• Structural Engineering and Mechanics
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• v.26 no.1
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• pp.99-109
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• 2007

A cracked composite specimen, comprised of an epoxy and an aluminium plate, was fractured under a tensile load. In this paper, two crack configurations were investigated. The first was an artificial center crack positioned in the epoxy plate parallel to the material interface. The other was for two edge cracks in the epoxy plate, again, parallel to the interface. A tensile test was carried out by gradually increasing the applied load and it was verified that the cracks always moved suddenly in an outward direction from the interface. The d/a ratio was gradually reduced to zero, and it was confirmed that the maximum stress intensity factor value for the artificial center crack, $K_{{\theta}{\theta}}^{max}$, approached that of an artificial interface crack,$K_{{\theta}{\theta}}^{ifc\;max}$ (where: 2a is the crack length and d is the offset between the crack and interface). The same phenomenon was also verified for the edge cracks. Specifically, when the offset, d, was reduced to zero, the maximum stress intensity factor value, $K_{{\theta}{\theta}}^{max}$, approached that of an artificial interface edge crack.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.6
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• pp.159-166
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• 1998

The problem of interface crack in the bonded structures has received a great deal of attention in recent years. In this paper the aluminum bonded single lap-joint containing the interface edge crack is investigated. The tensile load and the average shear stress of the adhesive joints which have different crack length are obtained from the static tensile tests. The critical value of crack length to provoke the interface fracture is determined to a/L=0.4, where a is the interface crack length and L is the adhesive lap-length. The fracture mechanical parameters are introduced to confirm the existence of the critical crack length. The compliance and the stress intensity factors are calculated using the displacement and the stress near the interface crack tip by the boundary element method. These numerical results support the experimental results that the critical value of a/L is 0.4. It is known that the compliance and the stress intensity factors are the efficient parameters to estimate the bonded single lap-joint containing the interface edge crack.

• Proceedings of the KSME Conference
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• 2002.08a
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• pp.307-310
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• 2002

A two-dimensional numerical method for inviscid two-fluid flows with evolution of density interface is developed, and an initially stationary two-dimensional fluid sheet surrounded by another fluid is studied. The Interface between two fluids is modeled as a vertex sheet, and the flow field u÷th the evolution of interface is solved by using vortex-in-cell/front-tracking method. The edge of the sheet Is pulled back into the sheet due to surface tension and a blob is formed at the edge. This blob and fluid sheet are connected by a thin neck. In the inviscid limit, such process of the blob and neck formation is examined in detail and their kinematic characteristics are summarized with dimensionless parameters. The edge recedes at $V=1.06({\sigma}/{\rho}h)^{0.5}$ and the capillary wave Propagating into the fluid sheet must be considered for bettor understanding of the edge receding.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.14 no.3
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• pp.309-315
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• 2001

The Stress intensity factors for edge cracks located at the bonding interface between the elastic semiconductor chip and the viscoelastic adhesive layer have been investigated. Such cracks might be generated due to stress singularity in the vicinity of the free surface. The domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The overall stress intensity factor for the case of a small interfacial edge crack has been computed. The magnitude of stress intensity factors decrease with time due to viscoelastic relaxation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.655-659
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• 1997

The analysis of cracks at the interface between dissimilar materilar has received a great deal of attention in recent years. In this paper we conducted the static tensile test for the aluminum bonded single lap-joint with the interface edge crack. Comparing this results, that is ultimate load and strain value of aluminum adherend by strain gauge with the fracture mechanics parameters, compliance and stress intensity factors acquied from the boundary element analysis, we concluded that there are critical value of crack length to provoke the interface fracture.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.6
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• pp.907-915
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• 2001

Application of bonded dissimilar materials in many industries are increasing. When these materials are to be used in structures, it needs to evaluate the failure strength applying fracture mechanics. Al/Epoxy bonded dissimilar materials with an interface crack and an interface crack emanating from an edge semicircular hole were prepared, experiment of fracture toughness were carried out. Stress intensity factors of interface cracks in bonded dissimilar materials were computed with boundary element method(BEM) and the fracture criteria of mixed mode crack were analyzed. From the results, the fracture criteria and the method of strength evaluation by the fracture toughness in Al/Epoxy bonded dissimilar materials were proposed.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.293-293
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• 2014

The applicability of graphene has been demonstrated in the electronic fields. But, high performance of graphene is limited by the contact resistance (Rc) at the metal-graphene interface. Recently, Rc was found to be improved by forming edge-contacted graphene via theoretical simulation. Based on the differences between the surface and edge contacts at the M-G interface, we demonstrate "edge-contacted" graphene through the use of a controlled plasma processing technique that generates the edge structure of the bond and significantly reduces the contact resistance. The contact resistance attained by using pre-plasma processing was of $270{\Omega}{\cdot}{\mu}m$. Mechanisms of pre-plasma process leading to low Rc was revealed by SEM and Raman spectroscopy. In the end, controlled pre-plasma processing enabled to fabricate CVD-graphene field effect transistors with an enhanced adhesion and improved carrier mobility.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 1999.04a
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• pp.19-26
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• 1999

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate as the film absorbs moisture from the ambient environment. The rime-domain boundary element method is employed to investigate the behavior of interface stresses. The order of the free-edge singularity is obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time,'while the order of the singularity increases with time for the viscoelastic model considered.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 1999.10a
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• pp.437-443
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• 1999

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to uniform temperature change. The viscoelastic film has been assumed to be thermorheologically simple. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The order of the free-edge singularity has been obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

• Journal of Adhesion and Interface
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• v.6 no.1
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• pp.1-6
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• 2005

The high accurate simulation of very thin glue layers based on the finite element method is still connected to many problems which result from the necessity to construct a complicated mesh of essentially different sizes of elements. This can lead to a loss of accuracy, unstable calculations and even loss of convergence. However, the implementation of special transmission elements along the glue ling and special edge-elements in the near-edge region would lead to a dramatic decrease of number of finite elements in the mesh and thus, prevent unsatisfactory phenomena in numerical analysis and extensive computation time. The theoretical basis for such special elements is the knowledge about appropriate transmission conditions and the edge effects near the free boundary of the adhesive layer. Therefore, recently proposed so-called non-classical transmission conditions and the behavior near the free edge are investigated in the context of the single-lap tensile-shear test of adhesive technology.