• Title/Summary/Keyword: Interface Propagating Crack

Search Result 21, Processing Time 0.019 seconds

Dynamic Interface Crack Propagating Along a Line Between Two Holes

  • Lee, Ouk-Sub;Park, Jae-Chul;Yin, Hai-Long;Byun, Kwi-Hwan
    • Journal of Mechanical Science and Technology
    • /
    • v.15 no.2
    • /
    • pp.172-179
    • /
    • 2001
  • The effects of the interface and two holes located near the crack path in the hybrid specimen on the dynamic crack propagation behavior have been investigated using dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system. The dynamic stress field around the dynamically propagating interface crack tip in the three point bending specimens under a dynamic load applied by a hammer dropped from 0.6m high without initial velocity are recorded. The complex stress intensity factors for the dynamically propagating interface crack are extracted by using a overdeterministic least square method. Theoretical dynamic interface isochromatic fringe loops generated by using the numerically determined complex stress intensity factors are compared with the experimental results. Furthermore, the influence of the hole to the dynamic interface crack velocities has been investigated experimentally.

  • PDF

Dynamic Mixed Mode Crack Propagation Behavior of Structural Bonded Joints

  • Lee, Ouk-Sub;Park, Jae-Chul;Kim, Gyu-Hyun
    • Journal of Mechanical Science and Technology
    • /
    • v.14 no.7
    • /
    • pp.752-763
    • /
    • 2000
  • The stress field around the dynamically propagating interface crack tip under a remote mixed mode loading condition has been studied with the aid of dynamic photoelastic method. The variation of stress field around the dynamic interface crack tip is photographed by using the Cranz-Shardin type camera having $10^6$ fps rate. The dynamically propagating crack velocities and the shapes of isochromatic fringe loops are characterized for varying mixed load conditions in double cantilever beam (DCB) specimens. The dynamic interface crack tip complex stress intensity factors, $K_1\;and\;K_2$, determined by a hybrid-experimental method are found to increase as the load mixture ratio of y/x (vertical/horizontal) values. Furthermore, it is found that the dynamically propagating interface crack velocities are highly dependent upon the varying mixed mode loading conditions and that the velocities are significantly small compared to those under the mode I impact loading conditions obtained by Shukla (Singh & Shukla, 1996a, b) and Rosakis (Rosakis et al., 1998) in the USA.

  • PDF

Dynamic Slant Interface Crack Propagation Behavior under Initial Impact Loading (초기 혼합모드 동적 하중을 받는 경사계면균열의 동적 전파거동)

  • Lee, Eok-Seop;Park, Jae-Cheol;Yun, Hae-Ryong
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.18 no.2
    • /
    • pp.146-151
    • /
    • 2001
  • The effects of slant interface in the hybrid specimen on the dynamic crack propagation behavior have been investigated using dynamic photoelasticity. The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamic stress field around the dynamically propagating inclined interface crack tip in the three point bending specimens. The dynamic load is applied by a hammer dropped from 0.08m high without initial velocity. The dynamic crack propagation velocities and dynamic stresses field around the interface crack tips are investigated. Theoretical dynamic isochromatic fringe loops are compared with the experimental reults. It is interesting to note that the crack propagating velocity becomes comparable to the Rayleigh wave speed of the soft material of a specimen when slant angle decreases.

  • PDF

Dynamic Photoelastic Experimental Method for Propagating Interfacial Crack of Bimaterials (이종재료의 진전 계면 균열에 대한 동적 광탄성 실험법)

  • Shin, Dong-Chul;Hawong, Jai-Sug
    • Proceedings of the KSME Conference
    • /
    • 2000.11a
    • /
    • pp.292-297
    • /
    • 2000
  • In this research, the dynamic photoelastic experimental hybrid method for bimaterial is introduced. Dynamic biaxial loading device is developed, its strain rate is 31.637 s-1 and its maximum impact load is 20 ton. Manufactured methods for model of the dynamic photoelastic experiment for bimaterial are suggested. They are bonding method(bonding material: AW106, PC-1) and molding method. In the bonding method, residual stress is not occurred in the manufactured bimaterial. Crack is propagated along the interface or sometimes deviated from the interface. While in the molding method, residual stress is occurred in the manufactured bimaterial. Crack is always deviated from the interface and propagated in the epoxy region(softer materila). In order to propagate with constant velocity along the interface of bimaterial with arbitrary stiffer material, edge crack should be located along the interface of the acute angle side of the softer material in the bimaterial.

  • PDF

Development of the Dynamic Photoelastic Hybrid Method for Propagating Interfacial Crack of Isotropic/Orthotropic Bi-materials (등방성/직교이방성 이종재료의 진전 계면균열에 대한 동적 광탄성 실험 하이브리드 법 개발)

  • Hwang, Jae-Seok;Sin, Dong-Cheol;Kim, Tae-Gyu
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.25 no.7
    • /
    • pp.1055-1063
    • /
    • 2001
  • When the interfacial crack of isotropic/orthotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for the bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid developed in this research are valid. Separating method of stress components is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 69∼71% of Rayleigh wave velocity of epoxy resin. The near-field stress components of bonded interface of bimaterial are similar with those of pure isotopic material and two dissimilar isotropic bimaterials under static or dynamic loading, but very near-field stress components of bonded interface of bimaterial are different from those.

Effect of Interface Hole Shape on Dynamic Interface Crack Propagation (계면에 존재하는 구멍의 모양이 동적 계면균열전파에 미치는 영향)

  • Yin, Hai-Long;Lee, Ouk-Sub
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.26 no.7
    • /
    • pp.1217-1222
    • /
    • 2002
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of the interface crack. This paper investigates the effects of the hole (existed along the path of the crack propagation) shape on the dynamic interface crack propagation behavior by comparing the experimental isochromatic fringes to the theoretical stress fields.

Characteristics for a Mode III Crack Propagating along Interface between Isotropic and Functionally Gradient Material with Linear Property Gradation along X Direction (등방성과 X방향 선형함수구배 재료의 접합계면을 따라 전파하는 모드 III 균열의 특성)

  • Lee Kwang Ho
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.28 no.10
    • /
    • pp.1500-1508
    • /
    • 2004
  • Stress and displacement fields for a crack propagating along interface between isotropic material and functionally gradient one with linear property gradation along X direction are developed. The stress and displacement fields are obtained from the complex function of steady plane motion for isotropic and functionally gradient material (FGM). The stresses and displacement in isotropic material of bimaterial are not influenced by nonhomogeneity, however, the fields in FCM are influenced by nonhomogeneity in the terms of higher order, n$\geq$3. When the nonhomogeneous parameter in FGM is zero, or in area close to crack tip, the fields are identical to those of isotropic-isotropic bimaterial. Using these stress components, the effects of nonhomogeneity on stresses are discussed.

Analysis of Propagating Crack Along Interface of Isotropic-Orthotropic Bimaterial by Photoelastic Experiment

  • Lee, K.H.;Shukla, A.;Parameswaran, V.;Chalivendra, V.;Hawong, J.S.
    • Proceedings of the KSME Conference
    • /
    • 2001.06a
    • /
    • pp.102-107
    • /
    • 2001
  • Interfacial cracks between an isotropic and orthotropic material, subjected to static far field tensile loading are analyzed using the technique of photoelasticity. The fracture parameters are extracted from the full-field isochromatic data and the same are compared with that obtained using boundary collocation method. Dynamic Photoelasticity combined with high-speed digital photography is employed for capturing the isochromatics in the case of propagating interfacial cracks. The normalized stress intensity factors for static crack is greater when $\alpha=90^{\circ}C$ (fibers perpendicular to the interface) than when $\alpha=0^{\circ}C$ (fiber parallel to the interface) and those when $\alpha=90^{\circ}C$ are similar to ones of isotropic material. The dynamic stress intensity factors for interfacial propagating crack are greater when $\alpha=0^{\circ}C$ than $\alpha=90^{\circ}C$. The relationship between complex dynamic stress intensity factor $|K_D|$ and crack speed C is similar to that for isotropic homogeneous materials, the rate of increase of energy release rate G or $|K_D|$ with crack speed is not as drastic as that reported for homogeneous materials.

  • PDF

Propagation Behavior of the Interface Crack Through a Hole (구멍을 통과하는 계면균열의 전파거동)

  • Lee, Eok-Seop;Yun, Hae-Ryong;Hwang, Si-Won
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.24 no.11
    • /
    • pp.2823-2827
    • /
    • 2000
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of an interface crack. This paper investigates determined the effects of the hole (exited on the path of the crack propagation) on the crack propagation behavior by comparing the experiment isochromatic fringes to the theoretical stress fields.

Propagation behavior of the interface crack through a hole (구멍을 통과하는 계면균열의 전파거동)

  • Lee, O.S.;Yin, H.L.;Hwang, S.W.;Byun, K.H.
    • Proceedings of the KSME Conference
    • /
    • 2000.04a
    • /
    • pp.127-131
    • /
    • 2000
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of an interface crack. This paper investigates determined the effects of the hole (existed on the path of the crack propagation) on the crack propagation behavior by comparing the experiment isochromatic fringes to the theoretical stress fields.

  • PDF