reaction layer by the chemical reaction of Nb and $MoSi_2$. Nb/$MoSi_2$ composites possessed an excellent density at the fabricating temperature of $1350^{\circ}C$, corresponded to about 95% of theoretical density. The flexural strength of Nb/$MoSi_2$ romposites were greatly affected by the pressure holding time at the same fabricating temperature, owing to the large suppression of porosity in the microstructure. Especially, Nb/$MoSi_2$ composites represented a good flexural strength of about 310 MPa at the fabricating condition of $1350^{\circ}C$, 30MPa and 60min, accompanying the pseudo-ductile fracture behavior by the deformation of Nb sheet and the interfacial delamination.

• Journal of Korea Foundry Society
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• v.16 no.6
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• pp.537-549
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• 1996

This study aims at investigating the correlation of microstructure and mechanical properties of the AZ91 Mg/Al borate whisker composites fabricated by squeeze csting technique with a variation of applied pressure. Microstructure observation and in-situ fracture tests were conducted on the composites to identify the microfracture process. Detailed microstructural analyses indicated that the grain refinement could be achieved with applied pressure and the little change in volume fraction on reinforcing whiskers could be carried out. It was also found clearly from in-situ observation of crack initiation and propagation that in the composite processed by the lower applied pressure, microcracks were initiated earily at whisker/matrix interfaces, thereby resulting in the drop in strength. In the composite processed by the higher applied pressure, on the other hand, planar slip lines were well developed in the matrix, and then propagated through whiskers without whisker/matrix decohesion. Thus, the effect of the applied pressure on microstructure and mechanical properties can be explained by grain refinement, increased amounts of reinforcements, and improvement of whisker/matrix interfacial strength as the applied pressure in increased.

• Journal of Welding and Joining
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• v.17 no.2
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• pp.104-111
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• 1999

The interfacial microstructure and bond strength were examined for WC-Co/Cu/SM45C steel join using a nickel-plated copper in vacuum at 1323K for 0.6ks∼3.6ks. After bonding, microstructure in bonding interface was observed by OM(Optical Microscopy), SEM(Scanning Electron Microscopy) and EPMA(Eelectron Probe Micro Analyzer). The oil cooling was carried out at 353K, the cooling rate in air and furnace was 22K/s and 4.4K/s. respectively. It was found that dendritic widths increased with the content of cobalt and bonding times at 1323K. As a whole, bond strength values at the same bonding condition decreased in this order: WC-13wt.%Co/SM45Csteel. WC-8wt.%Co/SM45Csteel and WC-4wt.%Co/SM45Csteel. The bond strength of WC-13wt.%Co/S45C steel joint in oil cooling was 273MPa. This value was greatly higher than those of 125MPa in furnace cooling and 93MPa in air cooling at 1323K for 0.6ks. The bond strength values were found to be closely associated with the content of cobalt in WC-Co and cooling rate.

• Journal of Powder Materials
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• v.16 no.6
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• pp.416-423
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• 2009

Diamond/SiC composites are appropriate candidate materials for heat conduction as well as high temperature abrasive materials because they do not form liquid phase at high temperature. Diamond/SiC composite consists of diamond particles embedded in a SiC binding matrix. SiC is a hard material with strong covalent bonds having similar structure and thermal expansion with diamond. Interfacial reaction plays an important role in diamond/SiC composites. Diamond/SiC composites were fabricated by high temperature and high pressure (HPHT) sintering with different diamond content, single diamond particle size and bi-modal diamond particle size, and also the effects of composition of diamond and silicon on microstructure, mechanical properties and thermal properties of diamond/SiC composite were investigated. The critical factors influencing the dynamics of reaction between diamond and silicon, such as graphitization process and phase composition, were characterized. Key factor to enhance mechanical and thermal properties of diamond/SiC composites is to keep strong interfacial bonding at diamond/SiC composites and homogeneous dispersion of diamond particles in SiC matrix.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1993.11a
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• pp.3-3
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• 1993

In mechanical testing of W-Ni-Pe heavy alloys, the cracks nucleate at W/W interface and propagate through W/ Imatrix interface or through matrix phase together with the cleavage of W grains. The mechanical properties can therefore be improved by control of the interfacial strength and area. In this presentation, some experimental result and techniques on this subject will be reviewed and discussed. The hydrogen embrittlement caused by the hydrogen segregation at interfaces during sintering in an hydrogen atmosphere can be removed by an heat-treattnent in vacuum or in an inert atmosphere. The heat-treatment condition can be estimated by using a diffusion equation for a cylindrical shape. The mechanical properties, in particular the impact property, are degraded by the segregation of non-metallic impurities, such as Sand P. The degradation can be prevented by adding a fourth element, such as La or Ca, active with the non-metallic impurities. The cyclic heat-treatment at usual heat-treattnent tempemture causes the penetration of matrix between W/W grain boundaries and results in remarkable increase in impact energy. This is due to an increase in the area of ductile failure during the impact test. The instability of W/matrix interface casued by addition of Mo or Re can be controlled by using W powders of different size. The increase in the interfacial area in found to be related to the presence of non-equilibrium pure W gmins among W(Mo or Re) solid solution gmins.

• Journal of the Korean Ceramic Society
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• v.34 no.8
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• pp.825-833
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• 1997

Silicon carbide films were deposited by low pressure chemical vapor deposition(LPCVD) using MTS(CH3SICl3) in hydrogen atmosphere on (100) Si substrate. To prevent the unstable interface from being formed on the substrate, the experiments were performed through three deposition processes which were the deposition on 1) as received Si, 2) low temperature grown SiC, and 3) carbonized Si by C2H2. The microstructure of the interface between Si substrates and SiC films was observed by SEM and the adhesion between Si substrates and SiC films was measured through scratch test. The SiC films deposited on the low temperature grown SiC thin films, showed the stable interfacial structures. The interface of the SiC films deposited on carbonized Si, however, was more stable and showed better adhesion than the others. In the case of the low temperature growth process, the optimum condition was 120$0^{\circ}C$ on carbonized Si by 3% C2H2, at 105$0^{\circ}C$, 5 torr, 10 min, showed the most stable interface. As a result of XRD analysis, it was observed that the preferred orientation of (200) plane was increased with Si carbonization. On the basis of the experimental results, the models of defect formation in the process of each deposition were compared.

• 연구논문집
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• s.28
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• pp.219-227
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• 1998

In order to investigate the interfacial structure between TiN and iron nitride, an AISI 4140 steel was nitrided to form a layer of thickness 15$\mum$ by DC ion nitriding, then the surface was bombarded with Ti ions and subsequently coated a TiN film of 5$\mum$ by arc ion plating method. The interfacial microstructure between TiN and iron nitride was characterized by optical microscope, SEM and XRD. So called black layer was observed in the duplex treatment. It was resulted from the decomposition of iron nitride during the bombardment. Its thickness was increased with increasing bombardment time at high bias voltage. But the thickness was greatly decreased when the iron nitride was bombarded with a nitrogen gas or at a reduced bias voltage. The adhesion strength of the top TiN coating was decreased with increasing thickness of the black layer. Furthermore, the reduced adhesion strength in this system was discussed in view of the interfacial structural relationship between TiN and iron nitride.

• Journal of the Korean Ceramic Society
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• v.32 no.1
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• pp.120-130
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• 1995

To analyze the mechanical property and the residual stress in functionally gradient materials(FGMs), disctype TZP/Ni-and TZP/SUS304-FGM were hot pressed using powder metallurgy compared with directly bonded materials which were fabricated by the same method. The continuous interface and the microstructure of FGMs were characterized by EPMA, WDS, optical microscope and SEM. By fractography, the fracture behavior of FGMs was mainly influenced by the defects which originated from the fabrication process. And the defectlike cracks in the FGMs induced by the residual stress have been shown to cause failure. This fact has well corresponded to the analysis of the residual stress distribution by Finite Element Method (FEM). The residual stress generated on the interface (between each layer, and matrix and second phase, respectively) were dominantly influenced on the sintering temperature and the material constants. As a consequence, the interfacial stability and the relaxation of residual stress could be obtained through compositional gradient.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.3
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• pp.284-291
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• 2011

Numerical experiments on biological interfacial layer, DEJ by finite element software ABAQUS have been conducted to study its fracture behavior including crack bridging / arresting characteristics in the model. Crack growth simulation has been carried out by numerical tool, XFEM, devoted to study cracks and discontinuities. The fracture toughness of DEJ has been estimated before and after crack bridging. The implications of bridging in numerical study of fracture behavior of DEJ-like biological interface have been discussed. It has been observed that the results provided by the numerical studies without proper accommodation of bridging phenomenon can mislead. This study can be helpful for understanding the DEJ-like biological interface in terms of its fracture toughness, an important material characteristics. This property of the material is an important measure that has to be taken care during design and manufacturing processes.