Thermal Stability of the Interface between TaN Deposited by MOCVD and Electroless-plated Cu Film (MOCVD 방법으로 증착된 TaN와 무전해도금된 Cu 박막 계면의 열적안정성 연구)
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- Proceedings of the Materials Research Society of Korea Conference
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- 1998.11a
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- pp.34-34
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- 1998