• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.165-180
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• 2004

Phosphor contents are critical to the interfacial reaction and IMC behavior. - If content is too low, the dissolution rate will be very fast. - If content is too much, the cracks during interfacial reaction and the IMCs spalling will easily occur. The spalling of IMCs caused the brittle fracture of solder joint under shear test. IMCs from chemical reaction influences to the mechanical properties and life time. Composition changes from chemical reaction influence to the life time.

• Journal of the Korean Society of Safety
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• v.30 no.1
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• pp.21-27
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• 2015

In this study, interfacial characteristics between SOFC and Ag paste as current collector was estimated in the high temperature environment. The Ag paste was used to connect the unit cell of SOFC strongly with interconnector and provide the electrical conductivity between them. To confirm electrical conductivity, Ag paste was treated in the furnace at $800^{\circ}C$ for 48 hours. The sheet resistance of Ag paste was measured to compare the resistance values before and after the heat treatment. Also, the four-point bending test was performed to measure the interfacial adhesion. The unit cell of SOFC and $SiO_2$ wafer were diced and then attached by Ag paste. The $SiO_2$ wafer had the center notch to initiate a crack from the tip of the notch. The modified stereomicroscope combined with the CCD camera and system for measuring the length was used to observe the fracture behavior. To compare the characteristics before heat treatment and after heat treatment, the specimen was exposed in the furnace at $800^{\circ}C$ for 48 hours and then the interfacial adhesion was evaluated. Finally, the interfacial adhesion energy quantitatively increases $1.78{\pm}0.07J/m^2$ to $4.9{\pm}0.87J/m^2$ between the cathode and Ag paste and also increase $2.9{\pm}0.47J/m^2$ to $5.12{\pm}1.01J/m^2$ between the anode and Ag paste through the high temperature. Therefore, it is expected that Ag paste as current collector was appropriate for improving the structural stability in the stacked SOFC system if the electrical conductivity was more increased.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.8
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• pp.2139-2157
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• 1994

In order to understand the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the stress intensity factor, T-stress and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the delamination are investigated taking into account the temperature dependence of the material properties, which simulates as more realistic condition. As the crack length increases the J-integral increases, which suggest that the crack propagates if it starts growing from the small size. The effects of the material properties and molding process temperature on stress intensity factor, T-stress is and J-integral are less significant than the chip size for the practical cases considered here. The T-stress is negative in all eases, which is in agreement with observation that interfacial crack is not kinked until the crack approaches the edge of the leadframe.

• Journal of the korean academy of Pediatric Dentistry
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• v.37 no.3
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• pp.298-307
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• 2010

The purpose of this study was to assess the effect on oxygen inhibition layer(OIL) for the interfacial bonding between resin composite layers, including shear bond strength, fracture modes and degree of conversion. The first layer of specimen was filled with Z-250(shade A3) and was cured for 40s. The second layer of specimen was filled with same composite(shade A1) and was cured for 40s. The first layer of specimens for each group were prepared by methods as followings. Control(curing in atmospheric air), Group1(curing against Mylar strip), Group2(scrubbed with a acetone-soaked cotton), Group3(using Tescera light cup), Group4(using Tescera heat cup), Group5(stored in disti1led water for 30days at $37^{\circ}C$), Group6 (using bonding agent). The results were as follows: 1. There was no statistically significant different shear bond strength between control and group 1(p>0.05). 2. Group 2 showed significantly lower shear bond strength than control and group 1(p<0.05). 3. The observation of the fracture surface leads to the evidence that a major difference occurs in the case of control, group1 and group 3 samples which break mainly cohesively while the other groups break in majority adhesively. 4. The results of FTIR showed that the degree of conversion was the highest in group 2 and the lowest in control group(p<0.05). It can be concluded that an OIL is not necessary for bonding with composite resin. But if a reduced critical amount of the unreacted monomer is present, it was detrimental to bonding additional layers of composite. Further study, such as the quantitative analysis of the unreacted monomer are required.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.45-45
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• 2009

원가 측면에서 유리한 저항점용접(Resistance Spot Welding)이 차체 용접에 80%이상으로 가장 많이 적용되고 있다. 첨단고강도강(Advanced High Strength Steel)의 저항점용접성 및 용접부 특성에 미치는 공정 변수의 영향에 대한 연구결과는 많으나, 합금원소의 영향에 대해서는 전무하다. 특히, Si는 DP(Dual Phase)강에 첨가 시 균일한 마르텐사이트의 분포를 촉진하는 원소로 저항 점용접성 및 용접부 특성에 영향을 미칠 것으로 예상되며, 이에 대한 연구는 보고된바 없다. 본 연구에서는 냉연 DP강의 저항 점용접시 중요한 인자 중 하나인 너깃경과 전단인장강도에 미치는 Si함유량의 영향을 검토하였다. 사용된 강재 및 용접기는 1.2mm 두께의 Si함유량(0, 0.5, 1.0, 1.5wt%)이 다른 인장강도 780~1000MPa급 냉연 DP강과 단상 AC용접기를 사용하였다. 용접조건은 ISO 18278-2규격에 따라 가압력 4kA, 초기가압시간 40cycle, 유지시간 17cycle로 고정하고, 용접전류만 변화하여 용접을 실시하였다. 너깃경은 용접부 단면을 컷팅 후 폴리싱 하여, 광학현미경과 Image Pro plus를 이용하여 측정했으며, 인장시편규격은 JIS Z 3137를 이용하였다. Si함유량이 증가에 따라 스패터 발생 전류는 감소했고, 너깃경은 직선적으로 증가했다. Si함유량 증가에 따른 너깃경 증가 이유는 저항(R) 측정결과, Si함유량 증가에 따라 모재의 저항이 높아져, 따라서 입열량($Q=I^2Rt$)이 많아지기 때문으로 판단되었다. 인정전단강도는 Si함유량 증가에 따라 직선적으로 증가했다. 이러한 이유는 Si함유량 증가에 따라 너깃경이 증가되기 때문으로 판단되었고, 너깃경과 인장전단강도 사이에 직선적 관계(PL(kN)=$3.2N_{dia.}$-0.81, $R^2$=0.93)를 가지고 있었다. 파단양상은 Si함유량에 상관없이 5.4kA이하에서는 계면파단이 일어났고, 6.0kA이상에서는 풀 아웃 파단이 일어났다. 계면파단주원인은 용접부 가장자리에 지름이 약 $5{\mu}m$이하의 예리한 노치가 존재하여 노치응력집중과 HAZ계면 근처에 미접합부가 존재하기 때문으로 판단되었다. 6.0kA이상에서는 예리한 노치가 없었고, HAZ부가 완전히 접합되어 있기 때문에 풀 아웃 파단이 일어난 것으로 판단되었다. 따라서, Si함유량 증가에 따라 적정용접전류 구간은 감소했고, 너깃경은 직선적으로 증가했다. 또한, Si함유량 증가에 따라 인장전간강도는 증가 했으며, 너깃경과 인장전단강도 사이에 직선적 관계를 가지고 있었다. 파단 양상은 Si함유량에 상관없이 5.2kA이하에서는 계면파단이, 6.0kA이상에서는 풀 아웃 파단이 일어났다.