• Proceeding of KASS Symposium
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• 2005.05a
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• pp.205-212
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• 2005

In order for utilization of the concrete filled tubular, It Is necessary to scrutinize interfacial characteristics between heterogeneous materials, and be performed to various analytical studies on the composite structure. In this paper, this analytic study is carried on using ABAQUS Package/ Version 5.8-1, and the variables aye the relations between the coefficient of friction and the contact pressure for analyzing the behavior on the contact surface, through modifying the analytic methods and improving some problems. It is used to subdivided analytical methods in this research which categorize into four regions and can obtain closer effect for the bond behavior. Four categories compose of the chemical bond and mechanical bond legions replaced the full-interaction before yielding, and the pure friction and moving-down regions after yielding.

• Carbon letters
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• v.11 no.4
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• pp.311-315
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• 2010

In this work, the effect of glycidyl methacrylate grafted multi-walled carbon nanotubes (GMA-MWCNTs) on the viscoelastic behaviors of polypropylene (PP) based nanocomposites was studied. The GMA-MWCNTs/PP was prepared using a bravender at $200^{\circ}C$ by melt mixing as a function of GMA-MWCNT content. The viscoelastic behaviors of GMA-MWCNTs/PP nanocomposites were measured by a rheometer. It was found that the GMA-MWCNTs were homogeneously dispersed in the PP matrix. The GMA-MWCNTs/PP nanocomposites showed higher storage modulus, loss modulus, and shear viscosity compared to pure PP nanocomposites and the maximum value was shown at 2.0 wt% GMA-MWCNTs loading. These results were probably attributed to the strong interfacial interaction between the GMA-MWCNT and the PP matrix.

• Advances in materials Research
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• v.3 no.3
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• pp.129-137
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• 2014

Biocomposites from polypropylene (PP) and corn cob (CC) were investigated. The effect of corn cob content and maleic anhydride polypropylene (MAPP) as compatibilizer were studied. Results showed that addition of corn cob (CC) in PP have decreased the tensile strength and elongation at break, whereas modulus of elasticity of biocomposites increased. The biocomposites with the MAPP as compatibilizer exhibited higher tensile strength and modulus of elasticity compared biocomposites without MAPP. The morphology study of biocomposites indicates that enhanced the interfacial interaction and adhesion between filler and matrix with the presence of MAPP.

• Proceedings of the Korean Magnestics Society Conference
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• 2017.05a
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• pp.106-107
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• 2017

• Bulletin of the Korean Chemical Society
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• v.12 no.1
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• pp.80-85
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• 1991

Laser Raman spectroscopy has been used to study the tungsta catalyst supported on titania. The surface tungsten species which forms on titania after calcination appeared to possess a structure that is independent of the initial impregnation condition. The surface polytungstate seemed to be stable only at the interfacial region since the crystalline WO$_3$ phase was observed as long as the tungsta loading was in excess of monolayer coverage. The close intact and strong interaction between the polytungstate and the titania could be evidenced from the inhibition of the phase transition of TiO$_2$ from anatase to rutile.

• Proceedings of the Korean Magnestics Society Conference
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• 2016.11a
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• pp.73-74
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• 2016

• Journal of Industrial and Engineering Chemistry
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• v.67
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• pp.140-147
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• 2018

The performance of a hydrate anti-agglomerant (AA) on cyclopentane (CyC5) hydrate anti-agglomeration at various concentrations (0-1 wt%, based on the oil phase) using MMF apparatus has been investigated. At low AA concentrations up to 0.01 wt%, the AA reduces the cohesion force (capillary force) by reducing the CyC5-water interfacial tension. At concentrations higher than 0.1 wt%, hydrate hydrophobicity alternation and AA's thermodynamic inhibition effects are the main part of AA's mechanism. Additionally, a "temporary agglomeration" phenomenon caused by surface melting of the hydrate particles is also observed, which may indicate the AA's weak ability to produce stable water-CyC5 interface.

• Steel and Composite Structures
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• v.38 no.3
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• pp.281-291
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• 2021

An equivalent single-layer theory (EST) is put forward for analyzing free vibrations of steel-concrete composite beams (SCCB) based on a higher-order beam theory. In the EST, the effect of partial interaction between sub-beams and the transverse shear deformation are taken into account. After using the interlaminar shear force continuity condition and the shear stress free conditions at the top and bottom surface, the displacement function of the EST does not contain the first derivatives of transverse displacement. Therefore, the C0 interpolation functions are just demanded during its finite element implementation. Finally, the EST is validated by comparing the results of two simply-supported steel-concrete composite beams which are tested in laboratory and calculated by ANSYS software. Then, the influencing factors for free vibrations of SCCB are analyzed, such as, different boundary conditions, depth to span ratio, high-order shear terms, and interfacial shear connector stiffness.

• Structural Engineering and Mechanics
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• v.61 no.3
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• pp.407-417
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• 2017

RC shear walls are considered one of the main lateral resisting members in buildings. In recent years, FRP has been widely utilized in order to strengthen and retrofit concrete structures. A number of experimental studies used CFRP sheets as an external bracing system for retrofitting of RC shear walls. It has been found that the common mode of failure is the debonding of the CFRP-concrete adhesive material. In this study, behavior of RC shear wall was investigated with three different micro models. The analysis included 2D model using plane stress element, 3D model using shell element and 3D model using solid element. To allow for the debonding mode of failure, the adhesive layer was modeled using cohesive surface-to-surface interaction model at 3D analysis model and node-to-node interaction method using Cartesian elastic-plastic connector element at 2D analysis model. The FE model results are validated comparing the experimental results in the literature. It is shown that the proposed FE model can predict the modes of failure due to debonding of CFRP and behavior of CFRP strengthened RC shear wall reasonably well. Additionally, using 2D plane stress model, many parameters on the behavior of the cohesive surfaces are investigated such as fracture energy, interfacial shear stress, partial bonding, proposed CFRP anchor location and using different bracing of CFRP strips. Using two anchors near end of each diagonal CFRP strips delay the end debonding and increase the ductility for RC shear walls.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.