• 접착 및 계면
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• 제4권2호
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• pp.1-9
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• 2003

Epoxy-amine liquid prepolymers are extensively applied onto metallic substrates and cured to obtain painted materials or bonded joint structures. Overall performances of such systems depend on the created interphase between the organic layer and the substrate. When epoxy-amine liquid mixtures are applied onto more or less hydrated metallic oxide layer, concomitant amine chemical sorption and hydroxide dissolution appear lending to the chelate formation. As soon as the chelate concentration is higher than the solubility product, these species crystallize as sharp needles. Moreover, intrinsic and thermal residual stresses are developed within painted or bonded systems. When residual stresses are higher than the organic layer/substrate adhesion, buckling, blistering, debonding may occur leading to a catastrophic drop of system performances. Practical adhesion can be evaluated with either ultimate parameters (Fmax or Dmax) or the critical strain energy release rate, using the three point flexure test (ISO 14679-1997). We observe that, for the same system, the ultimate load decreases while residual stresses increase when the liquid/solid time increases. Ultimate loads and residual stresses depend on the metallic surface treatment. For these systems, the critical strain energy release rate which takes into account the residual stress profile and the Young's modulus gradient remains quite constant whatever the metallic surface treatment was. These variations will be discussed and correlate to the formation mechanisms of the interphase.

• 대한조선학회논문집
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• 제44권6호
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• pp.627-634
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• 2007

A bonded plate or a coated part can be debonded by external impact or thermal expansion. To analyse adhesive strength, the blister test is generally adopted. In this paper, a blister test is modelled theoretically and then the stability and bifurcation of the blister are studied under several different cases. The blister is simplified to consist of a pure bending plate attached elastically to the rigid substrate. Expression of the energy release rate is obtained as a form of an explicit function for a circular-type blister or tunnel-type blister grown by controlling the internal pressure or internal volume. Stability and bifurcation are also studied in the frame of the quasi-static evolution. The study shows that the circular- type blister propagates with the first mode of bifurcation and that the tunnel-type blister propagates with a regular wave. It is proved that the waves have the same form on two side lines of the tunnel and that the wave length can be obtained. When the internal pressure is controlled, the blister is unstable, but when the internal volume is controlled, it is stable.

• 한국해양공학회지
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• 제16권6호
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• pp.55-59
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• 2002

Delamination means that cracking occurs on the interface layer between composite laminates. In this paper, to predict the delamination growth in composite laminates subjected to low-velocity impact, the unit load method was introduced, and an eighteen-node 3-D finite element analysis, based on assumed strain mixed formulation, was conducted. Strain energy release rate, necessary to determine the delamination growth, was calculated by using the virtual crack closure technique. The unit load method saves the computation time more than the re-meshing method. The virtual crack closure technique enables the strain energy release rate to be easily calculated, because information of the singular stress field near the crack tip is not required. Hence, the delamination growth in composite laminates that are subjected to low-velocity impact can be efficiently predicted using the above-mentioned methods.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집A
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• pp.111-116
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• 2000

A semi-infinite interfacial crack propagated with constant velocity in two bonded anisotropic strip under out-of-plane clamped displacements is analyzed. The asymptotic stress and displacement fields near the crack tip are obtained, where the results get more general expressions applicable not only to isotropic/orthotropic materials but also to the extent of the anisotropic material having one plane of elastic symmetry for the interfacial crack. The dynamic stress intensity factor is obtained as a closed form, which is decreased as the velocity of crack propagation increases. The critical velocity where the stress intensity factor comes to zero is obtained, which agrees with the lower value between the critical values of parallel crack merged in the material 1 and 2 adjacent to the interface. The dynamic energy release rate is also obtained as a form related to the stress intensity factor.

• 한국산업융합학회 논문집
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• 제2권2호
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• pp.131-137
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• 1999

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

• Composites Research
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• 제21권4호
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• pp.7-14
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• 2008

접착제 이용 결합 조인트의 하중지지 능력 예측 기법은 점착제를 이용한 접합 조인트 설계에 있어서 가장 중요한 기술이다. 본 연구 계면 파괴역학을 이용하여 복합재료/금속 접착 조인트의 하중지시 능력을 예측하는 기법을 소개한다. 구체적으로 복합재료/탄소강 결합의 접착 강도를 계면 균열의 에너지 방출률과 계면 파괴인성치 개념을 사용하여 평가하는 방법을 제시 검증하였다. 계면 균열의 에너지 방출률은 유한요소해선 결과를 이용한 가상 균열 닫음 기법 (VCCT)을 사용하여 계산하였으며, 게면 파괴인성치는 이종재료 ENF (end-notched flexure) 시편을 고안하여 측정하였다. 고안된 이종 재료 ENF 시편을 사용하여 시편의 두께에 상관없이 일관된 Mode II 계면 파괴인성치를 측정할 수 있음과 양면 겹치기 접합 조인트의 특성 에너지 방출률이 측정된 계면 파괴인성치와 일치함을 확인하였다. 따라서 에너지 방출률에 근거한 계면 균열 진전 기준은 접착 조인트의 하중지지 능력을 신뢰성 있게 예측하는 실제적인 설계 도구로서 활용될 수 있다.

• 한국농공학회:학술대회논문집
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• 한국농공학회 2002년도 학술발표회 발표논문집
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• pp.285-288
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• 2002

For real-time flood forecasting and effective control flood at the Youngsan estuary dam, the Flood Forecasting and Control User Interface System II (FFCUS II) has been developed. This paper describes the features and application of FFCUS II. FFCUS II is composed of the database management subsystem, the model subsystem, and the graphic user interface. The database management subsyem collects rainfall data and stream flow data, updates, processes, and searches the data. The model subsystem predicts the inflow hydrograph, the tide, forecasts flood hydrograph, and simulates the release rate from the sluice gates. The graphic user interface subsystem aids the user's decision-making process by displaying the operation results of the database management subsystem and model subsystem.

• 마이크로전자및패키징학회지
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• 제5권2호
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• pp.37-48
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• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.

• 접착 및 계면
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• 제9권2호
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• pp.8-15
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• 2008

마이크로캡슐은 다양한 기능성 물질의 약물 전달 시스템으로서 화장품과 제약 분야에서 널리 적용되고 있다. 키토산은 천연에 풍부하게 존재하는 생체고분자로 생체적합성이 우수하며 무독성이다. 본 연구에서는 키토산 마이크로캡슐을 글루타르알데히드를 가교제로 사용하여 W/O 형태의 유화법으로 제조하였다. 유화제로는 span80을 사용하였으며 가교가 시행되는 bath상의 물질은 mineral oil을 사용하였다. 제조된 키토산 마이크로캡슐은 완벽한 구의 형태로 평균 $2{\sim}10{\mu}m$ 크기를 보였으며, 교반속도와 유화제의 농도에 따른 캡슐의 직경 및 형태 변화를 관찰하였다. 마이크로캡슐의 방출실험을 하기 위하여 가교제, 키토산, 그리고 유화제의 양을 변화시키면서 방출 속도를 측정하였다. Riboflavin의 방출속도는 키토산의 가교 정도와 사용한 유화제의 양에 따라 크게 변하였다.

• 폴리머
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• 제28권2호
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• pp.103-110
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• 2004

토코페롤을 함유하는 폴리($\varepsilon$-카프로락톤)(PCL) 마이크로캡슐은 액중건조법에 의하여 제조하였고, 제조 조건에 따른 마이크로캡슐의 특성과 PCL 필름을 사용하여 PCL의 분해거동을 측정하였다 제조된 마이크로캡슐의 크기 및 형태와 구조적 특성은 각각 SEM과 XRD를 이용하여 관찰하였다. 또한, 접촉각 측정을 통하여 심물질의 농도에 따른 마이크로캡슐의 표면자유에너지를 측정하였다. 실험결과, 마이크로캡슐은 유화제로 폴리(비닐 알코올)을 사용한 경우 안정된 구형의 마이크로캡슐이 형성되었고, 마이크로캡슐의 표면자유에너지와 PCL의 결정성은 감소하고, PCL 필름은 악 21일 후 분해가 시작되었다. 토코페롤의 방출특성은 UV/vis.에 의하여 측정하였으며, 마이크로캡슐의 방출속도는 교반속도의 증가와 함께 증가하였다. 이는 교반속도의 증가와 함께 감소된 마이크로캡슐 입자 크기에 의한 방출용액과 마이크로캡슐 사이의 계면의 증가에 의한 것으로 판단된다.