• Journal of The Korean Association of Information Education
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• v.8 no.3
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• pp.375-384
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• 2004

With the advance of information communication technology, specifically the Internet technology, most schools have developed their own Web sites for the communication of diverse parties such as students, their parents, teachers, and others. In spite of the wide spread of school Web sites, their bulletin board systems are usually developed under the Web-boards for developing ordinary sites without reflecting educational environments. The purpose of this research is to develop the Web-board system for schools, which can be applied to construct adaptive school Web sites. This Web-board system is designed to reflect the educational environments as well as the user characteristics under the idea of customization and optimization. The main advantage of this Web-board system is that it can allow easy access to the system through user-friendly interface, and also promote interactions among users through their personalized Web pages.

• Journal of Korea Foundry Society
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• v.25 no.6
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.

• Journal of the Korea Society of Computer and Information
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• v.26 no.12
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• pp.29-43
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• 2021

In this paper, a new approach to solve the constrained dynamic programming is proposed by using the constraint programming. While the conventional dynamic programming scheme has the state space augmented with states on constraints, this approach, without state augmentation, represents states of constraints as domains in a contraining programming solver. It has a hybrid computational mechanism in its computation by combining solving the Bellman equation in the dynamic programming framework and exploiting the propagation and inference methods of the constraint programming. In order to portray the differences of the two approaches, this paper solves a simple version of the long-term car rental financing problem. In the conventional scheme, data structures for state on constraints are designed, and a simple inference borrowed from the constraint programming is used to the reduction of violation of constraints because no inference risks failure of a solution. In the hybrid approach, the architecture of interface of the dynamic programming solution method and the constraint programming solution method is shown. It finally discusses the advantages of the proposed method with the conventional method.

• Smart Structures and Systems
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• v.26 no.6
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• pp.681-692
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• 2020

Conventional Piezoelectric Energy Harvesters (CPEH) have been extensively studied for maximizing their electrical output through material selection, geometric and structural optimization, and adoption of efficient interface circuits. In this paper, the performance of Stepped Piezoelectric Energy Harvester (SPEH) under harmonic base excitation is studied analytically, numerically and experimentally. The motivation is to compare the energy harvesting performance of CPEH and SPEHs with the same characteristics (resonant frequency). The results of this study challenge the notion of achieving higher voltage and power output through incorporation of geometric discontinuities such as step sections in the harvester beams. A CPEH consists of substrate material with a patch of piezoelectric material bonded over it and a tip mass at the free end to tune the resonant frequency. A SPEH is designed by introducing a step section near the root of substrate beam to induce higher dynamic strain for maximizing the electrical output. The incorporation of step section reduces the stiffness and consequently, a lower tip mass is used with SPEH to match the resonant frequency to that of CPEH. Moreover, the electromechanical coupling coefficient, forcing function and damping are significantly influenced because of the inclusion of step section, which consequently affects harvester's output. Three different configurations of SPEHs characterized by the same resonant frequency as that of CPEH are designed and analyzed using linear electromechanical model and their performances are compared. The variation of strain on the harvester beams is obtained using finite element analysis. The prototypes of CPEH and SPEHs are fabricated and experimentally tested. It is shown that the power output from SPEHs is lower than the CPEH. When the prototypes with resonant frequencies in the range of 56-56.5 Hz are tested at 1 m/s2, three SPEHs generate power output of 482 μW, 424 μW and 228 μW when compared with 674 μW from CPEH. It is concluded that the advantage of increasing dynamic strain using step section is negated by increase in damping and decrease in forcing function. However, SPEHs show slightly better performance in terms of specific power and thus making them suitable for practical scenarios where the ratio of power to system mass is critical.

• Journal of the Korea Organic Resources Recycling Association
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• v.28 no.4
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• pp.69-75
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• 2020

This study was conducted to improve the solid-liquid separation efficiency of clarifiers. To do so, the study did a bio-flocculation experiment simply by controlling the stirring speed (rpm) and baffle angle of a clarifier on a lab scale, but without using a coagulant. For the purpose of the experiment, the feed wall of a clarifier was so improved that a baffle could be installed on the clarifier. Then, it was ensured to change its stirring speed (to 0.0rpm, 0.6rpm, and 1.2rpm), with the angle fixed at 10°. As a result, it was found that concentration efficiency increased by 2.0%, and effluent removal efficiency (SS concentration) by 7.8%, at a stirring speed of 0.6ppm. This indicates the bio-coagulation efficiency of sludge increased with changing stirring speeds. Then, the baffle angle of the sedimentation unit was changed to analyze how the changed baffle angle would affect the sedimentation of sludge. As a result, it was found that the compression of sludge interface was very effective at a baffle angle of 20°. It is hoped that these experimental findings will be useful in improving the sedimentation efficiency of circular clarifiers.

• Journal of the Korean Society of Safety
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• v.37 no.6
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• pp.166-173
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• 2022

A variety of input parameters are taken into consideration while performing a Level 3 PSA. Some parameters related to plume segments, spatial grids, and particle size distribution have flexible input formats. Fine modeling performed by splitting a number of segments or grids may enhance the accuracy of analysis but is time-consuming. Analysis speed is highly important because a considerably large number of calculations is required to handle Level 2 PSA scenarios for a single-unit or multi-unit Level 3 PSA. This study developed a sensitivity analysis supporting interface called MACCSsense to compare the results of the trials of plume segmentation with the results of the base case to determine its impact (in terms of time and accuracy) and to support the development of a modeling approach, which saves calculation time and improves accuracy. MACCSense is an automation tool that uses a large amount of plume segmentation analysis results obtained from MUST Converter and Mr. Manager developed by KAERI to generate a sensitivity report that includes impact (time and accuracy) by comparing them with the base-case result. In this study, various plume segmentation approaches were investigated, and both the accuracy and speed of offsite consequence analysis were evaluated using MACCS as a consequence analysis tool. A simultaneous evaluation revealed that execution time can be reduced using multi-threading. In addition, this study can serve as a framework for the development of a modeling strategy for plume segmentation in order to perform accurate and fast offsite consequence analyses.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.1
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• pp.51-58
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• 1999

The effects of glass composition on the wettability and reactivity with $ZrO_2$substrate was evaluated and fabrication variables and glass compositions was investigated. Various glass compositions was investigated. Alkaline earth silicate glass show good wettability and lower viscosity and crystallization of glass could be prevented by $B_2O_3$.The sealant glass begin to wet on $ZrO_2$substrate below $900^{\circ}C$ and porosity occurred in various glass compositions, the crystallization and porosity in the glass could be prevented by the addition of flux into glass composition. But flowability and reactivity of glass with $ZrO_2$substrate was enhanced. Processing variables should be optimized to reduce the porosity by enhancing the sintering of glass powder. Many silicate glasses were investigated for the applications of high temperature sealants. Wetting and bonding of glass was good enough to seal together between $ZrO_2$and other ceramic components of SOFC. But porosity and reaction layer were occurred in the sealant glass. It will be possible to produce glass sealant without porosity and reaction layer at the interface by optimization of processing variable and modify the glass compositions. In present study, wettability of glass-filler composite was investigated. The porosity, shape of filler and interfacial reactions of sealant glass with fillers were examined.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.31-38
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• 2015

In order to achieve a high speed and high quality silicon wafer bonding, the room-temperature direct bonding using atmospheric pressure plasma and sprayed water vapor was developed. Effects of different plasma fabrication parameters, such as flow rate of $N_2$ gas, flow rate of CDA (clear dry air), gap between the plasma head and wafer surface, and plasma applied voltage, on plasma activation were investigated using the measurements of the contact angle. Influences of the annealing temperature and the annealing time on bonding strength were also investigated. The bonding strength of the bonded wafers was measured using a crack opening method. The optimized condition for the highest bonding strength was an annealing temperature of $400^{\circ}C$ and an annealing time of 2 hours. For the plasma activation conditions, the highest bonding strength was achieved at the plasma scan speed of 30 mm/sec and the number of plasma treatment of 4 times. After optimization of the plasma activation conditions and annealing conditions, the direct bonding of the silicon wafers was performed. The infrared transmission image and the cross sectional image of bonded interface indicated that there is no void and defects on the bonded wafers. The bonded wafer exhibited a bonding strength of average $2.3J/m^2$.

• Journal of the Korean Society for Railway
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• v.15 no.1
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• pp.9-16
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• 2012

The dynamic stability of railway vehicle has been one of the important issues in railway safety. The dynamic simulator has been used in the study about the dynamic stability of railway vehicle and wheel/rail interface optimization. Especially, a small scale simulator has been widely used in the fundamental study in the laboratory instead of full scale roller rig which is not cost effective and inconvenient to achieve diverse design parameters. But the technique for the design of the small scale simulator about the dynamic characteristics of the wheel-rail system and the bogie system has not been well developed in Korea. Therefore, the research using the small-scaled derailment simulator and the 1/5 scaled bogie has been conducted. In this paper, we did running stability test of 1/5 scaled bogie using small-scaled derailment simulator. Also, for the operation of the small scaled simulator, it is required to investigate the performance and characteristics of the simulator system. This could be achieved by a comparative study between an analysis and an experiment. This paper presented the analytical model which could be used for verifying the test results and understanding of the physical behavior of the dynamic system comprising the small- scaled derailment simulator and the 1/5 scaled bogie.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.197-205
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• 2005

Development of the packaging is one of the critical issues for commercialization of the RF-MEMS devices. RF MEMS package should be designed to have small size, hermetic protection, good RF performance and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at the temperature below $300{\times}C$ is used. Au-Sn multilayer metallization with a square loop of $70{\mu}m$ in width is performed. The electrical feed-through is achieved by the vertical through-hole via filled with electroplated Cu. The size of the MEMS Package is $1mm\times1mm\times700{\mu}m$. By applying $O_2$ plasma ashing and fabrication process optimization, we can achieve the void-free structure within the bonding interface as well as via hole. The shear strength and hermeticity of the package satisfy the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.