• Title/Summary/Keyword: Interface reaction

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Effects of Induction Heating Conditions on Ni-Al Based Intermetallic Compound Coating (Ni-Al계 금속간화합물 코팅에 미치는 고주파유도 가열 조건의 영향)

  • Lee, Han-Young;Kim, Tae-Jun;Cho, Yong-Jae
    • Korean Journal of Metals and Materials
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    • v.48 no.2
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    • pp.141-147
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    • 2010
  • An Ni-Al intermetallic coating has been produced by induction heating on mild steel. The effect of the induction heating conditions on the microstructure of the coating has been investigated. The reaction synthesis of the intermetallic compounds was promoted while increasing the heating rate and the holding time at reaction temperature. Especially, an NiAl phase corresponding to the initial composition of mixed powder was predominantly formed. However, the synthesis at low reaction temperatures occurred by solid state diffusion during the holding time and an Fe-Al reaction layer was formed at the interface with the substrate, regardless of the heating rate. The combustion synthesis of the intermetallic compound occurred at a temperature higher than 1023 K and resulted in an almost single phase NiAl structure.

Studies of the $TiO_2-Si$ Interface Bombarded by $Ar^+$ Ion Beam

  • Zhang, J.;Huang, N.K.;Lu, T.C.;Zeng, L.;Din, T.;Chen, Y.K.
    • Journal of the Korean Vacuum Society
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    • v.12 no.S1
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    • pp.63-66
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    • 2003
  • It is experimentally shown that a $TiO_2$ film on Si(111) substrate was prepared by using the technique of D.C. reaction sputter deposition with $Ar^{+}$ ion beam bombardment, and a layer-like structure was observed from the depth profile of the interface between $TiO_2$ film and Si substrate with Scanning Electron Microscopy and Electron Probe. It was also surprisingly discovered that Ti atoms could be detected at about 9 $\mu$m depth. The $TiO_2$-Si interface bombarded by $Ar^{+}$ ion beams revealed multi-layer structures, a mechanism might be caused by defect diffusion, impurity and matrix relocation. Multi-relocations of impurity and matrix atoms were as a result of profile broadening of the $TiO_2$-Si interface, and the spread due to matrix relocation in this system is shown to exceed much more the spread due to impurity relocation.

Adhesion Enhancement of Solvent type and Water Soluble Adhesive Using Atmospheric Plasma (대기압 플라즈마를 이용한 용제형 및 수용성 접착제의 접착력 향상)

  • Jung, Young Sig;Seul, Soo Duk
    • Journal of Adhesion and Interface
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    • v.10 no.3
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    • pp.148-153
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    • 2009
  • An atmospheric plasma pre-treatment method was applied to PU foam, Leather (Action), Rubber to improve its adhesion using solvent and water soluble type pressure sensitive adhesion in atmospheric plate type reactor. In order to investigate the optimum reaction condition of plasma treatment, type of reaction gas (nitrogen), rate of gas flow (30~100 mL/min), and reaction time (0~30 s) were examined in a plate plasma reactor. The result of the surface modification with respect to the treatment procedure was characterized by using SEM. Due to a de-crease of the contact angle of various materials, the greatest adhesion strength was achieved at optimum condition such as flow rate of 100 mL/min, reaction time of 10 second for an atmospheric plasma treatment of the PU foam, EVA foam, Leather (Action) and Rubber also resulted in the improvement of the adhesion.

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Growth of Interfacial Reaction Layer by the Isothermal Heat Treatment of Cast-Bonded Fe-C-(Si)/Nb/Fe-C-(Si) (Nb/Fe-C-(Si) 주조접합재에서 등온열처리시 계면반응층의 성장에 관한 연구)

  • Jung, B.H.;Kim, M.G.;Jeong, S.H.;Park, H.I.;Ahn, Y.S.;Lee, S.Y.
    • Journal of the Korean Society for Heat Treatment
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    • v.16 no.5
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    • pp.260-266
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    • 2003
  • In order to study the interfacial reaction between Nb thin sheet and Fe-C-(Si) alloy with different Chemical compositions, they were cast-bonded. The growth of carbide layer formed at the interface after isothermal heat treatment at 1173K, 1223K, 1273K and 1323K for various times was investigated. The carbide formed at the interface was NbC and the thickness of NbC layer was increased linearly in proportional to the heat treating time. Therefore, It was found that the growth of NbC layer was controlled by the interfacial reaction. The growth rate constant of NbC layer was slightly increased with increase of carbon content when the silicon content is similar in the cast irons. However, as silicon content increases with no great difference in carbon content, the growth of NbC layer was greatly retarded. The calculated activation energy for the growth of NbC layer was varied in the range of 447.4~549.3 kJ/moI with the compositions of cast irons.

Adhesion Enhancement of Polyurethane Foam Using Atmospheric Plasma (II) (대기압 플라즈마를 이용한 폴리우레탄 소재의 접착력 향상 (II))

  • Sim, Dong Hyun;Seul, Soo Duk;Oh, Sang Taek
    • Journal of Adhesion and Interface
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    • v.8 no.3
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    • pp.1-8
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    • 2007
  • An atmospheric plasma pre-treatment method was applied to polyurethane foam to improve its contact angle and adhesion. In order to investigate the optimum reaction condition of plasma treatment, type of reaction gas (nitrogen, argon, oxygen, air), rate of gas flow (30~150 mL/min), and reaction time (0~30 sec) were examined in a plate plasma reactor. Also, the effects were compared to those of a conventional vacuum plasma pre-treatment system. The result of the surface modification with respect to the treatment procedure was characterized by using SEM and ATR-FTIR. Due to a decrease of the contact angle of polyurethane foam, the greatest adhesion strength was achieved at a flow rate of 100 mL/min and at a reaction time of 10s for N2 gas. Consequently, the atmospheric plasma treatment reduced the contact angle of the polyurethane foam and also resulted in the improvement of the peel strength.

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Interface formation and thermodynamics between SiC and thin metal films (SiC와 금속박막간의 계면형성 및 열역학)

  • Chang-Sung Lim;Kwang-Bo Shim;Dong-Woo Shin;Keun-Ho Auh
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.6 no.1
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    • pp.62-72
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    • 1996
  • The interface formation and reaction-product morphology between SiC and thin metal films were studied at temperatures between 550 and $1450^{\circ}C$ for various times. The typical reaction layer sequence was CoSi/CoSi+C/CoSi/CoSi+C/ $\cdots$ /SiC reaction at 1050 and $1250^{\circ}C$ for 2 h, while $Ni_2Si/Ni_2Si+C/Ni_2Si/Ni_2Si+C/ {\cdots} /SiC$ at 950 and 105$0^{\circ}C$ for 2 h. Carbon precipitated preferentially on the outer surface and crystallized as graphite above $1450^{\circ}C$ for SiC/Co reaction zone and $1250^{\circ}C$ for SiC/Ni. The mechanism of the periodic band structure formation with carbon precipitation behaviour was discussed in terms of thermodynamic considerations.

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Adhesion Enhancement of Polymer Material Using Atmospheric Plasma (III) (대기압 플라즈마를 이용한 고분자 소재의 접착력 향상 (III))

  • Sim, Dong Hyun;Seul, Soo Duk
    • Journal of Adhesion and Interface
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    • v.8 no.4
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    • pp.23-31
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    • 2007
  • An atmospheric plasma pre-treatment method was applied to EVA foam, Leather (Action), Rubber and Unwoven to improve its contact angle and adhesion using atmospheric plate type reactor. In order to investigate the optimum reaction condition of plasma treatment, type of reaction gas (nitrogen), rate of gas flow (30~100 mL/min), and reaction time (0~30 sec) were examined in a plate plasma reactor. The result of the surface modification with respect to the treatment procedure was characterized by using SEM. Due to a decrease of the contact angle of various materials, the greatest adhesion strength was achieved at optimum condition such as flow rate of 100 mL/min, reaction time of 10 second for an atmosphere nitrogen gas. Consequently, the atmospheric plasma treatment reduced the contact angle of the EVA foam, Leather (Action) and Rubber also resulted in the improvement of the adhesion.

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Chemical reaction at Cu/polyimide interface (Cu/polyimide 계면에서의 화학반응)

  • 이연승
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.7 no.3
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    • pp.494-503
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    • 1997
  • We investigated the initial stages of formation of the Cu/polyimide interface using another two methods by X-ray photoelectron spectroscopy. : One, in-situ measurement with increasing of Cu deposition thickness onto polyimide(PI), the other, measurement with decreasing of Cu thickness of Cu/pI film by $Ar^+$ ion etching. From these results, we find that the chemical reactions exist in Cu/PI interface. However, the measured chemical reactions were different according to experimental method.

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광반응 폴리이미드위에 RF bias sputtering 방식으로 증착된 Cr의 접착력에 관한 연구

  • 김선영;김영호;윤종승
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2001.11a
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    • pp.171-177
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    • 2001
  • The adhesion enhancement from inserting a RF bias-sputtered Cr layer between Cu and polyimide (PI) has been studied. The RF bias power applied in this study was ranged from 0 to 400 W. Without the RF bias, the peel strength, which measures the adhesion strength, was nearly o g/mm. As the RF power was increased, the peel strength rose up to ~130 g/mm at 200 W, which remained constant with further increase of the RF bias power. Cross-sectional transmission electron microscopy(TEM) was used to investigate the interfacial reaction between the Cr film and PI substrate during the bias sputtering. The Cr/PI interface without the application of RF dais showed a clean, sharp interface while the RF raised Cr/PI interface had about 10~30 nm thick atomistically mixed interlayer between the metal film and PI substrate. This interlayer appeared to have resulted from the implantation of high energy adatoms during the RF bias sputtering of Cr film. This mixed layer serves as an interlocking layer, which enhances adhesion between the metal and PI layers.

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A Study to Improve the Interface Strength of Composite Materials by the Radiation of Ultrasonic Energy (초음파 조사에 의한 복합재료의 계면특성의 보강 개선에 관한 연구 (II))

  • Lee, Sang-Kook;Jhqun, Choon-Saing;Kim, Ik-Nyon
    • Proceedings of the KIEE Conference
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    • 1988.11a
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    • pp.179-182
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    • 1988
  • This study is to investigate the adhesive strength of composite material's interface on the experimental methode of tree growth in the material. The results are as fellows 1) The irradiations of ultrasonic energy cause the mechanical vibration in the polymer composite materials of fluid state, so then bring about physical dispersion and heat form inorganic materials, being supposed to produce chemical crosslinking reaction, decreasing of voids between filler and matrix. 2) The characterics of the breakdown are increased by using coupling agent in the composite material. 3) As the intensity of ultrasonic energy and its irradiated time are larger, the tree inception and break-down voltages increase and the tree growing is slower. so we obtain that the interface adhesive force tan be strengthened by the irradiation of ultrasonic energy.

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