• Proceedings of the KSME Conference
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• 2000.11a
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• pp.292-297
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• 2000

In this research, the dynamic photoelastic experimental hybrid method for bimaterial is introduced. Dynamic biaxial loading device is developed, its strain rate is 31.637 s-1 and its maximum impact load is 20 ton. Manufactured methods for model of the dynamic photoelastic experiment for bimaterial are suggested. They are bonding method(bonding material: AW106, PC-1) and molding method. In the bonding method, residual stress is not occurred in the manufactured bimaterial. Crack is propagated along the interface or sometimes deviated from the interface. While in the molding method, residual stress is occurred in the manufactured bimaterial. Crack is always deviated from the interface and propagated in the epoxy region(softer materila). In order to propagate with constant velocity along the interface of bimaterial with arbitrary stiffer material, edge crack should be located along the interface of the acute angle side of the softer material in the bimaterial.

• Journal of Korea Foundry Society
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• v.13 no.1
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• pp.42-49
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• 1993

Conventional manufacturing process for cast iron-babbitt metal composite is complicate and bimetallic bonding by centrifugal casting is also difficult because their melting point is largely different and nonmetallic inclusion exists on outer shell. This study is aiming to simplify multistage process by adding Cu-powder as insert metals during cast iron solidification. The variables on fabrication of composite pipe are mold rotating speed and inner surface temperature of outer metal. The optimum temperature range for fusion bonding between cast iron and Cu-layer was $1100^{\circ}C-1140^{\circ}C$ in case of mold rotating speed was 700rpm. When the inner surface of Cu-layer was at $900^{\circ}C$, the value of interfacial hardness between Cu-layer and babbitt metal were higher than Cu-matrix by forming diffusion layer, interfacial products between Cu-layer and babbitt metal are proved to be $Cu_6Sn_5({\eta})$by XRD.

• Structural Engineering and Mechanics
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• v.78 no.3
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• pp.319-332
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• 2021

The wood-concrete composite is an interesting solution in the field of Civil Engineering to create high performance bending elements for bridges, as well as in the building construction for the design of wood concrete floor systems. The authors of this paper has been working for the past few years on the development of the bonding process as applied to wood-concrete composite structures. Contrary to conventional joining connectors, this assembling technique does ensure an almost perfect connection between wood and concrete. This paper presents a careful theoretical investigation into interfacial stresses at the level of the two interfaces in composite wooden beam- reinforced concrete slab strengthened by external bonding of prestressed composite plate under a uniformly distributed load. The model is based on equilibrium and deformations compatibility requirements in all parts of the strengthened composite beam, i.e., the wooden beam, RC slab, the CFRP plate and the adhesive layer. The theoretical predictions are compared with other existing solutions. This research is helpful for the understanding on mechanical behaviour of the interface and design of the CFRP- wooden-concrete hybrid structures.

• Proceedings of the KWS Conference
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• 2002.05a
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• pp.9-16
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• 2002

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.35-39
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• 2012

We studied interfacial reaction and bonding characteristics of a flip chip bonding with the viewpoint of formation behavior of intermetallic compounds. For this purpose, Sn-0.7Cu and Sn-3Cu solders were reflowed on the Al/Cu and Al/Ni UBMs. When Sn-0.7Cu was reflowed on the Al/Cu UBM, no intermetallic compounds were formed at the solder/UBM interface. The $Cu_6Sn_5$ intermetallic compounds formed by reflowing Sn-3Cu solder on the Al/Cu UBM were spalled from the interface, resulting in delamination of the solder/UBM interface. On the other hand, the $(Cu,Ni)_6Sn_5$ intermetallic compounds were formed by reflowing of Sn-0.7Cu and Sn-3Cu on the Al/Ni UBM and the interfacial bonding between the Sn-Cu solders and the Al/Ni UBM was kept stable.

• Korean Journal of Materials Research
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• v.5 no.2
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• pp.191-196
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• 1995

Self-bonding strength developed at the interface of amorphous PEEK films is highly sensitive to the processing variables(time, temperature, and pressure) during the bonding process. In order to examine the effects of these processing variables, amorphous PEEK films were bonded at various bonding conditions and the resultant interfacial bond strengths were measured using a modified single lap-shear test. Experimental results showed that the developed self-bonding strength increases with increase in bonding temperature and is directly proportional to the bonding time raised to the 1/4 power. The applied pressure seems only to produce better wetting at the beginning stage of the bonding process. Conclusively, the self-bonding of amorphous PEEK films provides a great potential for developing excellent bond strength approaching the strength of the parent material without any adhesives in structural applications.

• Journal of Korea Foundry Society
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• v.41 no.6
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• pp.535-542
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• 2021

In this study, to improve the interfacial bond strength of cast iron-aluminum dissimilar materials, graphite was removed to a certain depth from the cast iron surface through de-graphitization heat treatment. As the heat treatment time increased, the depth at which graphite was removed increased, showing a linear relationship between the heat treatment time and depth. Aluminum was filled to a certain depth on the de-graphitized cast iron surface through die-casting method, and no intermetallic compounds were formed on the cast iron-aluminum interface. The interfacial bonding strength showed a value of 90 MPa regardless of the heat treatment time, which is very high compared to the 12MPa bonding strength of the material without de-graphitization heat treatment. This result is thought to be due to the mechanical bonding of the undercut structure as the liquid aluminum, penetrated by the high pressure die-casting process, solidified in the de-graphitized region of the cast iron.

• Transactions of Materials Processing
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• v.6 no.2
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• pp.136-144
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• 1997

(Ag-10%Ni)/Cu clad metals for electric contact switch were fabricated by cold-roll bonding process. 2 or 3 passes of cold-rolling was carried out for each process to investigate the effect of the rolling passes on the bonding property. The effect of the annealing temperature of copper before the cold-roll bonding on the bond strength was also studied. The specimen bonded with copper annealed below 30$0^{\circ}C$ before roll bonding showed good bond strength. This is because high stored energy in copper promoted the short range diffusion and the grain refinement of copper by the static recrystallization increased the degree of the interfacial coherency. The maximum peel strength of clad metals bonded with Cu annealed below 30$0^{\circ}C$ was 120N.

• Elastomers and Composites
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• v.52 no.4
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• pp.257-265
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• 2017

In this work, CR (Chloroprene Rubber) was emulsified by phase-inversion emulsification with nonionic surfactants (NP-1025, LE-1017, and OP-1019) and an anionic surfactant (SDBS; sodium dodecylbenzenesulfonate), and its stabilization was investigated through a study of its adsorption characteristics, zeta potential, and flow behavior. As the amount of the mixed surfactant increased, the droplet size decreased, resulting in the increase of viscosity. In particular, a CR emulsion with a lower absorbance in the UV spectrum exhibited the highest zeta potential. The results of this experiment showed that the CR emulsion prepared using (LE-1017) and SDBS was the most stable. In this study, calcium hydroxide and aluminum hydroxide were added to enhance the mechanical properties of the CR emulsion, and the relationship between tensile strength, tear strength and surface free energy were investigated. The tensile and tear strengths of the CR emulsion incresed as the amount of calcium hydroxide and aluminum hydroxide increased. The highest tensile and tear strengths and surface free energy were observed for additions of 1.0% calcium hydroxide and 0.80% aluminum hydroxide, respectively. It was concluded that the interfacial bonding strength was improved by the even dispersion of calcium hydroxide and aluminum hydroxide in the CR emulsion.

• Steel and Composite Structures
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• v.11 no.6
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• pp.435-454
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• 2011

Bonding composite materials to structural members for strengthening purpose has received a considerable attention in recent years. The major problem when using bonded FRP or steel plates to strengthen existing structures is the high interfacial stresses that may be built up near the plate ends which lead to premature failure of the structure. As a result, many researchers have developed several analytical methods to predict the interface performance of bonded repairs. In this paper, a numerical solution using finite - difference method is used to calculate the interfacial stress distribution in beams strengthened with FRP plate having a tapered ends with different thinning profiles. These latter, can significantly reduce the stress concentration. In the present theoretical analysis, the adherend shear deformations are taken into account by assuming a parabolic shear stress through the thickness of both beam and bonded plate. Numerical results from the present analysis are presented to demonstrate the advantages of use the tapers in design of strengthened beams.