• Korean Journal of Materials Research
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• v.11 no.5
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• pp.398-404
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• 2001

Effects of coating treatment of metallic Cu film on SiC for Al/SiC composite were studied. The Copper was deposited on SiC by electroless plating method. Al/sic composite was fabricated at temperature range of $670^{\circ}C$ to 90$0^{\circ}C$ under vacuum atmosphere. The wetting behavior of Al/SiC composite were analysed by SEM and XRD. The coating treatment on SiC improved wettability of Al melt on SiC considerably comparing to the non coated SiC. This improved wettability seems strongly concerned to the increase of chemical reactivity between coated layer and Al matrix. The improvement of wettability of Al melt on the Cu coated SiC was closely related to in the initial stage of reaction. The metallic film played an important role in reducing the interfacial free energy and breaking down the aluminum oxide film through the reaction with Al melt. The wetting behavior of the as-received SiC with Al melt was not uniform, indicated by the contact angles from less than $97^{\circ}$to more than $97^{\circ}$.

• Korean Journal of Materials Research
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• v.24 no.3
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• pp.166-173
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• 2014

The effects of printed circuit board electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the electromigration reliability and shear strength of Sn-3.5Ag Pb-free solder bump were systematically investigated. In-situ annealing tests were performed in a scanning electron microscope chamber at 130, 150, and $170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). Electromigration lifetime and failure modes were investigated at $150^{\circ}C$ and $1.5{\times}10^5A/cm^2$, while ball shear tests and failure mode analysis were conducted under the high-speed conditions from 10 mm/s to 3000 mm/s. The activation energy of ENIG and OSP surface finishes during annealing were evaluated as 0.84 eV and 0.94 eV, respectively. The solder bumps with ENIG surface finish showed longer electromigration lifetime than OSP surface finish. Shear strengths between ENIG and OSP were similar, and the shear energies decreased with increasing shear speed. Failure analysis showed that electrical and mechanical reliabilities were very closely related to the interfacial IMC stabilities.

• Elastomers and Composites
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• v.36 no.3
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• pp.177-187
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• 2001

Polypropylene(PP)/polyurethane(PU) blends with reactive compatibilizers were prepared by the compositional quenching process. Maleic anhydride grafted PP(MPP) and hydroxyethyl maleimide grafted PP(HPP) were introduced as reactive compatibilizers. The formation of HPP and the reactions of compatibilizers with the PU components were confirmed by FT-IR spectroscopy. The morphology, tensile properties, thermal stability, and surface property were studied. The blends prepared by the compositional quenching showed better dispersed domain morphology than the melt blends. The PU domain size became more uniform and reduced in size with increasing the amount of compatibilizers. The blends with HPP showed sightly smaller domain sire than the blends with MPP. The blends with compatibilizers all showed improved tensile properties, surface property. and thermal stability due to the interfacial adhesion effect. The blends with MPP showed higher surface energy than the blends with HPP, but the latter showed better thermal stability compared to the former.

• Journal of Technologic Dentistry
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• v.39 no.1
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• pp.43-52
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• 2017

Purpose: Physical and chemical properties of gold is most suitable to be restored of teeth to its original state. Recently zirconia was used instead of gold because of esthetical and intimacy of human body. Because of high strength and high abrasion resistance of zirconia, all zirconia artificial tooth lead to wear the original tooth of opposite site. To preserve this original tooth, zirconia artificial tooth covered with dental ceramic glass was used. When joining the zirconia core and dental ceramic glass, difference of their thermal expansion coefficient and wetting ability is generated the residual stress at interface lead to crack. In order to solve this problem, intermediate layer what is called zir-liner was imported to decrease the residual stress and increase the bonding strength. Methods: In this study, to identify the optimum conditions for manufacturing process, various methods to rough the surface of zirconia core were adopted, and vary the thickness of interlayer, and analyzed bond strength. Results: Bond strength of sanding specimens group showed higher than that of non-sanding specimens group, and once applied intermediate layer with sanding specimens showed highest bond strength with 28 MPa. SEM photomicrographs of zirconia cores fired at $1500^{\circ}C$ showed parallel straight lines in sanding and pockmarked surface in blasting surfaces as abrasion traces. Observation of the destruction section after shear test by SEM were carried out. Liner applied non-sanding group and non-liner applied sanding group all showed interfacial crack. Sandblasting group with non-liner showed remained dental ceramic glass on the surface of zirconia. Sandblasting group with once applied liner showed partially remained liner and dental ceramic glass on the surface of zirconia. XRD analysis revealed that sandblasting group showed higher monoclinic peaks than other specimens group and this result was due to the high collision energy for stress induced phase transformation. Conclusions: A study on the improvement of bonding strength between zirconia and dental ceramic glass steadily carried out for the future to practical use.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.4
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• pp.343-350
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• 2003

Using Bi$_2$Sr$_2$Ca$_2$.$_2$Cu$_3$ $O_{x}$ powders prepared by solid state reaction and spray drying method, the nucleation and growth behaviors of superconducting and second phases were investigated during isothermal heat treatment. When the spray drying power was used in contrast with solid state reaction powder, Bi$_2$Sr$_2$Ca$_2$.$_2$Cu$_3$ $O_{x}$ (2223) phase could be formed at the relatively shot time and second phases were much bigger. Quantitative analysis showed that as the heat treatment time increased, more Bi$_2$Sr$_2$Ca$_2$.$_2$Cu$_3$ $O_{x}$ (2212) changed to 2223 and the major second phase was changed from (Sr,Ca)$_{14}$Cu$_{24}$ $O_{x}$(14:24) to (Sr,Ca)$_2$Cu$_1$ $O_{x}$ (2:l). The superconducting phase formed at the relatively short time 14:24 phase. Following the Bi-free phase of 14:24 Phase, but long time was needed in places far from the 14:24 phase. Following the formation of the 2212 phase near the 14:24 phase, the 2223 phase nucleated preferentially at the interface between the 2212 and 14:24 phases. The preferential nuclcation of 2223 was explained by its structural similarity and low Interfacial energy with both the Bi-free and 2212 Phases.12 Phases.

• Polymer(Korea)
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• v.27 no.1
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• pp.33-39
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• 2003

In this study, the bisphenol-based DGEBA/GEBS blend systems were studied in cure kinetics, thermal stabilities, and fracture toughness of the casting specimen. The content of DGEBA/DCEBS was varied in 100 : 0, 90 : 10, 80 : 20, 70 : 30, and 60 : 40 wt%. The cure activation energies ($E_a$) of the blend systems were determined by Ozawa's equation. The thermal stabilities, including initial decomposed temperature (IDT), temperatures of maximum rate of degradation ($T_{max}$), and integral procedural decomposition temperature (IPDT) of the cured specimen were investigated by thermogravimetric analysis (TGA). For the mechanical interfacial properties of the specimens, the critical stress intensity factor ($K_{IC}$) test was performed and their fractured surfaces were examined by using a scanning electron microscope (SEM). As a result, $E_a$, IPDT, and $K_{IC}$ show maximum values in the 20 wt% DGEBS content compared with the neat DGEBA resins. This was probably due to the fact that the elevated networks were farmed by the introduction of sulfonyl groups of the DCEBS resin.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.380-380
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• 2010

Currently, organic light-emitting diodes (OLEDs) have been proven of their readiness for commercialization in terms of lifetime and efficiency. In accordance with emerging new technologies, enhancement of light efficiency and extension of application fields are required. Particularly inverted structures, in which electron injection occurs at bottom and hole injection on top, show crucial advantages due to their easy integration with Si-based driving circuits for active matrix OLED as well as large open area for brighter illumination. In order to get better performance and process reliability, usually a proper buffer layer for carrier injection is needed. In inverted top emission OLED, the buffer layer should protect underlying organic materials against destructive particles during the electrode deposition, in addition to increasing their efficiency by reducing carrier injection barrier. For hole injection layers, there are several requirements for the buffer layer, such as high transparency, high work function, and reasonable electrical conductivity. As a buffer material, a few kinds of transition metal oxides for inverted OLED applications have been successfully utilized aiming at efficient hole injection properties. Among them, we chose 2 nm of $WO_3$ between NPB [N,N'-bis(1-naphthyl)-N,N'-diphenyl-1,1'-biphenyl-4,4'-diamine] and Au (or Al) films. The interfacial energy-level alignment and chemical reaction as a function of film coverage have been measured by using in-situ ultraviolet and X-ray photoelectron spectroscopy. It turned out that the $WO_3$ interlayer substantially reduces the hole injection barrier irrespective of the kind of electrode metals. It also avoids direct chemical interaction between NPB and metal atoms. This observation clearly validates the use of $WO_3$ interlayer as hole injection for inverted OLED applications.

• Advances in materials Research
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• v.8 no.1
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• pp.47-73
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• 2019

Joining of Mg/Ti hybrid structures by welding for automotive and aerospace applications has attracted great attention in recent years due mainly to its potential benefit of energy saving and emission reduction. However, joining them has been hampered with many difficulties due to their physical and metallurgical incompatibilities. Different joining processes have been employed to join Mg/Ti, and in most cases in order to get a metallurgical bonding between them was the use of an intermediate element at the interface or mutual diffusion of alloying elements from the base materials. The formation of a reaction product (in the form of solid solution or intermetallic compound) along the interface between the Mg and Ti is responsible for formation of a metallurgical bond. However, the interfacial bonding achieved and the joints performance depend significantly on the newly formed reaction product(s). Thus, a thorough understanding of the interaction between the selected intermediate elements with the base metals along with the influence of the associated welding parameters are essential. This review is timely as it presents on the current paradigm and progress in welding and joining of Mg/Ti alloys. The factors governing the welding of several important techniques are deliberated along with their joining mechanisms. Some opportunities to improve the welding of Mg/Ti for different welding techniques are also identified.

• Restorative Dentistry and Endodontics
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• v.44 no.2
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• pp.21.1-21.8
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• 2019

Objectives: The purpose of the present study was to evaluate the effect of calcium hydroxide with 2% chlorhexidine gel (HCX) or distilled water (HCA) compared to triple antibiotic paste (TAP) on push-out bond strength and the cement/dentin interface in canals sealed with White MTA Angelus (WMTA) or Biodentine (BD). Materials and Methods: A total of 70 extracted human lower premolars were endodontically prepared and randomly divided into 4 groups according to the intracanal medication, as follows: group 1, HCX; group 2, TAP; group 3, HCA; and group 4, control (without intracanal medication). After 7 days, the medications were removed and the cervical third of the specimens was sectioned into five 1-mm sections. The sections were then sealed with WMTA or BD as a reparative material. After 7 days in 100% humidity, a push-out bond strength test was performed. Elemental analysis was performed at the interface, using energy-dispersive spectroscopy. The data were statistically analyzed using analysis of variance and the Tukey test (p < 0.05). Results: BD presented a higher bond strength than WMTA (p < 0.05). BD or WMTA in canals treated with calcium hydroxide intracanal medications had the highest bond strength values, with a statistically significant difference compared to TAP in the WMTA group (p < 0.05). There were small amounts of phosphorus in samples exposed to triple antibiotic paste, regardless of the coronal sealing. Conclusions: The use of intracanal medications did not affect the bond strength of WMTA and BD, except when TAP was used with WMTA.

• Korean Journal of Materials Research
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• v.29 no.5
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• pp.282-287
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• 2019

The photovoltaic properties of $TiO_2$ used for the electron transport layer in perovskite solar cells(PSCs) are compared according to the particle size. The PSCs are fabricated and prepared by employing 20 nm and 30 nm $TiO_2$ as well as a 1:1 mixture of these particles. To analyze the microstructure and pores of each $TiO_2$ layer, a field emission scanning electron microscope and the Brunauer-Emmett-Teller(BET) method are used. The absorbance and photovoltaic characteristic of the PSC device are examined over time using ultraviolet-visible-near-infrared spectroscopy and a solar simulator. The microstructural analysis shows that the $TiO_2$ shape and layer thicknesses are all similar, and the BET analysis results demonstrate that the size of $TiO_2$ and in surface pore size is very small. The results of the photovoltaic characterization show that the mean absorbance is similar, in a range of about 400-800 nm. However, the device employing 30 nm $TiO_2$ demonstrates the highest energy conversion efficiency(ECE) of 15.07 %. Furthermore, it is determined that all the ECEs decrease over time for the devices employing the respective types of $TiO_2$. Such differences in ECE based on particle size are due to differences in fill factor, which changes because of changes in interfacial resistance during electron movement owing to differences in the $TiO_2$ particle size, which is explained by a one-dimensional model of the electron path through various $TiO_2$ particles.